Abstract: An integrated circuit design implementation system includes a die-to-die (D2D) complier configured to receive a configuration of a semiconductor package. The semiconductor package includes a first semiconductor die and a second semiconductor die bonded to each other. The D2D compiler is configured to generate, based on the configuration of the semiconductor package, a first bump map and a second bump map for the first semiconductor die and the second semiconductor die, respectively. The first bump map indicates respective locations of a plurality of first bump structures of the first semiconductor die, and the second bump map indicates respective locations of a plurality of second bump structures of the second semiconductor die.

Abstract: A method in certain embodiments includes using a computer system that includes an EDA tool to generate a layout of an IC device; searching, using a statistical method such as Bayesian optimization process, for one or more input variable parameters, such as the dimensions of the IC device and the dimensions of the voltage areas in the IC device, that results in an optimal characteristic, such as power, performance or area (PPA) of the IC device, subject to a limiting condition, such as one determined using a cost function. A computer system including one or more EDAs configured to perform the method is also disclosed.

Abstract: A method in certain embodiments includes using a computer system that includes an EDA tool to generate a layout of an IC device; searching, using a statistical method such as Bayesian optimization process, for one or more input variable parameters, such as the dimensions of the IC device and the dimensions of the voltage areas in the IC device, that results in an optimal characteristic, such as power, performance or area (PPA) of the IC device, subject to a limiting condition, such as one determined using a cost function. A computer system including one or more EDAs configured to perform the method is also disclosed.

Abstract: A method in certain embodiments includes using a computer system that includes an EDA tool to generate a layout of an IC device; searching, using a statistical method such as Bayesian optimization process, for one or more input variable parameters, such as the dimensions of the IC device and the dimensions of the voltage areas in the IC device, that results in an optimal characteristic, such as power, performance or area (PPA) of the IC device, subject to a limiting condition, such as one determined using a cost function. A computer system including one or more EDAs configured to perform the method is also disclosed.

Abstract: A method in certain embodiments includes using a computer system that includes an EDA tool to generate a layout of an IC device; searching, using a statistical method such as Bayesian optimization process, for one or more input variable parameters, such as the dimensions of the IC device and the dimensions of the voltage areas in the IC device, that results in an optimal characteristic, such as power, performance or area (PPA) of the IC device. A computer system including one or more EDAs configured to perform the method is also disclosed.

Abstract: A method in certain embodiments includes using a computer system that includes an EDA tool to generate a layout of an IC device; searching, using a statistical method such as Bayesian optimization process, for one or more input variable parameters, such as the dimensions of the IC device and the dimensions of the voltage areas in the IC device, that results in an optimal characteristic, such as power, performance or area (PPA) of the IC device. A computer system including one or more EDAs configured to perform the method is also disclosed.

Abstract: A cutting tool having a metallic glass thin film (MGTF) coated thereon, a metallic glass cutting tool, and methods of fabricating the same are disclosed. The cutting tool having metallic glass thin film coated thereon comprises: a cutting element having a sharpened portion, and the cutting element is made of metal; and a metallic glass thin film coated on the cutting element, and the metallic glass is represented by the following formula 1 or formula 2, (ZraCubNicAld)100-xSix,??[formula 1] wherein 45=<a=<75, 25=<b=<35, 5=<c=<15, 5=<d=<15, 0.1=<x=<10, (ZreCufAggAlh)100-ySiy,??[formula 2] 35=<e=<55, 35=<f=<55, 5=<g=<15, 5=<h=<15, 0.1=<y=<10. The metallic glass cutting tool of the present invention comprises: a cutting element having a sharpened portion, and the cutting element is made of a metallic glass represented by the above formula 1 or formula 2.

Abstract: A cutting tool having a metallic glass thin film (MGTF) coated thereon, a metallic glass cutting tool, and methods of fabricating the same are disclosed. The cutting tool having metallic glass thin film coated thereon comprises: a cutting element having a sharpened portion, and the cutting element is made of metal; and a metallic glass thin film coated on the cutting element, and the metallic glass is represented by the following formula 1 or formula 2, (ZraCubNicAld)100-xSix,??[formula 1] wherein 45=<a=<75, 25=<b=<35, 5=<c=<15, 5=<d=<15, 0.1=<x=<10, (ZreCufAggAlh)100-ySiy,??[formula 2] 35=<e=<55, 35=<f=<55, 5=<g=<15, 5=<h=<15, 0.1=<y=<10. The metallic glass cutting tool of the present invention comprises: a cutting element having a sharpened portion, and the cutting element is made of a metallic glass represented by the above formula 1 or formula 2.

Abstract: A cutting tool having a metallic glass thin film (MGTF) coated thereon, a metallic glass cutting tool, and methods of fabricating the same are disclosed. The cutting tool having metallic glass thin film coated thereon comprises: a cutting element having a sharpened portion, and the cutting element is made of metal; and a metallic glass thin film coated on the cutting element, and the metallic glass is represented by the following formula 1 or formula 2, (ZraCubNicAld)100-xSix,??[formula 1] wherein 45=<a=<75, 25=<b=<35, 5=<c=<15, 5=<d=<15, 0.1=<x=<10, (ZreCufAggAlh)100-ySiy,??[formula 2] 35=<e=<55, 35=<f=<55, 5=<g=<15, 5=<h=<15, 0.1=<y=<10. The metallic glass cutting tool of the present invention comprises: a cutting element having a sharpened portion, and the cutting element is made of a metallic glass represented by the above formula 1 or formula 2.