Abstract: A process and apparatus for cleaning a wafer, the wafer having a front side and a back side, are provided. The process begins with placing the wafer on a platform, and a first gas stream delivering in a direction from a center to an edge of the front side of the wafer. The first gas stream prevents liquid drops entering a work piece region on the front side of the wafer and protects the integrity of the integrated circuits. A cleaning brush is rinsed by a first liquid stream and contacting the edge of the wafer for cleaning the wafer. The cleaning brush scrubs unwanted residual materials from the edge of the wafer, and the first liquid stream flushes the cleaning brush to recover the cleaning ability.

Abstract: Among other things, one or more techniques and systems for cleaning a scrub brush of a scrubber utilized in semiconductor fabrication are provided. In particular, a charge modification element, such as a base pH material or ammonia, is applied to the scrub brush to modify a charge of a particle on the scrub brush to a modified charge. The modified charge of the particle is similar to a charge of the scrub brush, such that the particle and the scrub brush repel one another. The particle can be detached from the scrub brush utilizing various techniques such as a de-ionized water technique or a mechanical cleaning bar technique. In this way, one or more particles can be detached from the scrub brush to clean the scrub brush of particles so that the scrub brush can be used to clean a semiconductor wafer.

Abstract: A process and apparatus for cleaning a wafer, the wafer having a front side and a back side, are provided. The process begins with placing the wafer on a platform, and a first gas stream delivering in a direction from a center to an edge of the front side of the wafer. The first gas stream prevents liquid drops entering a work piece region on the front side of the wafer and protects the integrity of the integrated circuits. A cleaning brush is rinsed by a first liquid stream and contacting the edge of the wafer for cleaning the wafer. The cleaning brush scrubs unwanted residual materials from the edge of the wafer, and the first liquid stream flushes the cleaning brush to recover the cleaning ability.

Abstract: A composite radar absorption structure with a thin shell type and a method for manufacturing the same are provided. The composite radar absorption structure at lease comprising a continuous fibrous material and a plurality of filling mediums, wherein the plurality of filling mediums are uniformly distributed over the surface perpendicular to the thickness direction in the continuous fibrous material; and a volume percentage of the plurality of filling mediums are between 10 vol. % and 25 vol. % of the continuous fibrous material.