Patents by Inventor Yu-Yuan Huang

Yu-Yuan Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240137599
    Abstract: A terminal, comprising one or a plurality of processors, wherein the one or plurality of processors execute a machine-readable instruction to perform: receiving an object in a live streaming; displaying the object on the terminal; detecting a keyword in the object corresponding to a function in the live streaming; and triggering the function in response to an operation on the object. The present disclosure may allow the streamers to generate or amend an object such as stickers on the live streaming room in a more flexible manner. At the same time, the viewer may perform an operation on the object to realize a corresponding function in a more convenient manner. Therefore, the interaction among streamers and viewers may be increased, and the user experience may also be enhanced.
    Type: Application
    Filed: July 2, 2023
    Publication date: April 25, 2024
    Inventors: Yu-Cheng FAN, Sz-Chi HUANG, Chih-Yuan WANG
  • Publication number: 20240136344
    Abstract: A display device includes a substrate, at least one light emitting unit bound on the substrate, a transparency controllable unit disposed on the substrate, and an integrated circuit unit overlapped with the substrate. The integrated circuit unit includes a semiconducting structure and a conductive structure overlapped with the semiconducting structure. The integrated circuit unit is electrically connected to the at least one light emitting unit and the transparency controllable unit.
    Type: Application
    Filed: September 17, 2023
    Publication date: April 25, 2024
    Applicant: InnoLux Corporation
    Inventors: Jia-Yuan CHEN, Yu-Chia HUANG, Tsung-Han TSAI, Kuan-Feng LEE
  • Publication number: 20240130614
    Abstract: An intraocular pressure inspection device includes an intraocular pressure detection unit, a high-precision positioning system and a wide-area positioning system, wherein according to the position of the intraocular pressure detection unit, a set of high-precision coordinates output by the high-precision positioning system and a set of wide-area coordinates output by the wide-area positioning system are integrated in appropriate weights to obtain a set of more precise integrated coordinate. The above-mentioned intraocular pressure inspection device can prevent the intraocular pressure detection unit from failing to operate once it is not in the working area of the high-precision positioning system.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 25, 2024
    Inventors: Shao Hung HUANG, Chao-Ting CHEN, Fong Hao KUO, Yu-Chung TUNG, Chu-Ming CHENG, Chi-Yuan KANG
  • Patent number: 11967591
    Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee
  • Publication number: 20240113010
    Abstract: A semiconductor device is disclosed herein. The semiconductor device includes a routing structure. The routing structure has an intermediate conductive routing layer. The intermediate conductive routing layer includes a first mesh conductive layer formed in a predetermined second region of the semiconductor device and a second mesh conductive layer formed in a predetermined first region of the semiconductor device. The first mesh conductive layer and the second mesh conductive layer are electrically isolated from each other. The intermediate conductive routing layer further includes multiple first conductive islands formed in the predetermined first region and multiple second conductive islands formed in the predetermined second region.
    Type: Application
    Filed: September 20, 2023
    Publication date: April 4, 2024
    Inventors: Po-Hsien Huang, Yu-Huei Lee, Hsin-Hung Lin, Chun-Yuan Shih, Lien-Chieh Yu
  • Publication number: 20240105546
    Abstract: A module device on a first substrate includes a power module, a housing, a pair of locking structures. The housing covers the power module. The locking structures are installed on a pair of opposite sides of the housing, and the locking structure includes a main body, a locking ring, a pair of ribs and anchoring portions. The locking ring extends from a side toward an inner side of the main body, and is a double-ring structure, which includes an inner and an outer ring. A first side of the outer ring is connected to the main body, a second side of the outer ring is connected to the inner ring. The ribs extend along a normal direction of the top surface of the main body. The anchoring portions are disposed at the end of the ribs, and an extending direction is perpendicular to an extending direction of the rib.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 28, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Ji-Yuan Syu, Yuan-Cheng Huang, Yu-Chih Wang
  • Publication number: 20240089607
    Abstract: An image sensing device and a control device of an illumination device thereof are provided. The control device includes a control circuit, an operation circuit, and multiple driving signal generators. The control circuit generates multiple control signals. The operation circuit performs a logical operation on the control signals and an image capturing signal to generate multiple operation results. The driving signal generator respectively provides multiple driving signals to the illumination device according to the operation results, and the driving signals respectively have multiple different output powers.
    Type: Application
    Filed: May 29, 2023
    Publication date: March 14, 2024
    Applicant: HTC Corporation
    Inventors: Chao Shuan Huang, Sheng-Long Wu, Yu-Jui Hsu, Shih-Yao Tsai, Tun-Hao Chao, Sen-Lin Chung, Chih Pin Chung, Chih-Yuan Chien, Shih Hong Sun
  • Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • Patent number: 11913981
    Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: February 27, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Mean-Jue Tung, Ming-Da Yang, Shi-Yuan Tong, Yu-Ting Huang, Chun-Pin Wu
  • Patent number: 11495510
    Abstract: A semiconductor device package structure includes a substrate. The substrate has a circuit structure formed in a die region. The die region is defined by a plurality of scribe lines configured on the substrate. A seal ring is disposed in the substrate and located at a periphery region of the die region, and surrounds at least a portion of the circuit structure. A trench ring is disposed in the substrate between the seal ring and the scribe lines. A packaging passivation cap layer covers over the circuit structure and the seal ring, and covers at least the trench ring.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: November 8, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Yuan Huang, Tsung-Kai Yu, Chen-Hsiao Wang, Kai-Kuang Ho, Kuang-Hui Tang
  • Publication number: 20210202340
    Abstract: A semiconductor device package structure includes a substrate. The substrate has a circuit structure formed in a die region. The die region is defined by a plurality of scribe lines configured on the substrate. A seal ring is disposed in the substrate and located at a periphery region of the die region, and surrounds at least a portion of the circuit structure. A trench ring is disposed in the substrate between the seal ring and the scribe lines. A packaging passivation cap layer covers over the circuit structure and the seal ring, and covers at least the trench ring.
    Type: Application
    Filed: February 3, 2020
    Publication date: July 1, 2021
    Applicant: United Microelectronics Corp.
    Inventors: YU-YUAN HUANG, Tsung-Kai Yu, Chen-Hsiao Wang, Kai-Kuang Ho, Kuang-Hui Tang
  • Publication number: 20110182054
    Abstract: The present invention provides a light source module. The light source module includes a circuit board, a metal base, a plurality of LEDs, a plurality of bonding wires and a reflective layer. The metal base is arranged on the circuit board and has a bottom wall and a peripheral wall upwardly extending from the bottom wall. The bottom wall and the peripheral wall cooperatively define a recess. The bottom wall has a through groove exposing the circuit board. The LEDs are arranged on the bottom wall. The bonding wires electrically connect the LEDs to the circuit board through the through groove. The reflective layer is arranged in the through groove and seals the through groove. Therefore, the light source module has better heat dissipation effect and the overall illumination intensity of the light source module is increased.
    Type: Application
    Filed: June 23, 2010
    Publication date: July 28, 2011
    Inventors: Wan-Yi LEE, Chia-Ying TSENG, Yu-Yuan HUANG, Jin-Yong LIOU
  • Publication number: 20040093383
    Abstract: A system and method for managing network devices via e-mail that accomplishes sending management commands to the management proxy device (140) and receiving status information on the managed device (150) via e-mail in a network management system. The system for managing network devices via e-mail comprised: at least one management base (100) that runs an e-mail client side program (113) as a network management tool to send e-mails containing management commands; at least one management proxy device that runs an e-mail service module (146) for receiving and analyzing e-mails containing management commands, and for sending e-mails containing status information on a managed device, said e-mail service module comprising an e-mail receiving sub-module (1461), a decryption sub-module (1462), a status information reporting sub-module (1463) and an e-mail sending sub-module (1464); and an e-mail server (160) that receives e-mails from the management base and the management proxy device.
    Type: Application
    Filed: December 31, 2002
    Publication date: May 13, 2004
    Inventors: Yu-Yuan Huang, Cheng-Ling Lin
  • Patent number: 6102769
    Abstract: A hula hoop is formed of a plurality of spherical bodies, with each having a main body and a pliable connection rod which is provided at the free end thereof with a retaining block. The main body is provided with a receiving slot opposite to the connection rod and extending toward the center of the main body, and an insertion slot extending toward the receiving slot. The insertion slot is provided with a retaining slot corresponding to the center of the main body and greater in inner diameter than the insertion slot. The insertion slot has a width greater than a thickness of the connection rod. The hula hoop is formed of the spherical bodies such that the connection rod of one of the spherical bodies is received in the receiving slot of another one of the spherical bodies via the insertion slot of the another one spherical body, and that the retaining block is retained in the retaining slot.
    Type: Grant
    Filed: August 26, 1999
    Date of Patent: August 15, 2000
    Assignee: Li-Chu Wu
    Inventor: Yu-Yuan Huang
  • Patent number: D852391
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: June 25, 2019
    Assignee: MAXZONE VEHICLE LIGHTING CORP.
    Inventors: Hui-Chuan Chen, Yu-Yuan Huang
  • Patent number: D1003473
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: October 31, 2023
    Assignee: MAXZONE VEHICLE LIGHTING CORP.
    Inventors: Yu-Yuan Huang, Yung-Chien Lin
  • Patent number: D1013224
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: January 30, 2024
    Assignee: MAXZONE VEHICLE LIGHTING CORP.
    Inventors: Yu-Yuan Huang, Chun-Ting Chen, Ya-Hsuan Wu
  • Patent number: D1018907
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: March 19, 2024
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Yun-Chien Lee, Yi-Ching Hsu, Pei-Yi Lin, Yu-Hung Su, Sheng-Yuan Huang, Chun-Fu Lin