Patents by Inventor Yuan-Chi CHIEN

Yuan-Chi CHIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of processing semiconductor substrate
    Patent number: 11107671
    Abstract: A method includes disposing a semiconductor substrate over a chuck. The chuck has a plurality of holes therein. The semiconductor substrate has a first surface facing the chuck and a second surface opposite thereto. A liquid layer is formed flowing over a top surface of the chuck by supplying liquid to the top surface of the chuck through the holes of the chuck. The semiconductor substrate is moved toward the chuck such that the first surface of the semiconductor substrate is in contact with the liquid layer and the liquid layer flows between the first surface of the semiconductor substrate and the top surface of the chuck.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: August 31, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih Hsu, Kai-Lin Chuang, Yuan-Chi Chien, Jeng-Huei Yang, Jun-Xiu Liu
  • METHOD OF PROCESSING SEMICONDUCTOR SUBSTRATE
    Publication number: 20190252181
    Abstract: A method includes disposing a semiconductor substrate over a chuck. The chuck has a plurality of holes therein. The semiconductor substrate has a first surface facing the chuck and a second surface opposite thereto. A liquid layer is formed flowing over a top surface of the chuck by supplying liquid to the top surface of the chuck through the holes of the chuck. The semiconductor substrate is moved toward the chuck such that the first surface of the semiconductor substrate is in contact with the liquid layer and the liquid layer flows between the first surface of the semiconductor substrate and the top surface of the chuck.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih HSU, Kai-Lin CHUANG, Yuan-Chi CHIEN, Jeng-Huei YANG, Jun-Xiu LIU
  • Apparatus of processing semiconductor substrate
    Patent number: 10269557
    Abstract: An apparatus of processing a semiconductor substrate include a chuck, a holder, a liquid supplying system and a positive pressure unit. The chuck has a principal surface and at least a hole formed thereon. The holder is capable of holding a semiconductor substrate at a position above the principal surface. The liquid supplying system is configured to provide a liquid film onto the principal surface through the hole. The positive pressure unit is configured for providing a gas flow to a space over the chuck. A method of processing a semiconductor substrate is disclosed herein as well.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: April 23, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih Hsu, Kai-Lin Chuang, Yuan-Chi Chien, Jeng-Huei Yang, Jun-Xiu Liu
  • APPARATUS OF PROCESSING SEMICONDUCTOR SUBSTRATE
    Publication number: 20170110315
    Abstract: An apparatus of processing a semiconductor substrate include a chuck, a holder, a liquid supplying system and a positive pressure unit. The chuck has a principal surface and at least a hole formed thereon. The holder is capable of holding a semiconductor substrate at a position above the principal surface. The liquid supplying system is configured to provide a liquid film onto the principal surface through the hole. The positive pressure unit is configured for providing a gas flow to a space over the chuck. A method of processing a semiconductor substrate is disclosed herein as well.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 20, 2017
    Inventors: Wei-Chih HSU, Kai-Lin CHUANG, Yuan-Chi CHIEN, Jeng-Huei YANG, Jun-Xiu LIU