Abstract: A system and method for automatic SPC chart generation including a storage device and a data acquisition module. The storage device stores a chamber management tree, a recipe window management tree, a parameter configuration table and multiple chart profile records. The data acquisition module, which resides in a memory, acquires multiple process events and parameter values corresponding to the process events and a process parameter, selects a relevant statistical algorithm, calculates a statistical value by applying the statistical algorithm to the parameter values, creates a new chart profile record and a parameter statistics record therein if the chart profile record is absent, and stores the statistical values and measured time in the parameter statistics record.

Abstract: An apparatus and method for detecting mispositioned wafers attributable to transfer shift of the wafer are disclosed. A calibration wafer has a target region comprising a pattern of optically distinguishable features from which is determined the position of the calibration wafer within the chamber subsequent to its transfer therein. Preferably, the features comprise a pattern of colors that can be detected by spectroscopy. A preferred form and manner of providing such color features is by way of dielectric thin film filters.

Abstract: An apparatus and method for detecting in chamber wafer position and process status are disclosed. A chamber includes a processing pedestal and plurality of lift pins. Each lift pin has an associated load cell for measuring the load exerted by the wafer on the lift pins. Mispositioned wafers or broken wafers will result in load measurements outside of expected ranges. Position of the wafer may be determined from the load distribution sensed on the lift pins.

Abstract: An apparatus and method for detecting in chamber wafer position and process status are disclosed. A chamber includes a processing pedestal and plurality of lift pins. Each lift pin has an associated load cell for measuring the load exerted by the wafer on the lift pins. Mispositioned wafers or broken wafers will result in load measurements outside of expected ranges. Position of the wafer may be determined from the load distribution sensed on the lift pins.

Abstract: An apparatus and method for detecting mispositioned wafers attributable to transfer shift of the wafer are disclosed. A calibration wafer has a target region comprising a pattern of optically distinguishable features from which is determined the position of the calibration wafer within the chamber subsequent to its transfer therein. Preferably, the features comprise a pattern of colors that can be detected by spectroscopy. A preferred form and manner of providing such color features is by way of dielectric thin film filters.