Abstract: The present invention discloses a method for modifying a non-planar electrode, in which a short-chain molecule is used as a connector. The short-chain molecule is an alcohol compound having a thiol group at both ends. Therefore, the thiol groups at both the ends of the short-chain molecule can be separately bonded to a nanoparticle and a surface of an electrode, so that a plurality of nanoparticles are arranged on a surface of a non-planar electrode.

Abstract: An apparatus for segregating electronic components that engages and stops each of a plurality of electronic packages passing down a singulation tube is disclosed. In addition, the segregating apparatus is cable of segregating the electronic packages even though some of them had been linked together during the sealing process. The segregating apparatus includes a first swing arm to clip a electronic component, a second swing arm to clip another electronic component, and a third swing arm to depart the two electronic components, where all of components of the segregating apparatus are driven by a single driving force, reducing the size of the apparatus and the time needed for the segregating process.

Abstract: In the present invention, a feeding apparatus comprising a plurality of feeding mechanisms is provided. The feeding apparatus comprises a power source, a base, a rotating axle, a plurality of feeding mechanisms, a plurality of connecting units and a plurality of fixing units. The power source is driven to rotate the rotating axle, and then the feeding mechanisms are rotated by the rotating axle to proceed feeding process. In addition, the rotation of each of the feeding mechanisms is controlled by the connecting units and the fixing units. However, the feeding mechanisms can be rotated together or individually to proceed feeding process. Therefore, the production capacity is increased by the feeding apparatus, as well as the cost is reduced by decreasing power needed.

Abstract: A testboard with ZIF connectors is disclosed. The testboard comprises a test substrate, a plurality of ZIF connectors and a plurality of detachably adjustable fastening means. Each ZIF connector has a plurality of second through-holes, and pairs of electric terminals are deposed on the bottom of each ZIF connector where each pair of electric terminals has a radial shape for contacting the test substrate. Each fastening means is disposed through the first through-holes and the second through-holes through the middle of each ZIF connector for adjusting the ZIF connectors on the test substrate in better contact and for replacing each ZIF connector on the test substrate with a replacement ZIF connector where the second through-holes are arranged to one another in a spaced interval along a longitudinal direction, and each ZIF connector has a ratio of its longitudinal length to its spaced interval ranging from 3:1 to 5:1.

Abstract: An apparatus for segregating electronic components that engages and stops each of a plurality of electronic packages passing down a singulation tube is disclosed. In addition, the segregating apparatus is cable of segregating the electronic packages even though some of them had been linked together during the sealing process. The segregating apparatus includes a first swing arm to clip a electronic component, a second swing arm to clip another electronic component, and a third swing arm to depart the two electronic components, where all of components of the segregating apparatus are driven by a single driving force, reducing the size of the apparatus and the time needed for the segregating process.

Abstract: A pick-and-place head device with a pushing mechanism for handling electronic components is disclosed in this invention. The pick-and-place head device includes a fixing base connected to a robot arm and a cylinder member disposed on the fixing base, the cylinder member has a first pressure passage, one end of the first pressure passage is connected to a suction member and another end of the first pressure passage is connected to a first pressure source, and the cylinder member is connected to a second pressure source so as to push at least one pushing tip. One of the first pressure source and the second pressure source is controllably selected by a pressure controller at a given time to have a pressure operation so as to enable the suction member to pick up an electronic component or to enable the pushing tip to push the electronic component.

Abstract: This invention discloses a probe card assembly with adjustable ZIF connectors. The probe card assembly comprises a substrate, a plurality of ZIF connectors and a plurality of adjustable fastening means for assembling and disassembling the ZIF connectors on the substrate. The substrate is a disc-like plate, having a first surface, a second surface, a plurality of concave sections disposed on the second surface and a plurality of first through holes perpendicular to the first surface. The first through holes are circularly arranged toward the substrate center. Pairs of first contacts are provided on the first surface adjacent to both sides of first through holes. A plurality of terminals are protruded from the second surface of the substrate for contacting and testing the wafer. The ZIF connectors are also circularly arranged toward the substrate center.

Abstract: A tray to tube manual exchanger is disclosed herein. The manual exchanger includes a tray-fastening module and a bi-axle-rotating module. The tray-fastening module includes a tray-fastening member, a buffer-rail substrate, and a tube-inserting member. The buffer-rail substrate having a plurality of rails is disposed under the tray-fastening member, and the tube-inserting member is disposed at the outlets of the plurality of rails for respectively receiving tubes. The bi-axle-rotating module is pivotally connected to the tray-fastening module. The tray-fastening module clips a tray carrying a plurality of packaged semiconductor devices at a horizontal position, followed by rotating 180 degrees around a second rotating axle of the bi-axle-rotating module, thereby falling the packaged semiconductor devices of each row of the tray onto each rail.

Abstract: An apparatus and a method for monitoring overlapped objects are disclosed. The monitoring apparatus comprises a projection device and a camera for projecting images to a target plane at different angles and shooting the pictures from the target plane. When an object is placed on the target plane, the pictures present the part of the image overlapping the surface of the object for determining whether there are overlapped objects or not.

Abstract: A pick-and-place head device with a pushing mechanism for handling electronic components is disclosed in this invention. The pick-and-place head device includes a fixing base connected to a robot arm and a cylinder member disposed on the fixing base, the cylinder member has a first pressure passage, one end of the first pressure passage is connected to a suction member and another end of the first pressure passage is connected to a first pressure source, and the cylinder member is connected to a second pressure source so as to push at least one pushing tip. One of the first pressure source and the second pressure source is controllably selected by a pressure controller at a given time to have a pressure operation so as to enable the suction member to pick up an electronic component or to enable the pushing tip to push the electronic component.

Abstract: A tray to tube manual exchanger is disclosed herein. The manual exchanger includes a tray-fastening module and a bi-axle-rotating module. The tray-fastening module includes a tray-fastening member, a buffer-rail substrate, and a tube-inserting member. The buffer-rail substrate having a plurality of rails is disposed under the tray-fastening member, and the tube-inserting member is disposed at the outlets of the plurality of rails for respectively receiving tubes. The bi-axle-rotating module is pivotally connected to the tray-fastening module. The tray-fastening module clips a tray carrying a plurality of packaged semiconductor devices at a horizontal position, followed by rotating 180 degrees around a second rotating axle of the bi-axle-rotating module, thereby falling the packaged semiconductor devices of each row of the tray onto each rail.

Abstract: The present invention is directed to apparatus and method of automatically counting the loaded electronic components in a carrier tape. A pair of detectors is arranged respectively above and below the carrier tape, and a counting wheel having teeth on the periphery is operatively coupled to the keyholes of the tape and reel machine. An encoder is utilized having its axis coupled to the counting wheel.

Abstract: The present invention is directed to apparatus and method of adjusting distinct tape feeder. An image detector is arranged above the tape, and a mid-hole detector is utilized to detect the mid-hole of the tape. The image detector and the mid-hole detector are fixed a distance there between, wherein the distance is a common multiple of the various tape pitches.

Abstract: In the present invention, a feeding apparatus comprising a plurality of feeding mechanisms is provided. The feeding apparatus comprises a power source, a base, a rotating axle, a plurality of feeding mechanisms, a plurality of connecting units and a plurality of fixing units. The power source is driven to rotate the rotating axle, and then the feeding mechanisms are rotated by the rotating axle to proceed feeding process. In addition, the rotation of each of the feeding mechanisms is controlled by the connecting units and the fixing units. However, the feeding mechanisms can be rotated together or individually to proceed feeding process. Therefore, the production capacity is increased by the feeding apparatus, as well as the cost is reduced by decreasing power needed.

Abstract: The present invention is directed to apparatus and method of automatically counting the loaded electronic components in a carrier tape. A pair of detectors is arranged respectively above and below the carrier tape, and a counting wheel having teeth on the periphery is operatively coupled to the keyholes of the tape and reel machine. An encoder is utilized having its axis coupled to the counting wheel.

Abstract: A plasma display panel with a plurality of non-transparent display electrode pairs and a method of forming the same. Each electrode of every non-transparent display electrode pair is separated from but close to one another for effective discharging. For effective displaying, it is necessary that the area of the non-transparent display electrodes is smaller than the area of the panel. In the present invention, the shape of the non-transparent display electrodes are manufactured in a shape with a plurality of openings, such as a ladder or a chain.

Abstract: A driving electrode structure of a plasma display panel is described. The driving electrode structure has a driving electrode located in one luminant cell of each pixel. The driving electrode is formed on a transparent electrode and separated by a distance from the side of the transparent electrode adjacent to the edge of the luminant cells. The driving electrode has two branches coupled to a main electrode or a side electrode at the side of the transparent electrode adjacent to the edge of luminant cells. The driving electrode approximates the discharge center of the luminant cell to improve the driving characteristic.

Abstract: The present invention provides a method for improving the adhesion capability between the ?-type bus electrode and ITO (indium tin oxide) transparent conductive layer. The method includes an ITO transparent conductive layer as an ITO electrode is formed on the glass substrate by sputtering method. Then, a photoresist layer with a cavity pattern is formed on the portion of the ITO transparent conductive film. Next, an etching process is used to remove portion of the ITO transparent conductive film to form a cavity within the ITO transparent conductive film. Then, after removing the photoresist layer, a silver paste as a bus electrode is formed on the glass substrate and on the ITO transparent conductor film to form a pi (?) type bus electrode by print method.

Abstract: A method for forming a patterned ITO structure by using a photosensitive ITO solution is provided. By mixing both the ITO and photosensitive material to form a photosensitive ITO solution on a substrate, a patterned ITO structure is available by directly exposing and developing the photosensitive ITO layer. Significantly, no photo-resist layer is required.