Abstract: The present disclosure provides a probe assembly and a probe structure thereof. The probe structure includes a first base part, a second base part, a connecting part, and a contacting part. The first base part includes a first contacting segment and a first connecting segment. The first contacting segment includes a first abutting portion and a first side end portion connected to the first abutting portion. The second base part includes a second contacting segment, a second connecting segment, and a passive component disposed between the second contacting segment and the second connecting segment. The second contacting segment includes a second abutting portion and a second side end portion connected to the second abutting portion. The first connecting segment and the second connecting segment are connected to the connection part. The contacting portion is connected to the connection part.

Abstract: A probe component and a probe structure thereof are provided. The probe structure includes a first contacting segment, a first connecting segment, a second connecting segment and a second contacting segment. The first contacting segment has an abutting portion and a first end portion connected to the abutting portion. The first connecting segment is connected to the first contacting segment. The second connecting segment is connected to the first connecting segment. The second contacting segment is connected to the second connecting segment and has a second end portion.

Abstract: The present disclosure provides a probe assembly and a probe structure thereof. The probe structure includes a first base part, a second base part, a connecting part, and a contacting part. The first base part includes a first contacting segment and a first connecting segment. The first contacting segment includes a first abutting portion and a first side end portion connected to the first abutting portion. The second base part includes a second contacting segment, a second connecting segment, and a passive component disposed between the second contacting segment and the second connecting segment. The second contacting segment includes a second abutting portion and a second side end portion connected to the second abutting portion. The first connecting segment and the second connecting segment are connected to the connection part. The contacting portion is connected to the connection part.

Abstract: A probe component and a probe structure thereof are provided. The probe structure includes a first contacting segment, a first connecting segment, a second connecting segment and a second contacting segment. The first contacting segment has an abutting portion and a first end portion connected to the abutting portion. The first connecting segment is connected to the first contacting segment. The second connecting segment is connected to the first connecting segment. The second contacting segment is connected to the second connecting segment and has a second end portion.

Abstract: A stack type test interface board assembly is provided herein, which comprises: a space transform board having a narrow pitch transform board and a wide pitch transform board, a plurality of first connection nodes disposed on a side of the narrow pitch transform board to be electrically connected to a finished or semi-finished semiconductor product, a plurality of second connection nodes disposed on a side of the wide pitch transform board, and a printed circuit board where a side thereof is electrically connected to the plurality of the second connection nodes. The narrow pitch transform board and the wide pitch transform board are assembled in perpendicular stack into the space transform board. A pitch between each two of the plurality of the first connection nodes is smaller than a pitch between each two of the plurality of the second connection nodes.

Abstract: Disclosed is a multilayer interposer with high bonding strength, which is used in wafer testing. The multilayer interposer with high bonding strength comprises a plurality of thin-film layer structures overlapping sequentially. One of the thin-film layer structures comprises at least one first conductive blind via. An interconnection layer electrically connected to the first conductive blind via is configured on the surface of the one of the thin-film layer structures, and the interconnection layer comprises at least one head portion. Another one of the thin-film layer structures comprises at least one second conductive blind via. The bottom of the second conductive blind via contacts both of the corresponding head portion and part of the surface of the one of the thin-film layer structures. Thereby, the bonding strength between layers can be dramatically increased, and the resistance to the thermal shock can be also increased.

Abstract: A fine pitch interposer structure includes a Multi-core base substrate and a plurality of buildup laminates. A surface of each Multi-core base substrate has a first circuit layer, and a second circuit layer which is electrically connected to the first circuit layer. The buildup laminates are stacked on the surface of the Multi-core base substrate. Each buildup laminate includes a photosensitive dielectric layer, and a plurality of blind vias with a pre-determined interval therebetween which are correspondingly arranged on each of the plurality of vias formed on the photosensitive dielectric layer. The blind vias are electrically connected to the first circuit layer. At least one blind via of one buildup laminate is superimposed on another blind via of another buildup laminate.