Patents by Inventor Yu-Yi Su

Yu-Yi Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096835
    Abstract: A method of manufacturing an electronic package is provided, in which an electronic element is disposed on a carrier structure; a heat dissipation body of a heat dissipation structure is disposed on the electronic element via a heat dissipation material; the heat dissipation material is cured; supporting legs of the heat dissipation structure are fixed on the carrier structure via a bonding layer; and the bonding layer is cured. Therefore, the heat dissipation structure can be effectively fixed to the heat dissipation material and the bonding layer by completing the arrangements of the heat dissipation material and the bonding layer in stages.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 21, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Pin-Jing SU, Liang-Yi HUNG, Yu-Po WANG
  • Patent number: 7621173
    Abstract: A nano-indentation ultrasonic detecting system for detecting mechanical properties of a target material. An indentation device, disposed on a surface of the target material, generates an indentation on the surface, obtaining the relation between the Young's modulus and the Poisson's ratio of the target material. An ultrasonic generator is movably disposed on the surface of the target material, generating at least two different ultrasonic signals thereon. An ultrasonic receiver is disposed on the surface of the target material and separated from the ultrasonic generator, receiving the ultrasonic signals. The result of a nano-indentation experiment are applied in the ultrasonic theory and iterated by the ultrasonic experimental data and theory, obtaining the Young's modulus of the target material. The obtained Young's modulus of the target material is substituted back in the result of the nano-indentation experiment, obtaining the Poisson's ratio of the target material.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: November 24, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Jiong-Shiun Hsu, Kai-Yu Cheng, Yu-Shyan Liu, Jeah-Sheng Wu, Yu-Yi Su, Chi-Sheng Chang
  • Publication number: 20070151340
    Abstract: A nano-indentation ultrasonic detecting system for detecting mechanical properties of a target material. An indentation device, disposed on a surface of the target material, generates an indentation on the surface, obtaining the relation between the Young's modulus and the Poisson's ratio of the target material. An ultrasonic generator is movably disposed on the surface of the target material, generating at least two different ultrasonic signals thereon. An ultrasonic receiver is disposed on the surface of the target material and separated from the ultrasonic generator, receiving the ultrasonic signals. The result of a nano-indentation experiment are applied in the ultrasonic theory and iterated by the ultrasonic experimental data and theory, obtaining the Young's modulus of the target material. The obtained Young's modulus of the target material is substituted back in the result of the nano-indentation experiment, obtaining the Poisson's ratio of the target material.
    Type: Application
    Filed: October 23, 2006
    Publication date: July 5, 2007
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jiong-shiun Hsu, Kai-Yu Cheng, Yu-Shyan Liu, Jeah-Sheng Wu, Yu-Yi Su, Chi-Sheng Chang