Abstract: A lamp holder structure of the present invention is comprised of: a cup-shaped base; a circuit board and two elastic conducting devices mounted inside the cup-shaped base; and at least one light-emitting device mounted on the circuit board, wherein first ends of the elastic conducting devices are mounted under the circuit board for connection with the circuit board, and second ends of the elastic conducting devices are extended outside of the cup-shaped base, whereby the lamp holder structure can be supplied with electric power via the elastic conducting devices for providing illumination.

Abstract: A lighting device includes a control circuit board and a plurality of light-emitting diodes. The light-emitting diodes are electrically connected to the control circuit board and each light light-emitting diode includes at least a red-light chip, a blue-light chip, and a green-light chip. The control circuit board forms a control circuit that includes a band switch. Operation of the band switch allows switching of the light-emitting diodes among emission of light of different preset colors.

Abstract: The present invention relates to a night light type switch assembly, which comprises a base, a cover, a circuit board, a switch pushbutton, a sensor and at least one LED. The circuit board is mounted on the inside of the base, and electrically connected to the switch pushbutton. The circuit board is electrically connected to the sensor and the at least one LED to form a loop. The cover is located to cover the base.

Abstract: An adjustable illumination device comprises a control circuit board, several light-emitting diodes connected to the control circuit board, and a color sensor electrically connected to the control circuit board, wherein every light-emitting diode comprises at least a red chip, at least a blue chip, and at least a green chip, and the color sensor detects and adjusts the light-emitting diodes so as to obtain required light color and maintain stable light color.

Abstract: A light-emitting diode comprises: a coupling base; several light-emitting chips; and an adhesive for sealing the coupling base, wherein the coupling base has a coupling part and at least two frame pairs mounted therein. The light-emitting chips are fixed on the coupling part. The light-emitting chips are electrically connected with these two frame pairs, which are controlled by two control terminals simultaneously.

Abstract: A light-emitting device comprises: a coupling base, at least one light-emitting chip, a layer of glue, and a lens, wherein the coupling base is designed for coupling with at least one light-emitting chip. The light-emitting chip is electrically connected with a plurality of frames mounted inside the coupling base. The lens has a convex bottom. The glue is filled into the coupling base, and the lens is located on the glue, which is not yet dry. As a result, no bubble is formed on the contact junction between the lens and the glue after the glue is dry. Accordingly, the problems including poor refraction and poor transparency caused by the bubbles can be improved effectively.

Abstract: A novel red fluorescent powder of the following formula (I): AB(MO4)2??(I) wherein A is independently Li+, Na+, K+, Rb+, Cs+, or Ag+; B is Europium of trivalent rare-earth ion (Eu3+); and M is molybdenum (Mo) or tungsten(W). The red fluorescent powder prepared by a solid-state method is used in light emitted diodes (LED), particular in white light LEDs. It has strong absorption in the near-UV wavelength of 360 nm to 420 nm, improved luminescence intensity than commercially available, high color purity, luminescent efficiency, and excellent chemical stability.

Abstract: A high brightness light emitting diode (LED) includes a base, a reflector cap, LED dices, a plastic layer, a lens, and a silicon rubber layer. Conductive terminals extend from the base for connection with an external power source. The base defines a bore receiving the cap with a bottom of the cap exposed. The cap forms a cavity receiving the LED dices, which are electrically connected to the conductive terminals. The plastic layer comprising PPA, LCP, or engineer plastics is filled in the cavity o with ends of the terminals extending beyond the plastic layer. The lens is positioned over the plastic layer and has projections that snugly fit over and engage the base. The silicon rubber layer is interposed between the lens and the base. With such an arrangement, lights from the LED dices can be mixed twice for enhanced uniformity of brightness of the light distribution.

Abstract: A white light LED (light emitting diode) is disclosed. The white light LED comprises: a bracing frame; at least an UV (or a blue light) chip mounted on the bracing frame; and a flat thin film stacked on the UV chip and formed by mixing a main agent and a solute uniformly for having uniform thickness and homogenized fluorescent powder, thereby forming the uniform white light free of photochromic difference or halation by passing the UV light emitted from the UV chip through the thin film.

Abstract: A light emitting diode is disclosed. A light emitting diode comprises: a bracing frame; and at least two chips stacked on the bracing frame in a chip-on-chip stacking manner. The light emitting diode for uniform color mixing is completed after each of said at least two chips is electrically connected.

Abstract: A sideway-emission light emitting diode includes a light emitting diode package comprised of a light emitting diode dice that gives off light and a lens that is positioned in front of a front end face of the package for receiving the light and redirecting the received light toward a circumference of the package and a light guide comprised of a board defining a cavity to receive and retain the light emitting diode package therein. The board has opposite sides each forming a cut-off delimited by opposite inclined edges, a refraction section extending from each inclined edge, and a projection section formed between opposite refraction sections, whereby light transmitting into the light guide is directed, by means of the reflection/refraction by the inclined edges, the refraction sections and the projection sections, toward and projected from the projection sections in sideway directions.

Abstract: A solid-state semiconductor light emitting device is disclosed. A heat sink that comprises a receiving cup for receiving a chip is provided. A leadframe that comprises a connection base is mounted above the heat sink, wherein the chip is connected to the leadframe via a metal wire and a resin or silicone is applied to cover all of them so as to form the a light emitting device that emits light. In the leadframe, two holders that include two top sides on their two top portions are opposite to one another, and a holder having holes is mounted between these two top sides. The holder having the holes is connected to one of these two opposite holders. A plastic material is applied to mold the three holders into the connection base for receiving the receiving cup of the heat sink. As a result, the heat sink provides with good heat-dissipating efficacy and each holder of the leadframe also provides with heat-dissipating efficacy and enhances connection stability as well.

Abstract: A side-emitting solid-state semiconductor light emitting device (light emitting diode) comprises a light emitting diode package and a lens, wherein the lens is mounted on the front surface of the light emitting diode package to receive the light emitted from the light emitting diode and redirect the received light by use of a reflecting part to project the light on the peripheral surface of the light emitting diode package. This peripheral surface is designed to provide various changes and the side-emitting light is changed according to the changes of the peripheral surface.

Abstract: A solid-state semiconductor light emitting device is disclosed. A heat sink that comprises a receiving cup for receiving a chip is provided. A leadframe that comprises a connection base is mounted above the heat sink, wherein the chip is connected to the leadframe via a metal wire and a resin or silicone is applied to cover all of them so as to form the a light emitting device that emits light. In the leadframe, two holders that include two top sides on their two top portions are opposite to one another, and a holder having holes is mounted between these two top sides. The holder having the holes is connected to one of these two opposite holders. A plastic material is applied to mold the three holders into the connection base for receiving the receiving cup of the heat sink. As a result, the heat sink provides with good heat-dissipating efficacy and each holder of the leadframe also provides with heat-dissipating efficacy and enhances connection stability as well.

Abstract: A high brightness light emitting diode (LED) includes a base, a reflector cap, LED dices, a plastic layer, a lens, and a silicon rubber layer. Conductive terminals extend from the base for connection with an external power source. The base defines a bore receiving the cap with a bottom of the cap exposed. The cap forms a cavity receiving the LED dices, which are electrically connected to the conductive terminals. The plastic layer comprising PPA, LCP, or engineer plastics is filled in the cavity o with ends of the terminals extending beyond the plastic layer. The lens is positioned over the plastic layer and has projections that snugly fit over and engage the base. The silicon rubber layer is interposed between the lens and the base. With such an arrangement, lights from the LED dices can be mixed twice for enhanced uniformity of brightness of the light distribution.

Abstract: A sideway-emission light emitting diode includes a light emitting diode package comprised of a light emitting diode dice that gives off light and a lens that is positioned in front of a front end face of the package for receiving the light and redirecting the received light toward a circumference of the package and a light guide comprised of a board defining a cavity to receive and retain the light emitting diode package therein. The board has opposite sides each forming a cut-off delimited by opposite inclined edges, a refraction section extending from each inclined edge, and a projection section formed between opposite refraction sections, whereby light transmitting into the light guide is directed, by means of the reflection/refraction by the inclined edges, the refraction sections and the projection sections, toward and projected from the projection sections in sideway directions.

Abstract: A light emitting diode (LED) includes a base, a reflector cup, a plurality of LED dices, a plastic layer, and a glass lens. External terminals are mounted in the base. The reflector cup is received and fixed in the base and forms a recess in which the dices are received and fixed. The dices are connected by conductors to the external terminals. The plastic layer is filled in the base to seal the reflector cup, the dices, the conductors, and portions of the external terminals. A bottom of the reflector cup is exposed outside the plastic layer and the external terminals extend beyond the plastic layer. The lens is made of glass containing fluorescent powders and is positioned on the plastic layer at a position corresponding to the dices. The glass lens that has a high melting point offers an excellent heat resistance and thus enhances the life span and reliability of the LED.

Abstract: A light emitting diode includes first and second electrical terminals of which the first terminal forms a support. A light emitting diode die is mounted on the support of the first terminal and is connected to the second terminal by a conductive wire for emitting a first light. An encapsulation is formed around the die. A phosphor layer is formed on the support and interposed between the die and the support. The phosphor receives a portion of the first light and in turn gives off a second light that is selectively different from the first light for combining with the first light that travels out of the encapsulation to control brightness and color of the light projecting out of the encapsulation. Thus, a stable lighting may be achieved and mass production of quality-controlled light emitting diodes is made possible.

Abstract: A tubular light includes a light set having a substrate with light emitting diodes mounted on the substrate so as to electrically connect to the substrate, a tubular cover made of a translucent material, the tubular cover having a receiving space defined therein, a positioning seat formed to securely receiving the substrate in the receiving space, and a securing device securely engaged with the tubular cover and adapted to securely engage to a surface.

Abstract: A light emitting diode (LED) lamp includes an LED module having a base plate made of metals The base plate includes a first section and a second section isolated from each other and respectively connected to positive and negative terminals of a power source. A number of LED units is mounted to and mechanically supported by the base plate. Each LED unit includes a light emitting chip mounted on a support frame having positive and negative tabs both having predetermined surface areas and soldered to the first and second sections of the base plate whereby electrical connection is formed between the positive and negative tabs of the LED unit and the first and second sections of the base plate.