Abstract: A photosensitive composition and film prepared from the same are provided. The photosensitive composition includes 100 parts by weight of polyimide, 0.25-50 parts by weight of initiator and 0.25-100 parts by weight of crosslinking agent. The polyimide is a product of a reactant (a) and a reactant (b) via a reaction. The reactant (a) consists of a first dianhydride and a second dianhydride. The molar ratio of the first dianhydride to the second dianhydride is 3:7 to 8:2. The reactant (b) includes a first diamine. The first dianhydride, the second dianhydride and the first diamine are disclosed in the specification.

Abstract: A polyimide, a film composition, and film prepared from the same are provided. The polyimide is a product of a reactant (a) and a reactant (b). The reactant (a) consists of a first dianhydride and a second dianhydride. The first dianhydride has a structure represented by Formula (I) and the second dianhydride has a structure represented by Formula (II) wherein R1, R2 and Ar1 are as defined in specification. The reactant (b) includes a first diamine, wherein the first diamine is and R3, R4, R5, or R6 are as defined in specification.

Abstract: A photosensitive composite material is provided. The photosensitive composite material includes 0.1-20.5 parts by weight of a nanoporous silica material, 10.9-68.6 parts by weight of a siloxane polymer, and 10.9-89 parts by weight of a photosensitive siloxane composition, including a siloxane polymer having at least one terminal functional group being vinyl group and a siloxane polymer having at least one terminal functional group being thiol group, based on 100 parts by weight of the photosensitive composite material. The siloxane polymer is a homopolymer of a monomer having a structure of Formula (I) wherein each of R is independently a linear or branched C1-C10 alkyl group, n is a positive integer between 10 and 1000, X includes an alkoxysilyl group, a methacrylate group, an epoxy group, a vinyl group, or an acrylate group.

Abstract: A method for manufacturing a quantum dot and a quantum dot are provided. The method includes adding a core semiconductor precursor solution into a seed composition solution. The seed composition solution includes a seed composition, and the seed composition is a dendrimer-metal nanoparticle composite. The core semiconductor precursor solution includes a first semiconductor ion and a second semiconductor ion. The method also includes carrying out a first synthesis reaction to form a core semiconductor material wrapping the seed composition. The core semiconductor material is formed by combining the first semiconductor ion with the second semiconductor ion.

Abstract: A photosensitive composite material is provided. The photosensitive composite material includes 0.1-20.5 parts by weight of a nanoporous silica material, 10.9-68.6 parts by weight of a siloxane polymer, and 10.9-89 parts by weight of a photosensitive siloxane composition, including a siloxane polymer having at least one terminal functional group being vinyl group and a siloxane polymer having at least one terminal functional group being thiol group, based on 100 parts by weight of the photosensitive composite material. The siloxane polymer is a homopolymer of a monomer having a structure of Formula (I) wherein each of R is independently a linear or branched C1-C10 alkyl group, n is a positive integer between 10 and 1000, X includes an alkoxysilyl group, a methacrylate group, an epoxy group, a vinyl group, or an acrylate group.

Abstract: A method for manufacturing a quantum dot and a quantum dot are provided. The method includes adding a core semiconductor precursor solution into a seed composition solution. The seed composition solution includes a seed composition, and the seed composition is a dendrimer-metal nanoparticle composite. The core semiconductor precursor solution includes a first semiconductor ion and a second semiconductor ion. The method also includes carrying out a first synthesis reaction to form a core semiconductor material wrapping the seed composition. The core semiconductor material is formed by combining the first semiconductor ion with the second semiconductor ion.

Abstract: A coating includes an organosiloxane polymer and a mesoporous silica material bonded with the organosiloxane polymer. A monomer of the organosiloxane polymer is and the surface of the mesoporous silica material includes a hydrophilic group. A method for manufacturing the coating includes the following steps. Provide an organosiloxane polymer polymerized from a plurality of organosiloxanes including a terminal functional group. Provide a mesoporous silica precursor including a surface functional group. The organosiloxane polymer and the mesoporous silica precursor are blended in a solution, so that the surface functional group reacts with the terminal functional group to form a bond, and a mesoporous silica material is formed, as well as the surface of the mesoporous silica material includes a hydrophilic group. A film including a thickness of 0.1-500 ?m is formed by the coating.

Abstract: Provided is a coating composition having anti-fogging and heat-insulating functions, which includes a mesoporous material, an organic polysiloxane, and co-doped tungsten oxide as shown in formula (I), MxWO3-yAy wherein M is an alkali metal element, W is tungsten, O is oxygen, A is halogen, 0<x?1, and 0<y?0.5. Further provided are a method for preparing a coating composition having anti-fogging and heat-insulating functions and a film formed from the coating composition.

Abstract: Provided is a coating composition having anti-fogging and heat-insulating functions, which includes a mesoporous material, an organic polysiloxane, and co-doped tungsten oxide as shown in formula (I), MxWO3-yAy wherein M is an alkali metal element, W is tungsten, O is oxygen, A is halogen, 0<x?1, and 0<y?0.5. Further provided are a method for preparing a coating composition having anti-fogging and heat-insulating functions and a film formed from the coating composition.

Abstract: A method of manufacturing a metal foil with microcracks includes placing a metal foil between a first material sheet and a second material sheet and then rolling them to form a plurality of microcracks in the metal foil. The microcracks are penetrating, and a sidewall of each of the microcracks is an irregular rough surface. Two ends of each of the microcracks are acute angles. A sound-absorbing structure includes at least one metal foil and a base plate kept at a distance from the metal foil, wherein at least one resonant cavity air layer is formed between the metal foil and the base plate by the distance, and the metal foil has microcracks.

Abstract: A method of manufacturing a metal foil with microcracks includes placing a metal foil between a first material sheet and a second material sheet and then rolling them to form a plurality of microcracks in the metal foil. The microcracks are penetrating, and a sidewall of each of the microcracks is an irregular rough surface. Two ends of each of the microcracks are acute angles. A sound-absorbing structure includes at least one metal foil and a base plate kept at a distance from the metal foil, wherein at least one resonant cavity air layer is formed between the metal foil and the base plate by the distance, and the metal foil has microcracks.

Abstract: A coating includes an organosiloxane polymer and a mesoporous silica material bonded with the organosiloxane polymer. A monomer of the organosiloxane polymer is and the surface of the mesoporous silica material includes a hydrophilic group. A method for manufacturing the coating includes the following steps. Provide an organosiloxane polymer polymerized from a plurality of organosiloxanes including a terminal functional group. Provide a mesoporous silica precursor including a surface functional group. The organosiloxane polymer and the mesoporous silica precursor are blended in a solution, so that the surface functional group reacts with the terminal functional group to form a bond, and a mesoporous silica material is formed, as well as the surface of the mesoporous silica material includes a hydrophilic group. A film including a thickness of 0.1-500 ?m is formed by the coating.