Abstract: An electronic package is provided. The electronic package includes a carrier, a first electronic component, a bonding element, and a barrier. The carrier has a conductive layer. The first electronic component is disposed adjacent to the carrier and has a first terminal and a second terminal. The bonding element is configured to electrically connect the conductive layer to the first terminal. The barrier is configured to avoid electrically bypassing an electrical path in the first electronic component and between the first terminal and the second terminal.

Abstract: An electronic package is provided. The electronic package includes a carrier, a first electronic component, a bonding element, and a barrier. The carrier has a conductive layer. The first electronic component is disposed adjacent to the carrier and has a first terminal and a second terminal. The bonding element is configured to electrically connect the conductive layer to the first terminal. The barrier is configured to avoid electrically bypassing an electrical path in the first electronic component and between the first terminal and the second terminal.

Abstract: A metal mesh structure includes at least one first wire extending along a first direction and at least one second wire extending along a second direction different from the first direction. The at least one first wire includes a first portion, a second portion and a first bending portion connected between the first portion and the second portion. The first bending portion crosses the at least one second wire to form a node. An extending line of the first portion along the first direction passes through the node and is overlapped with the second portion. A first included angle is included between the first direction and the second direction, and a second included angle is included between the first bending portion and the at least one second wire, wherein the first included angle is different from the second included angle, and the second included angle is 90 degrees.

Abstract: A metal mesh structure includes at least one first wire extending along a first direction and at least one second wire extending along a second direction different from the first direction. The at least one first wire includes a first portion, a second portion and a first bending portion connected between the first portion and the second portion. The first bending portion crosses the at least one second wire to form a node. An extending line of the first portion along the first direction passes through the node and is overlapped with the second portion. A first included angle is included between the first direction and the second direction, and a second included angle is included between the first bending portion and the at least one second wire, wherein the first included angle is different from the second included angle, and the second included angle is 90 degrees.

Abstract: A semiconductor package structure and a method of manufacturing the same are provided. A semiconductor package structure includes a first electronic component and a light emitter. The photonic component includes a substrate and a first port. The light emitter is disposed over the substrate of the photonic component. The light emitter is configured to emit light through the first port. A coupling loss between the first port of the photonic component and the light emitter is less than 3 dB.

Abstract: A semiconductor package structure includes a conductive structure, a first semiconductor chip, a second semiconductor chip, a first encapsulant and an upper semiconductor chip. The first semiconductor chip is electrically connected to the conductive structure. The first semiconductor chip includes at least one first conductive element disposed adjacent to a second surface thereof. The second semiconductor chip is electrically connected to the conductive structure and disposed next to the first semiconductor chip. The second semiconductor chip includes at least one second conductive element disposed adjacent to a second surface thereof. The first encapsulant is disposed on the conductive structure to cover the first semiconductor chip and the second semiconductor chip. The first conductive element and the second conductive element are exposed from the first encapsulant.

Abstract: A semiconductor package structure includes a conductive structure, a first semiconductor chip, a second semiconductor chip, a first encapsulant and an upper semiconductor chip. The first semiconductor chip is electrically connected to the conductive structure. The first semiconductor chip includes at least one first conductive element disposed adjacent to a second surface thereof. The second semiconductor chip is electrically connected to the conductive structure and disposed next to the first semiconductor chip. The second semiconductor chip includes at least one second conductive element disposed adjacent to a second surface thereof. The first encapsulant is disposed on the conductive structure to cover the first semiconductor chip and the second semiconductor chip. The first conductive element and the second conductive element are exposed from the first encapsulant.

Abstract: An apparatus for identifying morphology comprises a substrate, a driving circuit, a readout circuit and an identifying circuit. The substrate comprises temperature sensors each comprising a sensing transistor. The driving circuit selects at least one of the transistors as a target sensing transistor, and outputs a driving signal to the target sensing transistor to heat the target sensing transistor in a heating period. The target sensing transistor senses a temperature change to generate a sensing signal in a sensing period after the heating period. The readout circuit reads the sensing signal, and the identifying circuit identifies the morphology according to the sensing signal.

Abstract: An illumination device includes a lamp housing component, a main bone disposed inside the lamp housing component, and at least one light emitting component. The light emitting component has a heat sink member and a light emitting member. The heat sink member is locked on the main bone, and the light emitting member is disposed on the lamp housing component and contacts the heat sink member. According to the demand for luminance, the number of light emitting components is optionally increased or decreased on the main bone, or the main bone inside the lamp housing component is replaced by an extended main bone, so as to increase the number of light emitting components.

Abstract: An illumination device includes a lamp housing component, a main bone disposed inside the lamp housing component, and at least one light emitting component. The light emitting component has a heat sink member and a light emitting member. The heat sink member is locked on the main bone, and the light emitting member is disposed on the lamp housing component and contacts the heat sink member. According to the demand for luminance, the number of light emitting components is optionally increased or decreased on the main bone, or the main bone inside the lamp housing component is replaced by an extended main bone, so as to increase the number of light emitting components.

Abstract: An LED light device module includes a housing, a light source structure and a power supply. The housing has a cover body and a base body. The cover body is located on the base body. The light source structure is located in the housing. The light source structure includes a cooling device, an LED light source device and a secondary optical device. The LED light source device and the secondary optical device are located on the cooling device. The LED light source device is located between the cooling device and the secondary optical device. The power supply is located in the housing and electrically connected with the light source structure. Thereby, the system cost is reduced, the total weight is low, it is easy to manufacture and maintain. The LED light device module can be expanded and the outline of the LED light device module can be designed flexibly.

Abstract: A heat pipe cooling system including an evaporator, a pipeline, a working fluid and a thermal connector is provided. The evaporator is connected to a heat-generating element, and the pipeline is connected to the evaporator. The working fluid is injected into a closed loop formed by the evaporator and the pipeline. The thermal connector includes a first thermal conductive block and a second thermal conductive block. The first thermal conductive block has many first fitting parts and a contact surface. The contact surface is suitable for attaching to one of the surfaces of an object. The second thermal conductive block has many second fitting parts. The second fitting parts are suitable for meshing with the first fitting parts to form a piping channel inside the thermal connector. The piping channel is suitable for enclosing a section of the pipeline or directly serving as a part of the pipeline.

Abstract: A heat pipe cooling system comprising an evaporator, a pipeline, a working fluid and a thermal connector is provided. The evaporator is connected to a heat-generating element, and the pipeline is connected to the evaporator. The working fluid is injected into a closed loop formed by the evaporator and the pipeline. The thermal connector comprises a first thermal conductive block and a second thermal conductive block. The first thermal conductive block has many first fitting parts and a contact surface. The contact surface is suitable for attaching to one of the surfaces of an object. The second thermal conductive block has many second fitting parts. The second fitting parts are suitable for meshing with the first fitting parts to form a piping channel inside the thermal connector. The piping channel is suitable for enclosing a section of the pipeline or directly serving as a part of the pipeline.