Patents by Inventor Yu-Yun LU

Yu-Yun LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113234
    Abstract: An integrated chip including a gate layer. An insulator layer is over the gate layer. A channel structure is over the insulator layer. A pair of source/drains are over the channel structure and laterally spaced apart by a dielectric layer. The channel structure includes a first channel layer between the insulator layer and the pair of source/drains, a second channel layer between the insulator layer and the dielectric layer, and a third channel layer between the second channel layer and the dielectric layer. The first channel layer, the second channel layer, and the third channel layer include different semiconductors.
    Type: Application
    Filed: January 4, 2023
    Publication date: April 4, 2024
    Inventors: Ya-Yun Cheng, Wen-Ling Lu, Yu-Chien Chiu, Chung-Wei Wu, Zhiqiang Wu
  • Publication number: 20240090230
    Abstract: A memory array and an operation method of the memory array are provided. The memory array includes first and second ferroelectric memory devices formed along a gate electrode, a channel layer and a ferroelectric layer between the gate electrode and the channel layer. The ferroelectric memory devices include: a common source/drain electrode and two respective source/drain electrodes, separately in contact with a side of the channel layer opposite to the ferroelectric layer, wherein the common source/drain electrode is disposed between the respective source/drain electrodes; and first and second auxiliary gates, capacitively coupled to the channel layer, wherein the first auxiliary gate is located between the common source/drain electrode and one of the respective source/drain electrodes, and the second auxiliary gate is located between the common source/drain electrode and the other respective source/drain electrode.
    Type: Application
    Filed: January 9, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Ling Lu, Chen-Jun Wu, Ya-Yun Cheng, Sheng-Chih Lai, Yi-Ching Liu, Yu-Ming Lin, Feng-Cheng Yang, Chung-Te Lin
  • Patent number: 9296086
    Abstract: An improved destructive and visual measurement automation system and a method for measuring a web thickness of a microdrill are provided. When a dual-axis motion platform module moves the microdrill to a first position, a reflection module reflects a first image in a first direction toward a second direction. A vision module receives the reflected first image in the second direction and outputs the received first image to a computer. According to the first image, the computer performs a positioning procedure and a grinding procedure to drive a drill grinding module to grind the microdrill to a sectional position to be measured of the microdrill. When the microdrill is moved to a second position, the vision module outputs a second image to the computer. According to the second image, the computer performs an image computing procedure to obtain the web thickness at the sectional position to be measured.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: March 29, 2016
    Assignee: National Taiwan Ocean University
    Inventors: Wen-Tung Chang, Yu-Yun Lu
  • Publication number: 20150017879
    Abstract: An improved destructive and visual measurement automation system and a method for measuring a web thickness of a microdrill are provided. When a dual-axis motion platform module moves the microdrill to a first position, a reflection module reflects a first image in a first direction toward a second direction. A vision module receives the reflected first image in the second direction and outputs the received first image to a computer. According to the first image, the computer performs a positioning procedure and a grinding procedure to drive a drill grinding module to grind the microdrill to a sectional position to be measured of the microdrill. When the microdrill is moved to a second position, the vision module outputs a second image to the computer. According to the second image, the computer performs an image computing procedure to obtain the web thickness at the sectional position to be measured.
    Type: Application
    Filed: April 16, 2014
    Publication date: January 15, 2015
    Applicant: National Taiwan Ocean University
    Inventors: Wen-Tung CHANG, Yu-Yun LU