Abstract: Provided is a semiconductor device including a substrate, a semiconductor layer, a source electrode, a first metal layer, a backside via hole, and a backside metal layer. The substrate has a frontside and a backside opposite to each other. The semiconductor layer is disposed on the frontside of the substrate. The source electrode is disposed on the semiconductor layer. The first metal layer is disposed on the source electrode. The backside via hole extends from the backside of the substrate to a bottom surface of the first metal layer. The backside via hole is laterally separated from the source electrode by a non-zero distance. The backside metal layer is disposed on the backside of the substrate and extending to cover a surface of the backside via hole.

Abstract: A semiconductor device package structure includes a substrate. The substrate has a circuit structure formed in a die region. The die region is defined by a plurality of scribe lines configured on the substrate. A seal ring is disposed in the substrate and located at a periphery region of the die region, and surrounds at least a portion of the circuit structure. A trench ring is disposed in the substrate between the seal ring and the scribe lines. A packaging passivation cap layer covers over the circuit structure and the seal ring, and covers at least the trench ring.

Abstract: A semiconductor device package structure includes a substrate. The substrate has a circuit structure formed in a die region. The die region is defined by a plurality of scribe lines configured on the substrate. A seal ring is disposed in the substrate and located at a periphery region of the die region, and surrounds at least a portion of the circuit structure. A trench ring is disposed in the substrate between the seal ring and the scribe lines. A packaging passivation cap layer covers over the circuit structure and the seal ring, and covers at least the trench ring.

Abstract: The present invention provides a light source module. The light source module includes a circuit board, a metal base, a plurality of LEDs, a plurality of bonding wires and a reflective layer. The metal base is arranged on the circuit board and has a bottom wall and a peripheral wall upwardly extending from the bottom wall. The bottom wall and the peripheral wall cooperatively define a recess. The bottom wall has a through groove exposing the circuit board. The LEDs are arranged on the bottom wall. The bonding wires electrically connect the LEDs to the circuit board through the through groove. The reflective layer is arranged in the through groove and seals the through groove. Therefore, the light source module has better heat dissipation effect and the overall illumination intensity of the light source module is increased.

Abstract: A system and method for managing network devices via e-mail that accomplishes sending management commands to the management proxy device (140) and receiving status information on the managed device (150) via e-mail in a network management system. The system for managing network devices via e-mail comprised: at least one management base (100) that runs an e-mail client side program (113) as a network management tool to send e-mails containing management commands; at least one management proxy device that runs an e-mail service module (146) for receiving and analyzing e-mails containing management commands, and for sending e-mails containing status information on a managed device, said e-mail service module comprising an e-mail receiving sub-module (1461), a decryption sub-module (1462), a status information reporting sub-module (1463) and an e-mail sending sub-module (1464); and an e-mail server (160) that receives e-mails from the management base and the management proxy device.

Abstract: A hula hoop is formed of a plurality of spherical bodies, with each having a main body and a pliable connection rod which is provided at the free end thereof with a retaining block. The main body is provided with a receiving slot opposite to the connection rod and extending toward the center of the main body, and an insertion slot extending toward the receiving slot. The insertion slot is provided with a retaining slot corresponding to the center of the main body and greater in inner diameter than the insertion slot. The insertion slot has a width greater than a thickness of the connection rod. The hula hoop is formed of the spherical bodies such that the connection rod of one of the spherical bodies is received in the receiving slot of another one of the spherical bodies via the insertion slot of the another one spherical body, and that the retaining block is retained in the retaining slot.