Patents by Inventor Yu-Yu Kao

Yu-Yu Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210120987
    Abstract: A cup structure comprises an inner cup and an outer cup. A groove is formed on an outer surface of the inner cup and concaved from the outer surface to an inner surface. The inner cup is completely or partly wrapped by the outer cup. The groove of the inner cup and a portion of the outer cup form a fluid channel. Suction holes are formed at two ends of the fluid channel. Thereby, the user can suck the material inside the cup structure. Further, the cup structure can be disassembled conveniently for cleaning.
    Type: Application
    Filed: October 28, 2020
    Publication date: April 29, 2021
    Inventors: YU-YU KAO, WEN-YUAN HSIEH
  • Publication number: 20160035943
    Abstract: A fluorescent composite resin substrate white light LED includes a fluorescent composite resin substrate, two conductive brackets, a light emitting unit, two conductive lines and a package material. The fluorescent composite resin substrate is formed from a mixture through a curing reaction. Each of the conductive brackets is partially connected to the substrate. The light emitting unit is disposed on the substrate. The conductive lines are connected to the light emitting unit and respectively connected to the conductive brackets. The package material is formed from a mixture through a curing reaction. By fixing the light emitting unit at the fluorescent composite resin substrate, when applied to white light LED operations, the present invention achieves effects of emitting light through six planes, having high light flux and good heat dissipation, and significantly increasing production yield rate and speed without incurring different color temperatures at front and reverse sides.
    Type: Application
    Filed: April 23, 2015
    Publication date: February 4, 2016
    Inventor: Yu-Yu KAO
  • Patent number: 9246066
    Abstract: A fluorescent composite resin substrate white light LED includes a fluorescent composite resin substrate, two conductive brackets, a light emitting unit, two conductive lines and a package material. The fluorescent composite resin substrate is formed from a mixture through a curing reaction. Each of the conductive brackets is partially connected to the substrate. The light emitting unit is disposed on the substrate. The conductive lines are connected to the light emitting unit and respectively connected to the conductive brackets. The package material is formed from a mixture through a curing reaction. By fixing the light emitting unit at the fluorescent composite resin substrate, when applied to white light LED operations, the present invention achieves effects of emitting light through six planes, having high light flux and good heat dissipation, and significantly increasing production yield rate and speed without incurring different color temperatures at front and reverse sides.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: January 26, 2016
    Inventor: Yu-Yu Kao
  • Patent number: 7297223
    Abstract: This present invention relates to a process of liquid crystal panel with one drop fill (ODF). A black matrix, which can not be penetrated by an ultraviolet light while curing a sealant, is formed on the other substrate. Hence, in this present invention, it can avoid the aforementioned problem during the curing process and simplifies the curing process.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: November 20, 2007
    Assignee: Chunghwa Picture Tubes, Ltd.
    Inventors: Tsung-Yu Yu Kao, Po-Hsiu Shih
  • Publication number: 20040174491
    Abstract: This present invention relates to a process of liquid crystal panel with one drop fill (ODF). A black matrix, which can not be penetrated by an ultraviolet light while curing a sealant, is formed on the other substrate. Hence, in this present invention, it can avoid the aforementioned problem during the curing process and simplifies the curing process.
    Type: Application
    Filed: February 13, 2004
    Publication date: September 9, 2004
    Inventors: Tsung-Yu Yu Kao, Po-Hsiu Shih