Patents by Inventor Yu-Wen Chung

Yu-Wen Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250016964
    Abstract: A node unit includes a base plate, at least one function module, and a non-conductive coolant. The function module includes a heat-generating element, a heat-dissipating structure, and a pump. The heat-generating element is disposed on the base plate, the heat-dissipating structure is disposed on the heat-generating element, and the pump is disposed on the heat-dissipating structure. The base plate and the at least one function module are immersed in the non-conductive coolant. The pump is configured to drive the non-conductive coolant to flow into the heat-dissipating structure and discharge from the heat-dissipating structure. An electronic device and an immersion cooling type equipment are also mentioned.
    Type: Application
    Filed: September 1, 2023
    Publication date: January 9, 2025
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Yu-Wen Chung, Shun-Wei Yang, Heng-Yu Lee, Hao-Yuan Cheng, Chun-Shi Liu, Chia-Wei Chang