Abstract: A stress modulating device including a semiconductor substrate, a first insulating layer formed over a first side of the semiconductor substrate, a second insulating layer formed over the first insulating layer, a third insulating layer formed over a second side of the semiconductor substrate, a fourth insulating layer formed over the third insulating layer, and a fifth insulating layer formed over the fourth insulating layer for incorporation in multi-stack package assemblies for reducing stress, strain, and/or warpage on the active elements within the package assembly.

Abstract: A silicone composition having anti-microbial properties contains well distributed silica and nanoparticles of a noble metal. Silica and nanoparticles of a noble metal are added to liquid vinyl-terminated polydimethylsiloxane. A coupling agent is then added to the mixture and heated, the coupling agent comprising trialkoxysilane having a formula R1Si(OR2)3, wherein R1 is vinyl or allyl, and R2 is an alkyl radical having from 1 to 3 carbon atoms. In one embodiment, trimethylsiloxy terminated polymethylhydrosiloxane is then added to the mixture and heated in the presence of a catalyst so as to cross-link and cure the same into a silicone elastomer. In another embodiment, in place of the trimethylsiloxy terminated polymethylhydrosiloxane, a peroxide is added to mixture and heated to form the silicone. In this later example, no catalyst is needed.

Abstract: A multifunctional cooking apparatus includes a parabolic-like cooking pot and dome-like cover. A heating element is embedded either in the wall of the cover or the wall of the cooking pot to provide heat transfer respectively. The cooking pot have an opening to create a cooking recess with a parabolic inner wall, and the cover have an opening and formed as a dome-like inner wall, so that the cooking pot and the cover are generally formed as a spherical-like or oval-like cooking chamber by which to concentrate the heat energy therein and cooking food in a variety of ways at a minimal cost, such as baking, steaming, deep-frying, boiling or simmering mode.

Abstract: A cushioning material is disclosed having at least two layers of unwoven, temperature-resistant staple fibers and layers of reinforcing scrim between the unwoven layers, wherein the entire structure is needlepunched for integrity and one face is embossed with a pattern to increase resiliency.