Patents by Inventor Yu-Wei Liu

Yu-Wei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250251638
    Abstract: A front-light glass display module includes an image display unit, an adhesive layer, and a front-light unit. The adhesive layer is stacked on one side of the image display unit, and is made of an optical clear adhesive and a buffer material. The front-light unit is installed on the adhesive layer and remote to the image display unit. The front-light unit has a glass sheet and a light-guiding structure. The glass sheet is stacked on the adhesive layer. The light-guiding structure is installed on at least one side of the glass sheet that faces or faces away from the adhesive layer. The light-guiding structure guides and transmits light to the image display unit uniformly. The front-light unit uses the high-strength glass sheet to eliminate the need of a protection layer for the conventionally used plastic structure, thereby reducing the overall thickness and weight while saving manufacturing costs.
    Type: Application
    Filed: August 20, 2024
    Publication date: August 7, 2025
    Applicant: CHENFENG OPTRONICS CORPORATION
    Inventors: CHING-FANG WONG, YU-WEI LIU, WEI-LUN ZENG, BANG-JIN YOU
  • Publication number: 20250244252
    Abstract: The present disclosure discloses an inspection device and an inspection method. The inspection device includes a first light source, a second light source, a light source controller and a sensor. The light source controller is configured to enable the first light source to irradiate an object under inspection in a first period of an inspection phase, and to enable the second light source to irradiate the object under inspection in a second period of the inspection phase. The sensor continuously senses the reflected light of the object under inspection in an exposure period of the inspection phase so as to obtain image data of the object under inspection. The exposure period includes the first period and the second period.
    Type: Application
    Filed: August 16, 2024
    Publication date: July 31, 2025
    Inventors: CHIH-YUAN LIN, CHIN-YU LIU, YU-WEI LIU, HUNG-CHUN LO, CHAO-YU HUANG, CHUN-PIN HSU, CHENG-TAO TSAI
  • Publication number: 20250216343
    Abstract: A method and device of inspecting a surface of an interconnect structure are provided. The interconnect structure includes a metal layer and a dielectric layer having fluorescence characteristics. The method includes: generating an excitation light beam from an excitation light source; adjusting the excitation light beam to cause the excitation light beam to form an elongated light spot having a long axis and a short axis on a surface of the interconnect structure, and cause the excitation light beams for forming the elongated light spot to be incident on the surface of the interconnect structure along a direction perpendicular to the long axis of the elongated light spot; receiving a plurality of fluorescent signals generated from the dielectric layer upon excitation thereof by the elongated light spot; and determining a portion of a planar pattern of the metal layer according to the fluorescence signals.
    Type: Application
    Filed: March 18, 2024
    Publication date: July 3, 2025
    Inventors: CHIH-YUAN LIN, YU-WEI LIU, FENG-JUI SHIH, HSIN-YI YEH, HUNG-CHUN LO, CHAO-YU HUANG, CHUN-PIN HSU, CHENG-TAO TSAI
  • Publication number: 20250121078
    Abstract: Disclosed are compounds of formula (I): in which L1, L2, LD1, LD2, R5, and R6 are defined. Also provided are pharmaceutical compositions containing such a compound a method of treating cancer using the compound.
    Type: Application
    Filed: October 4, 2024
    Publication date: April 17, 2025
    Inventors: Lun Kelvin Tsou, Yu-Wei Liu, Chiung-Tong Chen, Tai-Yu Chiu, Chuan Shih, Jang-Yang Chang
  • Patent number: 12271654
    Abstract: An audio dose monitoring circuit includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: April 8, 2025
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yu Wei Liu, Chi Wu, Chia Chun Hung
  • Publication number: 20250074815
    Abstract: A glass display cover with realistic haptic texture and a manufacturing method thereof are disclosed. The glass display cover is for being installed at one side of a display module. The glass display cover includes a glass substrate, a pattern layer, a pattern-highlighting layer, and a textured layer. The glass substrate is installed at the side of the display module. The pattern layer is formed by color layers stacked on the glass substrate. The pattern-highlighting layer is on a side of the pattern layer facing away from the glass substrate. The pattern-highlighting layer is made of a mixture of a white ink and a diluent. The textured layer is formed at a revere side of the glass substrate. The textured layer is made of a solvent material mixed with particles. The manufacturing method includes forming the layers. The textured layer endows the glass display cover with added qualitative value.
    Type: Application
    Filed: August 12, 2024
    Publication date: March 6, 2025
    Applicant: CHENFENG OPTRONICS CORPORATION
    Inventors: CHING-FANG WONG, YU-WEI LIU, WEI-LUN ZENG, BANG-JIN YOU
  • Patent number: 12024457
    Abstract: The present invention provides a flexible glass and manufacturing method thereof. The flexible glass includes a first straight part and a second straight part on two opposite ends thereof, a recess formed between the first straight part and the second straight part, and a pre-bent curve connection part disposed corresponding to the recess. The first straight part and the second straight part are not arranged on the same plane. The flexible glass has a first lateral side and a second lateral side, and the recess sinks from the first lateral side toward the second lateral side. Therefore, the flexible glass is provided with a greater bendability.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: July 2, 2024
    Assignee: CHENFENG OPTRONICS CORPORATION
    Inventors: Ching-Fang Wong, Yu-Wei Liu, Wei-Lun Zeng, Kuan-Hua Liao
  • Patent number: 12001756
    Abstract: An audio processing device includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: June 4, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yu Wei Liu, Chi Wu, Chia Chun Hung
  • Publication number: 20240109803
    Abstract: The present invention provides a flexible glass and manufacturing method thereof. The flexible glass includes a first straight part and a second straight part on two opposite ends thereof, a recess formed between the first straight part and the second straight part, and a pre-bent curve connection part disposed corresponding to the recess. The first straight part and the second straight part are not arranged on the same plane. The flexible glass has a first lateral side and a second lateral side, and the recess sinks from the first lateral side toward the second lateral side. Therefore, the flexible glass is provided with a greater bendability.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Applicant: CHENFENG OPTRONICS CORPORATION
    Inventors: CHING-FANG WONG, YU-WEI LIU, WEI-LUN ZENG, KUAN-HUA LIAO
  • Patent number: 11778405
    Abstract: An audio processing device includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: October 3, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yu Wei Liu, Chi Wu, Chia Chun Hung
  • Publication number: 20230040518
    Abstract: An audio processing device includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.
    Type: Application
    Filed: March 10, 2022
    Publication date: February 9, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yu Wei LIU, Chi WU, Chia Chun HUNG
  • Publication number: 20230040671
    Abstract: An audio processing device includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.
    Type: Application
    Filed: March 10, 2022
    Publication date: February 9, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yu Wei LIU, Chi WU, Chia Chun HUNG
  • Publication number: 20230041455
    Abstract: An audio dose monitoring circuit includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.
    Type: Application
    Filed: March 10, 2022
    Publication date: February 9, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yu Wei LIU, Chi WU, Chia Chun HUNG
  • Publication number: 20220228811
    Abstract: Titanium-based thermal ground planes are described.
    Type: Application
    Filed: November 26, 2012
    Publication date: July 21, 2022
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Payam Bozorgi, Carl D. Meinhart, Marin Sigurdson, Noel C. MacDonald, David Bothman, Yu-Wei Liu
  • Patent number: 11337317
    Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: May 17, 2022
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chih-Kai Yang, Ming-Hung Lin, Chung-Yi Huang, Yu-Wei Liu
  • Publication number: 20220081352
    Abstract: A glass plate coated with an impact protection film layer is made by coating an impact protection film layer onto a surface of the glass plate. The impact protection film layer is made of a phenyl-containing macromolecular polymer, which has a monomer carbon chain length of between C6 and C18. The coated glass plate is shock-cushioning and impact-proof, and is thereby protected against damage caused by impact from an external force.
    Type: Application
    Filed: September 14, 2021
    Publication date: March 17, 2022
    Inventors: CHING-FANG WONG, YU-WEI LIU, WEI-LUN ZENG, KUAN-HUA LIAO
  • Publication number: 20220071028
    Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.
    Type: Application
    Filed: September 14, 2020
    Publication date: March 3, 2022
    Inventors: Chih-Kai YANG, Ming-Hung LIN, Chung-Yi Huang, Yu-Wei Liu
  • Patent number: 10892118
    Abstract: A button module includes a casing, a button body, an elastic body and a cover. The casing includes a first accommodating recess, a first engaging portion and a retaining platform. The button body is disposed in the first accommodating recess. The button body includes a first positioning portion. The elastic body is disposed between the button body and the retaining platform. The cover is disposed on the casing. The cover includes a second engaging portion, a second positioning portion and a retaining portion. The second engaging portion engages with the first engaging portion. The second positioning portion cooperates with the first positioning portion to position the button body in the first accommodating recess. The retaining portion abuts against the retaining platform.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: January 12, 2021
    Assignee: Wistron Corporation
    Inventors: Qi-Hong Yang, Yu-Wei Liu, Cheng-Hsiu Lee, Tzu-Fa Yen, Guang-Zong Li
  • Publication number: 20200144004
    Abstract: A button module includes a casing, a button body, an elastic body and a cover. The casing includes a first accommodating recess, a first engaging portion and a retaining platform. The button body is disposed in the first accommodating recess. The button body includes a first positioning portion. The elastic body is disposed between the button body and the retaining platform. The cover is disposed on the casing. The cover includes a second engaging portion, a second positioning portion and a retaining portion. The second engaging portion engages with the first engaging portion. The second positioning portion cooperates with the first positioning portion to position the button body in the first accommodating recess. The retaining portion abuts against the retaining platform.
    Type: Application
    Filed: January 28, 2019
    Publication date: May 7, 2020
    Inventors: Qi-Hong Yang, Yu-Wei Liu, Cheng-Hsiu Lee, Tzu-Fa Yen, Guang-Zong Li
  • Patent number: 10490052
    Abstract: A motion-sensing floor mat, an assembly of such floor mats, and a monitoring system with such floor mats are provided; wherein the floor mat can be joined with another such floor mat and electrically connected to a monitoring device to form the monitoring system; the monitoring device stores a queue list and a topology matrix and uses a topological algorithm to store the identification tag of each such floor mat detected into the queue list in order, to gradually establish the topology matrix for the floor mats detected; and to thereby obtain the relative positions of the floor mats detected. When any of the floor mats is subjected to pressure (e.g., when someone falls on the floor mat accidentally) and generates a sensing signal, the monitoring device can pinpoint the position of that floor mat (i.e., the location of the fall) rapidly according to the topology matrix.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: November 26, 2019
    Assignees: SEDA CHEMICAL PRODUCTS CO., LTD., SEDA G-TECH CO., LTD.
    Inventors: Yeh-Liang Hsu, Wei-Kuan Wang, Kai-Wei Chang, Yu-Wei Liu, Wei-Yi Chang