Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: In some embodiments, a semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: Method and apparatus for constrained de-blocking filter are disclosed. One method receives input data related to a current block in a current picture at a video encoder side or a video bitstream corresponding to compressed data including the current block in the current picture at a video decoder side, and determines a first boundary associated with the current block, wherein the first boundary corresponds to one vertical boundary or one horizontal boundary of the current block. The method then applies de-blocking process to a reconstructed current block corresponding to the current block to result in a filtered-reconstructed current block, using a plurality of first reference samples at a same side of the first boundary, and replaces a first set of the first reference samples by one or more padding values. The method then generates a filtered decoded picture including the filtered-reconstructed current block.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A method for producing ?-aminobutyric acid includes cultivating, in a culture medium containing glutamic acid or a salt thereof, a probiotic composition including at least one lactic acid bacterial strain selected from the group consisting of Bifidobacterium breve CCFM1025 which is deposited at the Guangdong Microbial Culture Collection Center under an accession number GDMCC 60386, Lactobacillus acidophilus TYCA06, Lactobacillus plantarum LPL28, and Bifidobacterium longum subsp. infantis BLI-02 which are deposited at the China General Microbiological Culture Collection Center respectively under accession numbers CGMCC 15210, CGMCC 17954, and CGMCC 15212, Lactobacillus salivarius subsp. salicinius AP-32 which is deposited at the China Center for Type Culture Collection under an accession number CCTCC M 2011127, and combinations thereof.

Abstract: A spring configured to be fixed to a housing and nested within a dial that is rotatable about the spring. The dial has a plurality of spaced apart inwardly facing teeth that are adjacent the spring. The spring is configured to facilitate rotation of the dial about the spring. The spring includes a central body having at least one anchor configured to connect the spring to the housing. The spring also includes at least one arm having a first end connected to the central body. The spring also includes a second end of the arm that is connected to a bulb. The bulb can be enclosed and include an exterior surface with a node that is on distal from the central body. The node is sized to fit in a space between adjacent teeth. The enclosed bulb biases the node toward the spaces between the teeth.

Abstract: An oil filter wrench having a base, a main gear, a plurality of claws each having a gear portion and an arm configured to engage an oil filter. The gear portions are rotatably disposed within the base and configured to engage the main gear such that when the main gear rotates; the arms correspondingly extend or contract relative to the base. The oil filter wrench also includes a main spring. The main spring is disposed within a cavity defined by the main gear. The main spring is configured to selectively bias the main gear toward rotation in either a first direction or a second direction opposite to the first direction. The oil filter wrench is characterised in that it also includes a switching mechanism a switching mechanism. The switching mechanism is configured to selectively toggle between a first position and a second position. In the first position, the switching mechanism engages a first tine of the main spring such that the main gear is biased to rotate in the first direction.

Abstract: An adjustable sander having a body and a flexible base. The flexible base includes a first end and a second end spaced apart from one another. The first end and second end are each pivotally attached to the body. The flexible base is configured to move between a concave configuration, a neutral configuration, and a convex configuration relative to the body. The adjustable sander further includes a removable sanding surface affixed to a surface of the flexible base that is distal from the body. The adjustable sander also includes a locking mechanism configured to selectively hold the flexible base in a desired concave, neutral or convex configuration. The locking mechanism is characterized in that it includes an axial having a head and a shaft having a series of shaft notches.

Abstract: An oil filter wrench having a base, a main gear, a plurality of claws each having a gear portion and an arm configured to engage an oil filter. The gear portions are rotatably disposed within the base and configured to engage the main gear such that when the main gear rotates; the arms correspondingly extend or contract relative to the base. The oil filter wrench also includes a main spring. The main spring is disposed within a cavity defined by the main gear. The main spring is configured to selectively bias the main gear toward rotation in either a first direction or a second direction opposite to the first direction. The oil filter wrench is characterised in that it also includes a switching mechanism a switching mechanism. The switching mechanism is configured to selectively toggle between a first position and a second position. In the first position, the switching mechanism engages a first tine of the main spring such that the main gear is biased to rotate in the first direction.

Abstract: A method for manufacturing an apicoectomy guide plate includes: a) performing scanning to obtain a tooth jaw image model, a soft tissue image model, an alveolar bone image model, a tooth crown image model, and a tooth root image model that is defined with at least one affected area; b) calculating position relations of the tooth jaw image model corresponding to the soft tissue image model and the alveolar bone image model to determine at least one osteotomy and apicoectomy procedure, and establishing a guide plate model corresponding to the tooth jaw image model and the osteotomy and apicoectomy procedure; and c) outputting the apicoectomy guide plate, which includes a connecting portion corresponding to the soft tissue image model and the tooth crown image model, and at least one positioning portion corresponding to the affected area and comprising at least one pre-drilled hole.

Abstract: A method for manufacturing an apicoectomy guide plate includes: a) performing scanning to obtain a tooth jaw image model, a soft tissue image model, an alveolar bone image model, a tooth crown image model, and a tooth root image model that is defined with at least one affected area; b) calculating position relations of the tooth jaw image model corresponding to the soft tissue image model and the alveolar bone image model to determine at least one osteotomy and apicoectomy procedure, and establishing a guide plate model corresponding to the tooth jaw image model and the osteotomy and apicoectomy procedure; and c) outputting the apicoectomy guide plate, which includes a connecting portion corresponding to the soft tissue image model and the tooth crown image model, and at least one positioning portion corresponding to the affected area and comprising at least one pre-drilled hole.

Abstract: An LED light source includes a connecting body and a mounting base. The mounting base includes a mounting platform having a top surface, and an LED unit connected to the top surface, the top surface having good heat-dissipating properties. The LED unit includes LEDs, an LED driving device, and a circuit board. The circuit board includes a first portion for mounting the driving device and a second portion for mounting the LEDs. The first portion is connected to the top surface. The second portion is bent away from the first portion; the LEDs being mounted to outer surface of the integral second portion.

Abstract: An LED light source includes a connecting body and a mounting base. The mounting base includes a mounting platform having a top surface, and an LED unit connected to the top surface, the top surface having good heat-dissipating properties. The LED unit includes LEDs, an LED driving device, and a circuit board. The circuit board includes a first portion for mounting the driving device and a second portion for mounting the LEDs. The first portion is connected to the top surface. The second portion is bent away from the first portion; the LEDs being mounted to outer surface of the integral second portion.

Abstract: An LED lamp includes a supporting base and a reflector having a plurality of reflecting tabs mounted thereon. The reflector includes many circumferentially arranged tabs around a central axis of the supporting base. Many LED light sources are mounted in the supporting base and divided into an outer array and an inner array. Each reflecting tab has a fixed end connected to the supporting base and a free end distant from the supporting base. Each reflecting tab extends upwardly and outwardly from a central portion of the supporting base toward an outer periphery thereof. The inner array of the LED light sources is surrounded by the reflector. A hole is defined in a free end of each reflecting tab and aligned with one of the LED light sources of the outer array. A lamp mounting base is also provided.

Abstract: A light emitting diode (LED) package includes a substrate with a flat top surface, an LED chip mounted on the substrate, and a group of blocking structure and encapsulation body. The LED chip electrically connects with the substrate. The blocking structure surrounds the LED chip. The encapsulation body covers the LED chip. A bottom of the encapsulation body is enclosed by the blocking structure; the encapsulation body has a light outputting surface, and an outer surface of the blocking structure is continuously connected with the light outputting surface. The light outputting surface has a semispherical profile. An angle between a normal line extending from the outer surface of the blocking structure and perpendicular to the substrate and a tangent line tangent to the light outputting surface at a point thereof adjacent to the outer surface is smaller than 60 degrees.