Abstract: An inductor device includes an 8-shaped inductor and a ring-type wire. The ring-type wire is disposed around an outer side of the 8-shaped inductor. The 8-shaped inductor includes an input terminal and a center-tapped terminal. The input terminal of the 8-shaped inductor is located on a first side of the inductor device, and the center-tapped terminal is located on a second side of the inductor device. The ring-type wire includes an input terminal and a ground terminal. The input terminal of the ring-type wire is located on the first side of the inductor device, and the ground terminal is located on the second side of the inductor device. The input terminal of the ring-type wire is coupled to the input terminal of the 8-shaped inductor.

Abstract: The present disclosure provides an apparatus for automatically programming a robot to follow the contour of an object. One exemplary apparatus includes a 3D perception module for reconstructing a 3D digital model of the surface of objects and a planning software module for generating a path using said 3D digital model for a robot to follow. One aspect of this disclosure provides methods for sensing the geometry of a surface, reconstructing its 3D model, and creating paths for a robot to traverse along the surface.

Abstract: An electronic device is provided. The electronic device includes a first substrate, a second substrate, a first transistor and a second transistor. The second substrate is disposed on the first substrate. The first transistor is disposed on the first substrate and includes a first semiconductor layer. The second transistor is disposed on the second substrate and includes a second semiconductor layer. The first semiconductor layer includes a first channel. The second semiconductor layer includes a second channel. The width-to-length ratio of the first channel is different from the width-to-length ratio of the second channel.

Abstract: A turbocharger air intake silencer with adjustable cavity space structures is provided. The turbocharger air intake silencer comprises a silencer connecting flange and a first resonator device. The first resonator device comprises a first silencer sealing plate, a first annular sound absorption cavity body, a first rotary table, a first rotary steering gear and a first valve. A first sound absorption cavity is enclosed by the first silencer sealing plate, the first annular sound absorption cavity body, the first valve and the first rotary table. A first sound absorption cavity inlet pipe is arranged beside the first sound absorption cavity. The first sound absorption cavity and the first sound absorption cavity inlet pipe form a Helmholtz resonator. The first rotary steering gear is mounted on the silencer connecting flange. The rotary steering gear is connected with a first rotary rack.

Abstract: The present disclosure provides a semiconductor device includes a semiconductor substrate, a first metal plug, a second metal plug, a third metal plug, a fourth metal plug, and a boron nitride layer. The first metal plug and the second metal plug are disposed over a pattern-dense region of the semiconductor substrate. The third metal plug and the fourth metal plug are disposed over a pattern-loose region of the semiconductor substrate. The boron nitride layer is disposed over the semiconductor substrate. Each of the first metal plug and the second metal plug includes a barrier layer and a conductive feature. The barrier layer is contact with the semiconductor substrate. The conductive feature is disposed over the barrier layer. The conductive feature is separated from the semiconductor substrate by the barrier layer.

Abstract: A well cover assembly includes a monitoring device and a well cover. The well cover includes a first protrusion and a second protrusion. A through hole is defined on the well cover and surrounded by the second protrusion. The monitoring device can be installed on the well cover. The monitoring device includes a monitoring terminal and a fixing bracket. The fixing bracket includes a first bracket and a second bracket. One end of the first bracket is fixed to the monitoring terminal, and another end can protrude from the through hole. The second bracket is connected to the end of the first bracket protruding from the through hole, the second bracket can extend from the end of the first bracket toward an edge of the second protrusion and toward the first protrusion. The second bracket further can clamp with each of the second protrusion and the first protrusion.

Abstract: Provided are an attenuated virus of a flavivirus virus and the use thereof. The attenuated virus comprises a polyadenylic acid (poly(A)) sequence, wherein the polyadenylic acid (poly(A)) is used for replacing a part of the nucleotide sequence of a 3? untranslated region (3?UTR) of the flavivirus virus, so that the 3? untranslated region (3?UTR) of the attenuated virus obtained after the part of the nucleotide sequence of the flavivirus virus is replaced at least retains a 3?-end stem loop region (3?SL). The attenuated virus can be used for preparing safe and effective attenuated vaccine strains.

Abstract: A reconfigurable intelligent surface includes a radiant layer, a sensing feeding circuit layer, a processing layer and a controlling circuit layer. The radiant layer includes at least two antennas and a plurality of reflecting units. Each of the at least two antennas is configured for sensing a polarization, a frequency or a direction angle of an incident electromagnetic wave. The reflecting units are arranged to form a reflecting surface. The sensing feeding circuit layer is signally connected to the antennas. The processing layer is signally connected to the sensing feeding circuit layer, and the processing layer is configured to produce a controlling signal corresponding thereto. The controlling circuit layer is signally connected to the radiant layer and the processing layer, wherein the controlling circuit layer receives the controlling signal and controls the reflecting units according to the controlling signal to adjust and form a reflecting electromagnetic wave.

Abstract: An electronic device may include a display panel configured to produce light and a lens assembly that receives the light from the display panel. The lens assembly may include a first lens and a second lens. The second lens may be a removable lens that is configured to be selectively attached to the lens assembly. The lens assembly may also include a partially reflective mirror that is interposed between the first lens and the display panel, a reflective polarizer that is interposed between the first lens and the second lens when the second lens is attached to the lens assembly, and a quarter wave plate that is interposed between the reflective polarizer and the second lens when the second lens element is attached to the lens assembly.

Abstract: Disclosed are a silicon nitride ceramic sintered body and a-preparation method thereof. The silicon nitride ceramic sintered body includes a sintered bulk and a hard surface layer having a thickness of 10-1000 ?m, formed on a surface of the sintered bulk, wherein the sintered bulk comprises a first silicon nitride crystalline phase and a first grain boundary phase; the hard surface layer comprises a second silicon nitride crystalline phase and a second grain boundary phase; the first grain boundary phase comprises a metal tungsten phase being tungsten elementary substance and/or a tungsten alloy; the second grain boundary phase comprises tungsten carbide particles; tungsten element in the metal tungsten phase accounts for 80-100 wt % of total tungsten element in the first grain boundary phase; and tungsten element in the tungsten carbide particles accounts for 60-100 wt % of total tungsten element in the second grain boundary phase.

Abstract: Provided is a heat pipe, which has a simple construction but an excellent heat transfer performance. A loop-type heat pipe (1) has a loop-shaped fluid moving route, in which an evaporation portion (2), a vapor-rich pipe portion (4), a condensation portion (3) and a liquid-rich pipe portion (5) are sequentially connected. A nozzle portion (6) and a diffuser portion (7) are formed in that loop-shaped fluid moving route. As a result, a difference is made between the forward fluid resistance and the backward fluid resistance of the loop-shaped fluid moving route, thereby to form a one-directional steam flow in the loop-shaped fluid moving route.

Abstract: Disclosed is a preparation method of double-layer carbon-paper base paper with high uniformity and gradient pores, including adding carbon fibers to alkali lignin aqueous solution for treatment, controlling the alkali lignin aqueous solution to reach subcritical water conditions, and modifying the carbon fibers by sodium phenol reactive groups under the subcritical water conditions of the alkali lignin, for improving hydrophilic groups on a surface of the carbon fibers and a surface rough structure; further, modifying the carbon fibers to produce carbon nanotube clusters on the surface of the carbon fibers to obtain surface-thermally-modified carbon fibers, and adding the surface-thermally-modified carbon fibers to a dispersant for dispersion, stirring together with auxiliary materials to prepare a mixed slurry, and preparing the mixed slurry into the carbon-paper base paper by wet forming process.

Abstract: A keyboard module is provided, which includes a membrane circuit board, a base plate and a waterproof breathable film. The membrane circuit board has an air channel and at least one air hole communicating with the air channel and exposed from a lower surface of the membrane circuit board. The base plate is disposed beneath the membrane circuit board, in which the base plate has a first opening through the base plate and communicating with the air hole. The waterproof breathable film is disposed beneath the base plate and covers the first opening.

Abstract: Provided are a display panel and a method for manufacturing the same, and a display device. The display panel includes: a base substrate including a display area and a peripheral area; a separator located at the peripheral area and including at least one separation portion, each separation portion including a first and a second separation layer, and the orthographic projection of the first separation layer on the base substrate is within that of the second separation layer; a cathode including: a first cathode portion, and a second cathode apart from the first cathode portion; and an encapsulation layer including a first and a second inorganic layer, and an organic layer located between the first and the second inorganic layer, wherein edges of the orthographic projections of the first inorganic layer, the organic layer, and the second inorganic layer on the base substrate overlap.

Abstract: A collapsible pyramid holographic projection imager includes a pyramid imaging member and a bottom fixing member, where the pyramid imaging member includes two support plates and a holographic projection film; a middle of the support plate is shaped as a crisscross framework; the holographic projection film is fixed between the two support plates; four pre-cuts are formed in the bottom fixing member; in response to a collapsed state of the collapsible pyramid holographic projection imager, the pyramid imaging member and the bottom fixing member are placed independently in a sheet manner; and in response to an expanded state of the collapsible pyramid holographic projection imager, the collapsible pyramid holographic projection imager assists an image generation device, and a video or an image played by the image generation device is projected to the collapsible pyramid holographic projection imager to form a three-dimensional (3D) image.

Abstract: A method includes receiving a silicon substrate; forming a first doped region and a second doped region in the silicon substrate; forming a third doped region and fourth doped region on upper portions of the first doped region and the second doped region, respectively; and patterning the silicon substrate to form an optical modulator. The optical modulator includes: a first section; a second section and a third section at least formed from the first and second doped regions, respectively; a fourth section, including a first height less than that of the first section and the second section and arranged between the first section and the second section, the fourth section being an undoped region; and a fifth section immediately adjacent to the fourth section, the fifth section including a height less than that of the first section and the second section and different from the first height.

Abstract: In one embodiment, an apparatus comprises a processor to: receive a request to configure a secure execution environment for a first workload; configure a first set of secure execution enclaves for execution of the first workload, wherein the first set of secure execution enclaves is configured on a first set of processing resources, wherein the first set of processing resources comprises one or more central processing units and one or more accelerators; configure a first set of secure datapaths for communication among the first set of secure execution enclaves during execution of the first workload, wherein the first set of secure datapaths is configured over a first set of interconnect resources; configure the secure execution environment for the first workload, wherein the secure execution environment comprises the first set of secure execution enclaves and the first set of secure datapaths.

Abstract: A semiconductor package includes a first tier and a second tier underlying the first tier and including TIVs and third dies. The first tier includes a first redistribution structure and first and second dies disposed side-by-side and separated by a first insulating encapsulation. A surface of the first insulating encapsulation, surfaces of first die connectors of the first die, and truncated spherical surfaces of second die connectors of the second die are level. The first redistribution structure underlies the surfaces of the first insulating encapsulation and the first die connectors and the truncated spherical surfaces of the second die connectors. The third dies disposed below the first redistribution structure are electrically coupled to the first die through the first redistribution structure and laterally covered by a second insulating encapsulation. The TIVs penetrate through the second insulating encapsulation and are electrically coupled to the second die through the first redistribution structure.

Abstract: A complementary current-steering digital-to-analog converter (DAC) including a p-type DAC as well as an n-type DAC is shown. The p-type DAC has p-type current sources, and the n-type DAC has n-type current sources. The p-type and n-type current sources are coupled to a first input terminal or a second input terminal of a transimpedance amplifier (TIA) according to the digital input of the complementary current-steering DAC. In response to the digital input changing from a first value to a second value that is greater than the first value, one or more n-type current sources connected to the second input terminal of the TIA are switched so that they are connected to the first input terminal of the TIA.

Abstract: A transport container includes a body. The transport container further includes a first securing mechanism coupled to the body. The first securing mechanism is configured to couple the body to a second securing mechanism of an attachment point. The transport container further includes a controller configured to receive a request for coupling. The controller is configured to authenticate the request for coupling responsive to receiving the request for coupling. The controller is further configured to, responsive to authenticating the request for coupling, initiate coupling between the first securing mechanism and the second securing mechanism. The coupling includes locking a first locking structure of the first securing mechanism to a first attachment structure of the second securing mechanism.