Abstract: A method of making a semiconductor device includes forming a first polysilicon structure over a first portion of a substrate. The method further includes forming a first spacer on a sidewall of the first polysilicon structure, wherein the first spacer has a concave corner region between an upper portion and a lower portion. The method further includes forming a protective layer covering an entirety of the first spacer and the first polysilicon structure, wherein the protective layer has a first thickness over the concave corner region and a second thickness over the first polysilicon structure, and a difference between the first thickness and the second thickness is at most 10% of the second thickness.

Abstract: A micro light emitting diode display panel including multiple pixel structures is provided. Each of the pixel structures includes at least one sub-pixel, which includes a first micro-light-emitting chip with a first light-emitting area and a second micro-light-emitting chip with a second light-emitting area smaller than the first light-emitting area. The first micro-light-emitting chip emits light corresponding to a first luminance interval according to a first operating current interval. The second micro light-emitting chip emits light corresponding to a second luminance interval according to a second operating current interval. A gray-scale value of the second luminance interval is lower than a gray-scale value of the first luminance interval. The first micro-light-emitting chip and the second micro light-emitting chip have the same light-emitting color. The second micro-light-emitting chip has a smaller slope of a tangent line to a luminance versus current curve than the first micro-light-emitting chip.

Abstract: A micro LED display panel is provided. The micro LED display panel includes a driving substrate and a plurality of bonding pads disposed on the driving substrate and spaced apart from each other. The micro LED display panel also includes a plurality of micro LED structures electrically connected to the bonding pads. Each micro LED structure includes at least one electrode disposed on the side of the micro LED structure facing the driving substrate. The electrode has a normal contact surface and a side contact surface. The normal contact surface faces the driving substrate, and the side contact surface is laterally connected to the corresponding bonding pad.

Abstract: An alignment structure is provided. The alignment structure includes a substrate, an alignment portion, and an extension portion. The alignment portion is disposed on the substrate. The extension portion is disposed on the substrate. The extension portion at least partially surrounds the alignment portion and is spaced apart from the alignment portion by a void. A side of the extension portion adjacent to the alignment portion and a side of the alignment portion adjacent to the extension portion are conformal to each other.

Abstract: An alignment structure is provided. The alignment structure includes a substrate, an alignment portion, and an extension portion. The alignment portion is disposed on the substrate. The extension portion is disposed on the substrate. The extension portion at least partially surrounds the alignment portion and is spaced apart from the alignment portion by a void. A side of the extension portion adjacent to the alignment portion and a side of the alignment portion adjacent to the extension portion are conformal to each other.