Patents by Inventor Yu-Young Wang
Yu-Young Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220379356Abstract: A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.Type: ApplicationFiled: August 10, 2022Publication date: December 1, 2022Inventors: Yu-Young WANG, Chung-En KAO, Victor Y. LU
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Publication number: 20220359174Abstract: An apparatus and method for physical vapor deposition includes a magnetron having a plurality of electromagnets disposed between a base and a magnetic conductive plate. The magnetron includes a plurality of individually controlled electromagnets between a base and an electromagnetic plate. The magnetron controls the polarity and strength of current supplied to the respective electromagnets to generate magnetic fields that confine electrons to areas near a target material within the deposition chamber.Type: ApplicationFiled: May 5, 2021Publication date: November 10, 2022Inventors: Yu-Young WANG, Wen-Cheng YANG, Chyi-Tsong NI
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Patent number: 11433440Abstract: A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.Type: GrantFiled: June 3, 2019Date of Patent: September 6, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yu-Young Wang, Chung-En Kao, Victor Y. Lu
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Patent number: 10504776Abstract: A device includes a semiconductor substrate and a Metal-Oxide-Semiconductor (MOS) transistor. The MOS transistor includes a gate electrode over the semiconductor substrate, and a source/drain region on a side of the gate electrode. A source/drain contact plug includes a lower portion and an upper portion over the lower portion, wherein the source/drain contact plug is disposed over and electrically connected to the source/drain region. A gate contact plug is disposed over and electrically connected to the gate electrode, wherein a top surface of the gate contact plug is level with a top surface of the top portion of the source/drain contact plug. A Through-Substrate Via (TSV) extends into the semiconductor substrate. A top surface of the TSV is substantially level with an interface between the gate contact plug and the gate electrode.Type: GrantFiled: July 27, 2018Date of Patent: December 10, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan
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Publication number: 20190283087Abstract: A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.Type: ApplicationFiled: June 3, 2019Publication date: September 19, 2019Inventors: Yu-Young WANG, Chung-En KAO, Victor Y. LU
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Patent number: 10307798Abstract: A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.Type: GrantFiled: August 28, 2015Date of Patent: June 4, 2019Assignee: TAIWAN SEMICONDUCTER MANUFACTURING COMPANY LIMITEDInventors: Yu-Young Wang, Chung-En Kao, Victor Y. Lu
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Publication number: 20180337112Abstract: A device includes a semiconductor substrate and a Metal-Oxide-Semiconductor (MOS) transistor. The MOS transistor includes a gate electrode over the semiconductor substrate, and a source/drain region on a side of the gate electrode. A source/drain contact plug includes a lower portion and an upper portion over the lower portion, wherein the source/drain contact plug is disposed over and electrically connected to the source/drain region. A gate contact plug is disposed over and electrically connected to the gate electrode, wherein a top surface of the gate contact plug is level with a top surface of the top portion of the source/drain contact plug. A Through-Substrate Via (TSV) extends into the semiconductor substrate. A top surface of the TSV is substantially level with an interface between the gate contact plug and the gate electrode.Type: ApplicationFiled: July 27, 2018Publication date: November 22, 2018Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan
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Patent number: 10049965Abstract: A device includes a semiconductor substrate and a Metal-Oxide-Semiconductor (MOS) transistor. The MOS transistor includes a gate electrode over the semiconductor substrate, and a source/drain region on a side of the gate electrode. A source/drain contact plug includes a lower portion and an upper portion over the lower portion, wherein the source/drain contact plug is disposed over and electrically connected to the source/drain region. A gate contact plug is disposed over and electrically connected to the gate electrode, wherein a top surface of the gate contact plug is level with a top surface of the top portion of the source/drain contact plug. A Through-Substrate Via (TSV) extends into the semiconductor substrate. A top surface of the TSV is substantially level with an interface between the gate contact plug and the gate electrode.Type: GrantFiled: July 8, 2014Date of Patent: August 14, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan
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Publication number: 20170056934Abstract: A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.Type: ApplicationFiled: August 28, 2015Publication date: March 2, 2017Inventors: Yu-Young WANG, Chung-En KAO, Victor Y. LU
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Patent number: 9355935Abstract: Methods and devices for connecting a through via and a terminal of a transistor formed of a strained silicon material are provided. The terminal, which can be a source or a drain of a NMOS or a PMOS transistor, is formed within a substrate. A first contact within a first inter-layer dielectric (ILD) layer over the substrate is formed over and connected to the terminal. A through via extends through the first ILD layer into the substrate. A second contact is formed over and connected to the first contact and the through via within a second ILD layer and a contact etch stop layer (CESL). The second ILD layer is over the CESL, and the CESL is over the first ILD layer, which are all below a first inter-metal dielectric (IMD) layer and the first metal layer of the transistor.Type: GrantFiled: August 31, 2015Date of Patent: May 31, 2016Assignee: Taiwan Semiconductor Manufactruing Company, Ltd.Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan
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Publication number: 20150371928Abstract: Methods and devices for connecting a through via and a terminal of a transistor formed of a strained silicon material are provided. The terminal, which can be a source or a drain of a NMOS or a PMOS transistor, is formed within a substrate. A first contact within a first inter-layer dielectric (ILD) layer over the substrate is formed over and connected to the terminal. A through via extends through the first ILD layer into the substrate. A second contact is formed over and connected to the first contact and the through via within a second ILD layer and a contact etch stop layer (CESL). The second ILD layer is over the CESL, and the CESL is over the first ILD layer, which are all below a first inter-metal dielectric (IMD) layer and the first metal layer of the transistor.Type: ApplicationFiled: August 31, 2015Publication date: December 24, 2015Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan
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Patent number: 9123702Abstract: Methods and devices for connecting a through via and a terminal of a transistor formed of a strained silicon material are provided. The terminal, which can be a source or a drain of a NMOS or a PMOS transistor, is formed within a substrate. A first contact within a first inter-layer dielectric (ILD) layer over the substrate is formed over and connected to the terminal. A through via extends through the first ILD layer into the substrate. A second contact is formed over and connected to the first contact and the through via within a second ILD layer and a contact etch stop layer (CESL). The second ILD layer is over the CESL, and the CESL is over the first ILD layer, which are all below a first inter-metal dielectric (IMD) layer and the first metal layer of the transistor.Type: GrantFiled: January 7, 2014Date of Patent: September 1, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan
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Publication number: 20140319587Abstract: A device includes a semiconductor substrate and a Metal-Oxide-Semiconductor (MOS) transistor. The MOS transistor includes a gate electrode over the semiconductor substrate, and a source/drain region on a side of the gate electrode. A source/drain contact plug includes a lower portion and an upper portion over the lower portion, wherein the source/drain contact plug is disposed over and electrically connected to the source/drain region. A gate contact plug is disposed over and electrically connected to the gate electrode, wherein a top surface of the gate contact plug is level with a top surface of the top portion of the source/drain contact plug. A Through-Substrate Via (TSV) extends into the semiconductor substrate. A top surface of the TSV is substantially level with an interface between the gate contact plug and the gate electrode.Type: ApplicationFiled: July 8, 2014Publication date: October 30, 2014Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan
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Patent number: 8803292Abstract: A device includes a semiconductor substrate and a Metal-Oxide-Semiconductor (MOS) transistor. The MOS transistor includes a gate electrode over the semiconductor substrate, and a source/drain region on a side of the gate electrode. A source/drain contact plug includes a lower portion and an upper portion over the lower portion, wherein the source/drain contact plug is disposed over and electrically connected to the source/drain region. A gate contact plug is disposed over and electrically connected to the gate electrode, wherein a top surface of the gate contact plug is level with a top surface of the top portion of the source/drain contact plug. A Through-Substrate Via (TSV) extends into the semiconductor substrate. A top surface of the TSV is substantially level with an interface between the gate contact plug and the gate electrode.Type: GrantFiled: April 27, 2012Date of Patent: August 12, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan
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Publication number: 20140117461Abstract: Methods and devices for connecting a through via and a terminal of a transistor formed of a strained silicon material are provided. The terminal, which can be a source or a drain of a NMOS or a PMOS transistor, is formed within a substrate. A first contact within a first inter-layer dielectric (ILD) layer over the substrate is formed over and connected to the terminal. A through via extends through the first ILD layer into the substrate. A second contact is formed over and connected to the first contact and the through via within a second ILD layer and a contact etch stop layer (CESL). The second ILD layer is over the CESL, and the CESL is over the first ILD layer, which are all below a first inter-metal dielectric (IMD) layer and the first metal layer of the transistor.Type: ApplicationFiled: January 7, 2014Publication date: May 1, 2014Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan
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Patent number: 8624324Abstract: Methods and devices for connecting a through via and a terminal of a transistor formed of a strained silicon material are provided. The terminal, which can be a source or a drain of a NMOS or a PMOS transistor, is formed within a substrate. A first contact within a first inter-layer dielectric (ILD) layer over the substrate is formed over and connected to the terminal. A through via extends through the first ILD layer into the substrate. A second contact is formed over and connected to the first contact and the through via within a second ILD layer and a contact etch stop layer (CESL). The second ILD layer is over the CESL, and the CESL is over the first ILD layer, which are all below a first inter-metal dielectric (IMD) layer and the first metal layer of the transistor.Type: GrantFiled: August 10, 2012Date of Patent: January 7, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan
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Publication number: 20130285125Abstract: A device includes a semiconductor substrate and a Metal-Oxide-Semiconductor (MOS) transistor. The MOS transistor includes a gate electrode over the semiconductor substrate, and a source/drain region on a side of the gate electrode. A source/drain contact plug includes a lower portion and an upper portion over the lower portion, wherein the source/drain contact plug is disposed over and electrically connected to the source/drain region. A gate contact plug is disposed over and electrically connected to the gate electrode, wherein a top surface of the gate contact plug is level with a top surface of the top portion of the source/drain contact plug. A Through-Substrate Via (TSV) extends into the semiconductor substrate. A top surface of the TSV is substantially level with an interface between the gate contact plug and the gate electrode.Type: ApplicationFiled: April 27, 2012Publication date: October 31, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ming-Fa Chen, Yu-Young Wang, Sen-Bor Jan