Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

Abstract: Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.

Abstract: A surface-modified microsphere composition comprises poly(lactic-co-glycolic acid) (PLGA), chitosan, hydrophobic drug, and hydrophilic drug. The PLGA forms a microsphere. The chitosan is formed on a surface of the microsphere. The hydrophobic drug is encapsulated by the microsphere. The hydrophilic drug is adsorbed on the surface of the microsphere. The surface-modified microsphere composition is for treating arthritis. A method of preparing a surface-modified microsphere composition involves producing by an oil-in-water emulsion method microspheres formed from PLGA, covered with chitosan, and adapted to encapsulate hydrophobic drug, and having hydrophilic drug adsorbed on their surfaces. The surface-modified microsphere composition enables drug to be released to achieve efficacy both instantly and persistently.