Abstract: A heat sink used in an interface card includes a supporting base, a first heat-dissipating body and a second heat-dissipating body. The supporting base has a side. The first heat-dissipating body is mounted on the supporting base. The first heat-dissipating body is constituted of a plurality of overlapping heat-dissipating pieces. The heat-dissipating pieces are arranged obliquely with respect to the side. The second heat-dissipating body overlaps on the first heat-dissipating body. The second heat-dissipating body comprises a plurality of heat-dissipating pieces. Via the above arrangement, the heat-dissipating efficiency of the interface card can be increased and the lifetime thereof can be extended.

Abstract: A heat sink used in an interface card includes a supporting base, a first heat-dissipating body and a second heat-dissipating body. The supporting base has a side. The first heat-dissipating body is mounted on the supporting base. The first heat-dissipating body is constituted of a plurality of overlapping heat-dissipating pieces. The heat-dissipating pieces are arranged obliquely with respect to the side. The second heat-dissipating body overlaps on the first heat-dissipating body. The second heat-dissipating body comprises a plurality of heat-dissipating pieces. Via the above arrangement, the heat-dissipating efficiency of the interface card can be increased and the lifetime thereof can be extended.

Abstract: An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions configured to contact the circuit board. The heatsink attachment assembly further includes a heatsink clip configured to concurrently (i) fasten to the anchors when the anchors secure to the circuit board, and (ii) hold a heatsink to against a circuit board component of the circuit board. The looped end portions of the legs prevent the legs from completely passing through holes defined in the circuit board. In some situations, the looped end portions define extended coils (e.g., double loops) for a robust interference fit with the circuit board as well as for enhanced strength and stability.

Abstract: An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions configured to contact the circuit board. The heatsink attachment assembly further includes a heatsink clip configured to concurrently (i) fasten to the anchors when the anchors secure to the circuit board, and (ii) hold a heatsink to against a circuit board component of the circuit board. The looped end portions of the legs prevent the legs from completely passing through holes defined in the circuit board. In some situations, the looped end portions define extended coils (e.g., double loops) for a robust interference fit with the circuit board as well as for enhanced strength and stability.