Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.

Abstract: The present invention relates to a composition comprising an amino acid-modified polymer, a carboxypolysaccharide, and may further include a metal ion for anti-adhesion and vector application. More specifically, the invention relates to a thermosensitive composition having enhanced mechanical and improved water-erosion resistant properties for efficiently preventing tissue adhesions and can serve as a vector with bio-compatible, bio-degradable/absorbable, and in-vivo sustainable properties.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.

Abstract: A mould assembly with a heating device comprises: an upper mould with an upper joint surface, a lower mould, two conductive plates and two conductive wires. The lower mould includes a conductive layer, a lower joint surface which is formed on the conductive layer and faces the upper joint surface, an insulating surface which is formed on the conductive layer and faces in an opposite direction from the lower joint surface, an insulating formed on the insulating surface. The two conductive plates are disposed on the conductive layer of the lower mould. The two conductive wires are connected to the conductive plates and each have a resistivity lower than a resistivity of the conductive layer. The mould assembly with a heating device is low cost and capable of making the temperature distribution on the surface of the mould assembly more uniform.

Abstract: A platform for securely mounting a wafer cassette holder thereon is provided which includes a wafer cassette holder that has a flat bottom surface and four sidewall panels, a platform that has a flat top surface larger than and for mating to the flat bottom surface of the wafer cassette holder, And a securing device mounted in the flat top surface of the platform juxtaposed to each side of the four sidewalls of the wafer cassette holder for preventing the holder from accidentally slipping off the platform, the securing device may include either a plurality of engagement pins that slidingly engages the wafer cassette holder for securely holding the holder on the platform, or a plurality of side panels mounted along the peripheral edge of the platform for preventing the holder from slipping off the platform.

Abstract: A cassette stocker and method of forming the same. The cassette stocker comprises a housing, at least one operation device, and a transferring device. The housing comprises a plurality of openings. The operation device is disposed corresponding to the openings and storing a cassette. The transferring device is disposed in the housing, retrieving and transferring the cassette stored in the operation device via the openings.

Abstract: An automatic material handing system (AMHS). The AMHS comprises a rail, an overhead shuttle (OHS) and a stocker. The OHS moves on the rail. An in/out port (I/O port) is disposed in the stocker. The rail passes through the stocker and enters the I/O port. When the OHS is in the I/O port, a transport device places goods directly into the OHS.

Abstract: A conveyer system. The conveyer system includes a stocker and a conveyor. The stocker has a first position and a second position. The conveyor, with an Input/Output port, enters the stocker, wherein the Input/Output port is disposed between the first position and the second position.

Abstract: Within both a stocker apparatus and a method for operating the stocker apparatus there is employed: (1) a minimum of six input/output ports; (2) an array of storage locations for storing an array of work in process (WIP) product units; and (3) a random access transportation means for transporting a work in process (WIP) product unit at least bidirectionally between the minimum of six input/output ports and a storage location within the array of storage locations. Within the stocker apparatus and the method, the minimum of six input/output ports provides for more efficient operation of the stocker apparatus.

Abstract: A platform for securely mounting a wafer cassette holder thereon is provided which includes a wafer cassette holder that has a flat bottom surface and four sidewall panels, a platform that has a flat top surface larger than and for mating to the flat bottom surface of the wafer cassette holder, and a securing means mounted in the flat top surface of the platform juxtaposed to each side of the four sidewalls of the wafer cassette holder for preventing the holder from accidentally slipping off the platform. The securing means may include either a plurality of engagement pins that slidingly engages the wafer cassette holder for securely holding the holder on the platform, or a plurality of side panels mounted along the peripheral edge of the platform for preventing the holder from slipping off the platform.

Abstract: The SMIF pod includes a base having a cassette that may receive one or more wafers in preparation for transferring the wafers. The base includes a plurality of first openings formed on the side surfaces for a latch mechanism. The base includes a window formed on a surface of the base for an operator to read the state of the container. A box having second openings one to one corresponding to said first openings for the latch mechanism with latch member to penetrate through them while in the lock state. An indicator presents a first mark for indicating the locked state at the window or presents a second mark at the window for indicating the unlocked state.

Abstract: Within both a stocker apparatus and a method for operating the stocker apparatus there is employed, in addition to: (1) a minimum of one input/output port; (2) an array of storage locations for storing an array of work in process (WIP) product units; and (3) a random access transportation means for transporting a work in process (WIP) product unit at least bidirectionally between the minimum of one input/output port and a storage location within the array of storage locations; (4) a controller for controlling the random access transportation means. Within the stocker apparatus and the method, the controller is programmed such that upon unavailability of the minimum of one input/output port and upon concurrent receipt of a request to retrieve a work in process (WIP) product unit stored within the array of storage locations to reposition the requested work in process (WIP) product unit to a designated storage location within the array of storage locations where it may be manually retrieved.

Abstract: Within both a stocker apparatus and a method for operating the stocker apparatus there is employed: (1) a minimum of six input/output ports; (2) an array of storage locations for storing an array of work in process (WIP) product units; and (3) a random access transportation means for transporting a work in process (WIP) product unit at least bidirectionally between the minimum of six input/output ports and a storage location within the array of storage locations. Within the stocker apparatus and the method, the minimum of six input/output ports provides for more efficient operation of the stocker apparatus.

Abstract: Within both a stocker apparatus and a method for operating the stocker apparatus there is employed, in addition to: (1) a minimum of one input/output port; (2) an array of storage locations for storing an array of work in process (WIP) product units; and (3) a random access transportation means for transporting a work in process (WIP) product unit at least bidirectionally between the minimum of one input/output port and a storage location within the array of storage locations; (4) a controller for controlling the random access transportation means. Within the stocker apparatus and the method, the controller is programmed such that upon unavailability of the minimum of one input/output port and upon concurrent receipt of a request to retrieve a work in process (WIP) product unit stored within the array of storage locations to reposition the requested work in process (WIP) product unit to a designated storage location within the array of storage locations where it may be manually retrieved.