Abstract: A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer. A patterned first photoresist layer is formed on the conductive layer. Copper bumps are respectively formed on the conductive layer located in the first photoresist layer openings. A patterned second photoresist layer is formed on the first photoresist layer, such that at least one of the copper bumps is exposed through second photoresist layer opening and the corresponding first photoresist layer opening. A diffusion barrier layer and an oxidation barrier layer are formed on the copper bump. The first and second photoresist layers, and the conductive layer not covered by the copper bumps are removed.

Abstract: A manufacturing method of a passive component structure includes the following steps. A protection layer is formed on a substrate, and bond pads of the substrate are respectively exposed through protection layer openings. A conductive layer is formed on the bond pads and the protection layer. A patterned photoresist layer is formed on the conductive layer, and the conductive layer adjacent to the protection layer openings is exposed through photoresist layer openings. Copper bumps are respectively electroplated on the conductive layer. The photoresist layer and the conductive layer not covered by the copper bumps are removed. A passivation layer is formed on the copper bumps and the protection layer, and at least one of the copper bumps is exposed through a passivation layer opening. A diffusion barrier layer and an oxidation barrier layer are chemically plated in sequence on the copper bump.

Abstract: A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer. A patterned first photoresist layer is formed on the conductive layer. Copper bumps are respectively formed on the conductive layer located in the first photoresist layer openings. A patterned second photoresist layer is formed on the first photoresist layer, such that at least one of the copper bumps is exposed through second photoresist layer opening and the corresponding first photoresist layer opening. A diffusion barrier layer and an oxidation barrier layer are formed on the copper bump. The first and second photoresist layers, and the conductive layer not covered by the copper bumps are removed.

Abstract: A manufacturing method of a passive component structure includes the following steps. A protection layer is formed on a substrate, and bond pads of the substrate are respectively exposed through protection layer openings. A conductive layer is formed on the bond pads and the protection layer. A patterned photoresist layer is formed on the conductive layer, and the conductive layer adjacent to the protection layer openings is exposed through photoresist layer openings. Copper bumps are respectively electroplated on the conductive layer. The photoresist layer and the conductive layer not covered by the copper bumps are removed. A passivation layer is formed on the copper bumps and the protection layer, and at least one of the copper bumps is exposed through a passivation layer opening. A diffusion barrier layer and an oxidation barrier layer are chemically plated in sequence on the copper bump.

Abstract: An inductor structure includes a substrate, a protection layer, a patterned first conductive layer, copper bumps, a passivation layer, a diffusion barrier layer, and an oxidation barrier layer. The protection layer is located on the substrate. The bond pads of the substrate are respectively exposed through protection layer openings. The first conductive layer is located on the surfaces of the bond pads and the protection layer adjacent to the protection layer openings. The copper bumps are located on the first conductive layer. The passivation layer is located on the protection layer and the copper bumps. At least one of the copper bumps is exposed through a passivation layer opening. The diffusion barrier layer is located on the copper bump that is exposed through the passivation layer opening. The oxidation barrier layer is located on the diffusion barrier layer.

Abstract: A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer. A patterned first photoresist layer is formed on the conductive layer. Copper bumps are respectively formed on the conductive layer located in the first photoresist layer openings. A patterned second photoresist layer is formed on the first photoresist layer, such that at least one of the copper bumps is exposed through second photoresist layer opening and the corresponding first photoresist layer opening. A diffusion barrier layer and an oxidation barrier layer are formed on the copper bump. The first and second photoresist layers, and the conductive layer not covered by the copper bumps are removed.

Abstract: A microwave control system is applied to control a working system to execute at least one predetermined assignment, and comprises a microwave control unit, a control card and a passive control unit. A microwave illuminator of the microwave control unit is applied to send a microwave signal. After receiving the microwave signal, the control card reflects a reflection signal to the microwave control unit, wakes up from a first sleep mode to enter a first awake mode, and sends a first control signal to the passive control unit. After the microwave control unit receives the reflection signal, the passive control unit wake up from a second sleep mode to enter a second awake mode, and the passive control unit transmits a second control signal in accordance with the first control signal to the working system, so as to control the working system to execute the predetermined assignment.

Abstract: A method of detecting, characterizing and treating viral infection is provided. In particular, a strategy of molecular mimicry is provided for characterizing viral behavior and/or a predisposition for a given viral outcome in vivo. Novel compositions are also provided for detecting, characterizing and treating viral infections.

Abstract: A microwave control system is applied to control a working system to execute at least one predetermined assignment, and comprises a microwave control unit, a control card and a passive control unit. A microwave illuminator of the microwave control unit is applied to send a microwave signal. After receiving the microwave signal, the control card reflects a reflection signal to the microwave control unit, wakes up from a first sleep mode to enter a first awake mode, and sends a first control signal to the passive control unit. After the microwave control unit receives the reflection signal, the passive control unit wake up from a second sleep mode to enter a second awake mode, and the passive control unit transmits a second control signal in accordance with the first control signal to the working system, so as to control the working system to execute the predetermined assignment.

Abstract: A method of detecting, characterizing and treating viral infection is provided. In particular, a strategy of molecular mimicry is provided for characterizing viral behavior and/or a predisposition for a given viral outcome in vivo. Novel compositions are also provided for detecting, characterizing and treating viral infections.

Abstract: The invention relates to primer-specific and mispair extension assays for identifying gene variations, such as in different genotypes or subtypes of a given genotype. The assay includes extending a nucleic acid sequence from a patient sample with extension products of the primer, characterizing the extension products, and comparing the extension products with known nucleic acid sequences of various genotypes for determining the genotype of the nucleic acid sequence extended. In the assay, at least one primer or the dNTPs is labeled.

Abstract: The invention relates to primer-specific and mispair extension assays for identifying gene variations, such as in different genotypes or subtypes of a given genotype. The assay includes extending a nucleic acid sequence from a patient sample with extension products of the primer, characterizing the extension products, and comparing the extension products with known nucleic acid sequences of various genotypes for determining the genotype of the nucleic acid sequence extended. In the assay, at least one primer or the dNTPs is labeled.

Abstract: The present invention relates to the use of insoluble forms of recombinant proteins in a flow cytometric immunofluorescence assay for the detection of given antibodies.