Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a first semiconductor die, and a second semiconductor die. The substrate includes a first substrate partition and a second substrate partition. The first substrate partition has a first wiring structure. The second substrate partition is adjacent to the first substrate partition and has a second wiring structure. The first substrate partition and the second substrate partition are surrounded by a first molding material. The first semiconductor die is disposed over the substrate and electrically coupled to the first wiring structure. The second semiconductor die is disposed over the substrate and electrically coupled to the second wiring structure.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a first semiconductor die, and a second semiconductor die. The substrate includes a first substrate partition and a second substrate partition. The first substrate partition has a first wiring structure. The second substrate partition is adjacent to the first substrate partition and has a second wiring structure. The first substrate partition and the second substrate partition are surrounded by a first molding material. The first semiconductor die is disposed over the substrate and electrically coupled to the first wiring structure. The second semiconductor die is disposed over the substrate and electrically coupled to the second wiring structure.

Abstract: A track mounting structure includes: a linear motor coil, a linear motor magnet correspondingly provided with the linear motor coil, a first track, and a trolley; wherein, the cross-section of the trolley is U-shape, the internal of the U-shape forms a mounting cavity; the first track is provided inside the mounting cavity, two groups of upper rollers being axis crossing are provided between an upper surface of the first track and an upper surface of the mounting cavity. The disclosure moves the track beneath the linear motor coil, thus increasing the available space, which can be used to increase the size and load of the trolley, so as to achieve the purpose of changing the track form and strengthening the track structure.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a first semiconductor die, and a second semiconductor die. The substrate includes a first substrate partition and a second substrate partition. The first substrate partition has a first wiring structure. The second substrate partition is adjacent to the first substrate partition and has a second wiring structure. The first substrate partition and the second substrate partition are surrounded by a first molding material. The first semiconductor die is disposed over the substrate and electrically coupled to the first wiring structure. The second semiconductor die is disposed over the substrate and electrically coupled to the second wiring structure.

Abstract: A wafer-level package includes a plurality of dies and a plurality of connection paths. The dies include at least a first die and a second die. The dies are arranged in a side-by-side fashion, and a first side of the first die is adjacent to a first side of the second die. The connection paths connect input/output (I/O) pads arranged on the first side of the first die to I/O pads arranged on the first side of the second die, wherein adjacent I/O pads on the first side of the first die are connected to adjacent I/O pads on the first side of the second die via connection paths on only a single layer. For example, the first die is identical to the second die. For another example, the wafer-level package is an integrated fan-out (InFO) package or a chip on wafer on substrate (CoWoS) package. For yet another example, the dies are assembled in the wafer-level package to perform a network switch function.

Abstract: A wafer-level package includes a first die and a second die that are wafer-level packaged. The first die has a first clock source. The second die has a second clock source. The first clock source generates a clock shared by the first die and the second die. The second clock source, however, does not generate a clock used by any of the first die and the second die.

Abstract: A wafer-level package includes a first die and a second die that are wafer-level packaged. The first die has a first clock source. The second die has a second clock source. The first clock source generates a clock shared by the first die and the second die. The second clock source, however, does not generate a clock used by any of the first die and the second die.

Abstract: A wafer-level package has a first die and a second die. The first die has a first clock source arranged to generate a first clock, a first sub-system arranged to generate transmit data, and an output circuit arranged to output the transmit data according to the first clock. The second die has a second sub-system, a second clock source arranged to generate a second clock, and an input circuit having an asynchronous first-in first-out (FIFO) buffer. The input circuit buffers the transmit data transferred from the output circuit in the asynchronous FIFO buffer according to the first clock, and outputs the buffered transmit data in the asynchronous FIFO buffer to the second sub-system according to the second clock.

Abstract: A wafer-level package includes a plurality of dies and a plurality of connection paths. The dies include at least a first die and a second die. The dies are arranged in a side-by-side fashion, and a first side of the first die is adjacent to a first side of the second die. The connection paths connect input/output (I/O) pads arranged on the first side of the first die to I/O pads arranged on the first side of the second die, wherein adjacent I/O pads on the first side of the first die are connected to adjacent I/O pads on the first side of the second die via connection paths on only a single layer. For example, the first die is identical to the second die. For another example, the wafer-level package is an integrated fan-out (InFO) package or a chip on wafer on substrate (CoWoS) package. For yet another example, the dies are assembled in the wafer-level package to perform a network switch function.

Abstract: A wafer-level package has a first die and a second die. The first die has a first clock source arranged to generate a first clock, a first sub-system arranged to generate transmit data, and an output circuit arranged to output the transmit data according to the first clock. The second die has a second sub-system, a second clock source arranged to generate a second clock, and an input circuit having an asynchronous first-in first-out (FIFO) buffer. The input circuit buffers the transmit data transferred from the output circuit in the asynchronous FIFO buffer according to the first clock, and outputs the buffered transmit data in the asynchronous FIFO buffer to the second sub-system according to the second clock.

Abstract: A write strategy setting apparatus applied in an optical disc drive includes a storage unit, an error calculator, and a write strategy controller. The storage unit stores an initial write strategy including a plurality of write strategy parameter sets corresponding to a plurality of data set types; the error calculator calculates an error value set for each data set type generated by the optical disc drive utilizing a corresponding write strategy parameter set in the initial write strategy, and stores the calculated error value set into the storage unit to thereby overwrite the write strategy parameter set; and the write strategy controller determines a modified write strategy by referring to a plurality of error value sets stored in the storage unit and the initial write strategy, and then storing the modified write strategy into the storage unit.

Abstract: A delay circuit comprising a delay measurement unit, a delay mapping unit and a map delay module. The delay measurement unit generates a mapping table according to a reference signal and a reference clock signal. The delay mapping unit generates a mapped delay selection signal according to an input selection signal and at least a mapping value from the mapping table. The map delay module delays an input data signal to generate an output data signal according to the mapped delay selection signal.

Abstract: A system in an optical storage device has a controller which obtains a plurality of write strategy parameters for the optical storage device to write data on an optical storage medium. The write strategy parameters are derived from data-to-clock edge deviations respectively corresponding to a plurality of data set types. Each of the data set types corresponds to a combination of at least a specific target pit length and a specific target land length, or a combination of at least a specific target land length and a specific target pit length.

Abstract: An apparatus for writing data to an optical storage media and a servo control unit and a laser diode driver unit thereof. The apparatus making a laser diode emit light includes a servo control unit and a laser diode driver unit. The servo control unit includes a control unit for controlling a burning procedure and a modulation unit for outputting an encoded signal. The laser diode driver unit receives the encoded signal and includes a PLL unit, a write strategy generation unit and a lock/unlock detection unit. The PLL unit outputs at least one of a second clock signal and a second data signal according to the encoded signal. The write strategy generation unit outputs a control signal to control the laser diode according to the second clock signal and the second data signal. The lock/unlock detection unit outputs a lock indicator or an unlock indicator to the control unit.

Abstract: Level shifters capable of setting logic level of the output signals thereof to a pre-defined known state during power-up are provided, in which a first logic unit is powered by a first power voltage, receives input signals with a core power voltage and comprises first and second output terminals. First and second drivers are coupled between the first output terminal and the first power voltage and between the second output terminal and the second power voltage respectively. When one of the first and second power voltages is not ready during power-up, the first driver matches a voltage level on the first output terminal with the first power voltage by AC coupling and the second driver pulls low or maintains a voltage level on the second output terminal.

Abstract: A delay circuit includes a first delay module, a delay measurement unit and a fault judge unit. The first delay module has a first delay circuit with at least one delay stage. The delay measurement unit is used for measuring a first delay amount and a second delay amount of the first delay chain respectively corresponding to a first number and a second number of delay stages. The fault judge unit is used for determining if the first delay chain has delay faults or not according to the first and second delay amounts.

Abstract: A method for tuning a plurality of write strategy parameters of an optical storage device includes detecting a plurality of lengths, each length corresponding to a pit or a land on an optical storage medium accessed by the optical storage device, performing calculations corresponding to a plurality of data set types and generating a plurality of data-to-clock edge deviations respectively corresponding to the data set types, and utilizing the data-to-clock edge deviations for tuning the write strategy parameters corresponding to the data set types respectively.

Abstract: A delay circuit comprising a delay measurement unit, a delay mapping unit and a map delay module. The delay measurement unit generates a mapping table according to a reference signal and a reference clock signal. The delay mapping unit generates a mapped delay selection signal according to an input selection signal and at least a mapping value from the mapping table. The map delay module delays an input data signal to generate an output data signal according to the mapped delay selection signal.

Abstract: A delay circuit includes a first delay module, a delay measurement unit and a fault judge unit. The first delay module has a first delay circuit with at least one delay stage. The delay measurement unit is used for measuring a first delay amount and a second delay amount of the first delay chain respectively corresponding to a first number and a second number of delay stages. The fault judge unit is used for determining if the first delay chain has delay faults or not according to the first and second delay amounts.

Abstract: An integrated circuit package comprising a semiconductor device and pins is provided. The semiconductor device comprises first and second scan chains, each having an input port and an output port. The semiconductor device further comprises at least two first pads, at least two second pads, and a connecting device. The at least two first pads are coupled to the input port of the first scan chain and the output port of the second scan chain, respectively. The at least two second pads are coupled to the output port of the first scan chain and the input port of the second scan chain, respectively. The connecting device is coupled between the first and the second chains, and is capable of controlling electrical connection between the input port of the second scan chain and the output port of the first scan chain. When the connecting device is disabled, the input port of the second scan chain is electrically disconnected from the output port of the first scan chain.