Patents by Inventor Yu-Wen Lee

Yu-Wen Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961899
    Abstract: A semiconductor device includes a gate structure extending along a first lateral direction. The semiconductor device includes a source/drain structure disposed on one side of the gate structure along a second lateral direction, the second lateral direction perpendicular to the first lateral direction. The semiconductor device includes an air gap disposed between the gate structure and the source/drain structure along the second lateral direction, wherein the air gap is disposed over the source/drain structure.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Yao Lin, Hsiao Wen Lee, Yu-Shan Cheng, Chao-Cheng Chen
  • Patent number: 11961768
    Abstract: A method includes forming a first transistor, which includes forming a first gate dielectric layer over a first channel region in a substrate and forming a first work-function layer over the first gate dielectric layer, wherein forming the first work-function layer includes depositing a work-function material using first process conditions to form the work-function material having a first proportion of different crystalline orientations and forming a second transistor, which includes forming a second gate dielectric layer over a second channel region in the substrate and forming a second work-function layer over the second gate dielectric layer, wherein forming the second work-function layer includes depositing the work-function material using second process conditions to form the work-function material having a second proportion of different crystalline orientations.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ya-Wen Chiu, Da-Yuan Lee, Hsien-Ming Lee, Kai-Cyuan Yang, Yu-Sheng Wang, Chih-Hsiang Fan, Kun-Wa Kuok
  • Publication number: 20240120317
    Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 11, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Cheng-Hsiung Yang, Chien Te Chen, Cong Zhang, Ching-Chuan Hsieh, Yu-Ying Tan, Juan Zhou, Ai-wen Wang, Yih-Fran Lee, Yu-Wen Huang
  • Publication number: 20240106757
    Abstract: A method of wireless signal transmission management includes transmitting a plurality of data packets to tethering equipment from user equipment to tethering equipment, determining a size of each of the plurality of data packets by the tethering equipment, designating data packets of the plurality of data packets having a specific range of sizes as control signal packets by the tethering equipment, and prioritizing in transmitting the control signal packets to a cellular network by the tethering equipment.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 28, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ching-Hao Lee, Yi-Lun Chen, Ho-Wen Pu, Yu-Yu Hung, Jun-Yi Li, Ting-Sheng Lo
  • Patent number: 11942364
    Abstract: In some embodiments, the present disclosure relates to a method of forming an interconnect. The method includes forming an etch stop layer (ESL) over a lower conductive structure and forming one or more dielectric layers over the ESL. A first patterning process is performed on the one or more dielectric layers to form interconnect opening and a second patterning process is performed on the one or more dielectric layers to increase a depth of the interconnect opening and expose an upper surface of the ESL. A protective layer is selectively formed on sidewalls of the one or more dielectric layers forming the interconnect opening. A third patterning process is performed to remove portions of the ESL that are uncovered by the one or more dielectric layers and the protective layer and to expose the lower conductive structure. A conductive material is formed within the interconnect opening.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Yu-Teng Dai, Wei-Hao Liao
  • Publication number: 20240088022
    Abstract: Some embodiments relate to an integrated chip including a plurality of conductive structures over a substrate. A first dielectric layer is disposed laterally between the conductive structures. A spacer structure is disposed between the first dielectric layer and the plurality of conductive structures. An etch stop layer overlies the plurality of conductive structures. The etch stop layer is disposed on upper surfaces of the spacer structure and the first dielectric layer.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Yu-Teng Dai, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Hsi-Wen Tien, Wei-Hao Liao
  • Patent number: 11923293
    Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first interconnect dielectric layer arranged over a substrate. An interconnect wire extends through the first interconnect dielectric layer, and a barrier structure is arranged directly over the interconnect wire. The integrated chip further includes an etch stop layer arranged over the barrier structure and surrounds outer sidewalls of the barrier structure. A second interconnect dielectric layer is arranged over the etch stop layer, and an interconnect via extends through the second interconnect dielectric layer, the etch stop layer, and the barrier structure to contact the interconnect wire.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai
  • Publication number: 20240069069
    Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.
    Type: Application
    Filed: November 10, 2023
    Publication date: February 29, 2024
    Applicant: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin
  • Patent number: 11914429
    Abstract: An electronic device includes a host, a display, a sliding plate, and a keyboard. The host has an operating surface. The display is pivoted to the host. The sliding plate is slidably disposed in the host, where the display is mechanically coupled to the sliding plate, and the sliding plate includes a plat portion and a recess portion that are arranged side by side. The keyboard is integrated to the host. The keyboard includes a key structure, where the key structure includes a key cap and a reciprocating element, and the key cap is exposed from the operating surface of the host. The reciprocating element is disposed between the key cap and the sliding plate and has a first end connected to the key cap and a second end contacting the sliding plate. The second end is located on a sliding path of the plat portion and the recess portion.
    Type: Grant
    Filed: March 9, 2023
    Date of Patent: February 27, 2024
    Assignee: Acer Incorporated
    Inventors: Hung-Chi Chen, Shun-Bin Chen, Huei-Ting Chuang, Yen-Chieh Chiu, Yu-Wen Lin, Yen-Chou Chueh, Po-Yi Lee
  • Publication number: 20240047491
    Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer disposed on the light-curing layer, a shielding layer disposed on an inner surface of the light-permeable layer, a light filter layer arranged between the light-curing layer and the shielding layer, and a package body that is formed on the substrate. A projection region defined by orthogonally projecting the shielding layer onto a top surface of the sensor chip surrounds a sensing region of the sensor chip. The shielding layer has at least one light-permeable slot being covered by the light filter layer. The sensor chip, the light-curing layer, the light-permeable layer, the light filter layer, and the shielding layer are embedded in the package body that exposes at least part of the light-permeable layer.
    Type: Application
    Filed: October 10, 2023
    Publication date: February 8, 2024
    Inventors: YU-WEN LEE, LI-CHUN HUNG
  • Patent number: 11604380
    Abstract: A display device includes a backlight module, a liquid crystal display panel and an optical module. The liquid crystal display panel is disposed on the backlight module. The liquid crystal display panel includes an array substrate, an opposite substrate, a display medium layer, an upper polarizing pattern, and a lower polarizing pattern. The upper polarizing pattern is disposed on the opposite substrate. The lower polarizing pattern is disposed on the array substrate and has a first transmission axis. The optical module is disposed between the backlight module and the liquid crystal display panel. The optical module includes a dual brightness enhancement film. The dual brightness enhancement film has a second transmission axis. The polarization direction of the light after passing through the optical module is different from the polarization direction of the light after passing through the lower polarizing pattern.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: March 14, 2023
    Assignee: Au Optronics Corporation
    Inventors: Zong-Huei Tsai, Yu-Wen Lee
  • Publication number: 20210333630
    Abstract: A display device includes a backlight module, a liquid crystal display panel and an optical module. The liquid crystal display panel is disposed on the backlight module. The liquid crystal display panel includes an array substrate, an opposite substrate, a display medium layer, an upper polarizing pattern, and a lower polarizing pattern. The upper polarizing pattern is disposed on the opposite substrate. The lower polarizing pattern is disposed on the array substrate and has a first transmission axis. The optical module is disposed between the backlight module and the liquid crystal display panel. The optical module includes a dual brightness enhancement film. The dual brightness enhancement film has a second transmission axis. The polarization direction of the light after passing through the optical module is different from the polarization direction of the light after passing through the lower polarizing pattern.
    Type: Application
    Filed: July 6, 2021
    Publication date: October 28, 2021
    Applicant: Au Optronics Corporation
    Inventors: Zong-Huei Tsai, Yu-Wen Lee
  • Patent number: 11099423
    Abstract: A display device includes a backlight module, a liquid crystal display panel and an optical module. The liquid crystal display panel is disposed on the backlight module. The liquid crystal display panel includes an array substrate, an opposite substrate, a display medium layer, an upper polarizing pattern, and a lower polarizing pattern. The upper polarizing pattern is disposed on the opposite substrate. The lower polarizing pattern is disposed on the array substrate and has a first transmission axis. The optical module is disposed between the backlight module and the liquid crystal display panel. The optical module includes a dual brightness enhancement film. The dual brightness enhancement film has a second transmission axis. The polarization direction of the light after passing through the optical module is different from the polarization direction of the light after passing through the lower polarizing pattern.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: August 24, 2021
    Assignee: Au Optronics Corporation
    Inventors: Zong-Huei Tsai, Yu-Wen Lee
  • Publication number: 20200132095
    Abstract: A fool-proof housing is configured for a first mounting piece which includes a first fool-proof recess or a second mounting piece which includes a second fool-proof recess to be disposed thereon. The fool-proof housing includes a casing and a fool-proof element. The fool-proof element includes a fool-proof protrusion. The fool-proof element is movably disposed on the casing and includes a first position and a second position. When the fool-proof element is in the first position, the casing is configured for the first mounting piece to be mounted thereon, and the fool-proof protrusion blocks the second mounting piece from mounted on the casing. When the fool-proof element is in the second position, the casing is configured for the second mounting piece to be mounted thereon, and the fool-proof protrusion blocks the first mounting piece from mounted on the casing.
    Type: Application
    Filed: December 1, 2018
    Publication date: April 30, 2020
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Hsin-Liang CHEN, Chih-Wei CHIANG, Yu Wen LEE
  • Publication number: 20200033677
    Abstract: A display device includes a backlight module, a liquid crystal display panel and an optical module. The liquid crystal display panel is disposed on the backlight module. The liquid crystal display panel includes an array substrate, an opposite substrate, a display medium layer, an upper polarizing pattern, and a lower polarizing pattern. The upper polarizing pattern is disposed on the opposite substrate. The lower polarizing pattern is disposed on the array substrate and has a first transmission axis. The optical module is disposed between the backlight module and the liquid crystal display panel. The optical module includes a dual brightness enhancement film. The dual brightness enhancement film has a second transmission axis. The polarization direction of the light after passing through the optical module is different from the polarization direction of the light after passing through the lower polarizing pattern.
    Type: Application
    Filed: December 10, 2018
    Publication date: January 30, 2020
    Applicant: Au Optronics Corporation
    Inventors: Zong-Huei Tsai, Yu-Wen Lee
  • Publication number: 20120233809
    Abstract: A castor includes an inner frame, an outer frame surrounding the inner frame, a plurality of buffering members mounted between the inner frame and the outer frame, a plurality of connecting ribs each connected between the outer frame and a respective one of the buffering members, and a plurality of connecting flanges each connected between the inner frame and a respective one of the buffering members. Thus, the buffering members are mounted between the inner frame and the outer frame and are compressed and deformed elastically to provide a shock absorbing and buffering effect to the castor when the castor is subjected to an external force or impact so as to reduce the vibration and pressure of the castor, thereby providing a comfortable sensation to a user when moving the castor.
    Type: Application
    Filed: March 18, 2011
    Publication date: September 20, 2012
    Inventor: Yu-Wen Lee
  • Patent number: 7712590
    Abstract: A luggage grip includes two fixing seats spaced from each other, and a flexible holding bar mounted between the two fixing seats and having two opposite end portions each movably mounted on the respective fixing seat. Thus, the holding bar is pulled upward to have a curved shape for use with the user and is retractable to have a flat shape when not in use, thereby facilitating the user operating and folding the holding bar. In addition, the luggage grip has a simplified construction to decrease the cost of fabrication. Further, the luggage grip is assembled easily and quickly.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: May 11, 2010
    Assignee: Hando Industrial Co., Ltd.
    Inventor: Yu-Wen Lee
  • Patent number: 6710899
    Abstract: A scanner has a scanning module for generating image data by way of scanning a document, a motor for driving the scanning module, and a control circuit electrically connected to the scanning module and the motor for controlling operations of the scanner. The scanning module has a light source for illuminating the document and a charge coupled device (CCD) for detecting reflected light from the document so as to generate the image data. The scanner is powered only by a serial bus.
    Type: Grant
    Filed: March 6, 2002
    Date of Patent: March 23, 2004
    Assignee: Mustek Systems Inc.
    Inventors: Ching-Fu Chung, Yu-Wen Lee
  • Patent number: 6698060
    Abstract: A caster structure comprises a small wheel, a mounting plate, a roller bearing, a wheel frame, and a locating member. The wheel is fastened pivotally with the wheel frame which is fastened with the underside of the mounting plate by the locating member in conjunction with the roller bearing. The locating member is provided with a plurality of rollers. The rollers of the locating member and the rollers of the roller bearing move to reduce friction at such time when the wheel is turned in a direction.
    Type: Grant
    Filed: June 10, 2002
    Date of Patent: March 2, 2004
    Assignee: Hando Industrial Co., Ltd.
    Inventor: Yu Wen Lee
  • Patent number: RE41094
    Abstract: A scanner has a scanning module for generating image data by way of scanning a document, a motor for driving the scanning module, and a control circuit electrically connected to the scanning module and the motor for controlling operations of the scanner. The scanning module has a light source for illuminating the document and a charge coupled device (CCD) for detecting reflected light from the document so as to generate the image data. The scanner is powered only by a serial bus.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: February 2, 2010
    Inventors: Ching-Fu Chung, Yu-Wen Lee