Abstract: A semiconductor device includes a metal-insulator-metal (MIM) capacitor. The MIM capacitor includes: electrodes including one or more first electrodes and one or more second electrodes; and one or more insulating layers disposed between adjacent electrodes. The MIM capacitor is disposed in an interlayer dielectric (ILD) layer disposed over a substrate. The one or more first electrodes are connected to a side wall of a first via electrode disposed in the ILD layer, and the one or more second electrodes are connected to a side wall of a second via electrode disposed in the ILD layer. In one or more of the foregoing or following embodiments, the one or more insulating layers include a high-k dielectric material.

Abstract: A device structure, along with methods of forming such, are described. The device structure includes a structure, a first passivation layer disposed on the structure, a buffer layer disposed on the first passivation layer, a barrier layer disposed on a first portion of the buffer layer, a redistribution layer disposed over the barrier layer, an adhesion layer disposed on the barrier layer and on side surfaces of the redistribution layer, and a second passivation layer disposed on a second portion of the buffer layer. The second passivation layer is in contact with the barrier layer, the adhesion layer, and the redistribution layer.

Abstract: A venting device includes a first flap, which is configured to be actuated to swing upward during a rising time, and a second flap, which is disposed opposite to the first flap and configured to be actuated to swing downward during a falling time, a first actuating portion disposed on the first flap, and a second actuating portion disposed on the second flap. The venting device configured to form a vent is disposed within a wearable sound device or to be disposed within the wearable sound device. The vent is formed via applying a first voltage to the first actuating portion and applying a second voltage on the second actuating portion, such that the venting device gradually forms the vent.

Abstract: A device structure, along with methods of forming such, are described. The device structure includes a structure, a first passivation layer disposed on the structure, a buffer layer disposed on the first passivation layer, a barrier layer disposed on a first portion of the buffer layer, a redistribution layer disposed over the barrier layer, an adhesion layer disposed on the barrier layer and on side surfaces of the redistribution layer, and a second passivation layer disposed on a second portion of the buffer layer. The second passivation layer is in contact with the barrier layer, the adhesion layer, and the redistribution layer.

Abstract: A semiconductor device includes first and second metal-insulator-metal structures. The first metal-insulator-metal structure includes a first bottom conductor plate, a first portion of a first dielectric layer, a first middle conductor plate, a first portion of a second dielectric layer, and a first top conductor plate stacked up one over another. The second metal-insulator-metal structure includes a second bottom conductor plate, a second portion of the first dielectric layer, a second middle conductor plate, a second portion of the second dielectric layer, and a second top conductor plate stacked up one over another. In a cross-sectional view, the first bottom conductor plate is wider than the first middle conductor plate that is wider than the first top conductor plate, and the second bottom conductor plate is narrower than the second middle conductor plate that is narrower than the first top conductor plate.

Abstract: A motherboard having a smart charging function is provided. A connection interface is configured to an electrical device. A first controller is coupled to the switching circuit and communicates with the electrical device via a first transmission path. A second controller is coupled to the switching circuit and communicates with the electrical device via a second transmission path. In a standard charge mode, the first transmission path is turned on and the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a fast charge mode, the first controller determines whether the electrical device has a specific operating system. Responsive to determining that the electrical device does not have the specific operating system, the second transmission path is turned on and the second controller directs the voltage converter circuit to generate second charge power to the electrical device.

Abstract: A serial transmission fan control device comprises a master controller, a first fan controller, and a second controller. The master controller generates a serial control data, wherein the serial control data comprises a plurality of packets concatenated in an order and each of the plurality of packets comprises a control parameter set of a fan. The first fan controller electrically connects to the master controller, receives the serial control data, extracts a packet from the plurality of packets of the serial control data, and sends a first downlink serial data, wherein the first downlink data comprises all of the plurality of packets of the serial control data except for the extracted packet. The second fan controller electrically connects to the first fan controller, receives the first downlink serial data, and extracts a packet from the packets of the first downlink serial data.

Abstract: A motherboard having a charging function is provided. A connection interface is configured to an electrical device. A first controller communicates with the electrical device via a first transmission path. A second controller communicates with the electrical device via a second transmission path. In a first mode, the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a second mode, the second controller directs the voltage converter circuit to generate second charge power to the electrical device. In a third mode, the first controller determines whether the electrical device is a specific device. Responsive to the electrical device not being the specific device, the voltage converter circuit generates third charge power to the electrical device. Responsive to the electrical device being the specific device, the voltage converter circuit generates fourth charge power to the electrical device.

Abstract: A differential pressure sensor, wherein a gas pipeline (12) is formed in an IC carrier plate (10) and two air holes (13) in communication with the gas pipeline (12) are arranged on the top surface of the IC carrier plate (10). A pressure sensing chip (30) is integrated with one of the air holes (13) on the IC carrier plate (10), and an upper cover (40) is adhered and combined on the top surface of the IC carrier plate (10); two cavities (411) are arranged on the upper cover (40) and correspond to the positions of the two air holes (13), and two air pipes (42) respectively connected to the cavities (411) are arranged on the upper cover (40).

Abstract: A serial transmission fan control device comprises a master controller, a first fan controller, and a second controller. The master controller generates a serial control data, wherein the serial control data comprises a plurality of packets concatenated in an order and each of the plurality of packets comprises a control parameter set of a fan. The first fan controller electrically connects to the master controller, receives the serial control data, extracts a packet from the plurality of packets of the serial control data, and sends a first downlink serial data, wherein the first downlink data comprises all of the plurality of packets of the serial control data except for the extracted packet. The second fan controller electrically connects to the first fan controller, receives the first downlink serial data, and extracts a packet from the packets of the first downlink serial data.

Abstract: A motherboard having a smart charging function is provided. A connection interface is configured to an electrical device. A first controller is coupled to the switching circuit and communicates with the electrical device via a first transmission path. A second controller is coupled to the switching circuit and communicates with the electrical device via a second transmission path. In a standard charge mode, the first transmission path is turned on and the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a fast charge mode, the first controller determines whether the electrical device has a specific operating system. Responsive to determining that the electrical device does not have the specific operating system, the second transmission path is turned on and the second controller directs the voltage converter circuit to generate second charge power to the electrical device.

Abstract: A motherboard having a charging function is provided. A connection interface is configured to an electrical device. A first controller communicates with the electrical device via a first transmission path. A second controller communicates with the electrical device via a second transmission path. In a first mode, the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a second mode, the second controller directs the voltage converter circuit to generate second charge power to the electrical device. In a third mode, the first controller determines whether the electrical device is a specific device. Responsive to the electrical device not being the specific device, the voltage converter circuit generates third charge power to the electrical device. Responsive to the electrical device being the specific device, the voltage converter circuit generates fourth charge power to the electrical device.