Patents by Inventor Yuan CHU
Yuan CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133941Abstract: An electronic device is provided and includes a substrate, a first contact pad, a second contact pad, an electronic element, and a third contact pad. The first contact pad and the second contact pad are disposed on the substrate. The electronic element is located above the substrate and electrically connected to the first contact pad and the second contact pad. The third contact pad is electrically connected to the first contact pad. A test method for an electronic device is also provided.Type: ApplicationFiled: September 7, 2023Publication date: April 25, 2024Applicant: CARUX TECHNOLOGY PTE. LTD.Inventors: Chao-Chin Sung, Chueh-Yuan Nien, Chien-Tzu Chu
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Publication number: 20240127989Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.Type: ApplicationFiled: January 25, 2023Publication date: April 18, 2024Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
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Publication number: 20240127988Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.Type: ApplicationFiled: March 2, 2023Publication date: April 18, 2024Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
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Publication number: 20240117297Abstract: A p-aminobenzoic acid-producing microorganism is provided. The p-aminobenzoic acid-producing microorganism is obtained by a method for preparing a p-aminobenzoic acid-producing microorganism. The method for preparing a p-aminobenzoic acid-producing microorganism includes (a) performing an acclimation process on a source microorganism with at least one sulfonamide antibiotic to obtain at least one acclimatized microorganism and (b) screening out at least one p-aminobenzoic acid-producing microorganism from the at least one acclimatized microorganism, wherein the at least one p-aminobenzoic acid-producing microorganism has a higher p-aminobenzoic acid titer than the source microorganism.Type: ApplicationFiled: December 29, 2022Publication date: April 11, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Pei-Ching CHANG, Jhong-De LIN, Ya-Lin LIN, Hung-Yu LIAO, Hsiang Yuan CHU, Jie-Len HUANG
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Publication number: 20240120639Abstract: A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.Type: ApplicationFiled: August 10, 2023Publication date: April 11, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Hsiang Huang, Fong-Yuan Chang, Tsui-Ping Wang, Yi-Shin Chu
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Patent number: 11946771Abstract: An aerial vehicle including a body, a first ranging device, a second ranging device and a controller is provided. The first ranging device is disposed on the body and is configured to detect a first distance between the first ranging device and the reflector. The second ranging device is disposed on the body and is configured to detect a second distance between the second ranging device and the reflector. The controller is configured to obtain an included angle between a direction of the body and the reflector according to the first distance and the second distance.Type: GrantFiled: April 1, 2020Date of Patent: April 2, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yuan-Chu Tai, Chung-Hsien Wu, Yu-Kai Wang
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Patent number: 11932498Abstract: A temperature control system and method for devices under test and an image sensor-testing apparatus having the system are provided. The temperature control method for devices under test mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.Type: GrantFiled: September 12, 2022Date of Patent: March 19, 2024Assignee: CHROMA ATE INC.Inventors: Chin-Yi Ouyang, Chin-Yuan Kuo, Chang-Jyun He, Yung-Fan Chu
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Publication number: 20240077716Abstract: A micromirror assembly comprises a first position-limiting part, a micromirror chip, and a second position-limiting part that are stacked. The micromirror chip includes a fastening frame, a movable part, and a first cantilever, where the movable part is connected to the fastening frame by the first cantilever. The first position-limiting part and the second position-limiting part are separately connected to the fastening frame, the first position-limiting part and the second position-limiting part have a hollow area, and the hollow areas are opposite to the movable part. The first position-limiting part and the second position-limiting part are configured to absorb shock from a collision with the micromirror chip, and a projection of a collision part of the first position-limiting part on the micromirror chip intersects with a central axis of the first cantilever.Type: ApplicationFiled: November 13, 2023Publication date: March 7, 2024Inventors: Fei Zhao, Huai Yuan Chu, Jinghui Xu, Jiahao Wu
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Patent number: 11919536Abstract: The present disclosure relates to an evaluation method and system for steering comfort in a human machine cooperative take-over control process of an autonomous vehicle, and a storage medium, thereby avoiding a defect that most comfort evaluation methods are applicable only in laboratory conditions, and also solving a problem that most comfort evaluation methods do not consider non-traditional control characteristics of a driver in a take-over control process. The method of the present disclosure includes: acquiring vehicle data information in a current driving cycle, and preprocessing the vehicle data information to form preprocessed vehicle data information; and using the preprocessed vehicle data information as an input to a well-trained comfort model library, and performing log probability matching calculation on the basis of the comfort model library, to form a comfort recognition result corresponding to comfort.Type: GrantFiled: June 21, 2021Date of Patent: March 5, 2024Assignee: Tsinghua UniversityInventors: Xuewu Ji, Yuan Chu
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Patent number: 11918987Abstract: Provided are a preparation method for a propylene epoxidation catalyst, and a use thereof. During the preparation, an alkoxide solution of a prepared active component and a silica gel support are mixed, then a rotary evaporation treatment is performed on the mixture to remove a low-carbon alcohol to obtain a catalyst precursor, and then the obtained catalyst precursor is subjected to calcination and silylation treatments to obtain the propylene epoxidation catalyst. The catalyst is prepared in a simple process, can be applied to the chemical process of preparing propylene oxide by propylene epoxidation, has high average selectivity to propylene oxide, and has industrial application prospect.Type: GrantFiled: January 14, 2020Date of Patent: March 5, 2024Assignee: Wanhua Chemical Group Co., Ltd.Inventors: Lei Wang, Tongji Wang, Fei Ye, Kang Sun, Naibo Chu, Qiankun Jiao, Yuan Li
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Patent number: 11916060Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device comprises a source region and a drain region in a substrate and laterally spaced. A gate stack is over the substrate and between the source region and the drain region. The drain region includes two or more first doped regions having a first doping type in the substrate. The drain region further includes one or more second doped regions in the substrate. The first doped regions have a greater concentration of first doping type dopants than the second doped regions, and each of the second doped regions is disposed laterally between two neighboring first doped regions.Type: GrantFiled: June 21, 2022Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sheng-Fu Hsu, Ta-Yuan Kung, Chen-Liang Chu, Chih-Chung Tsai
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Publication number: 20230417822Abstract: The present invention discloses an RF element group testing system and method. The method comprises steps: adding an identification feature to a first RF signal, which is output by one of the plurality of tested RF elements, to generate an identification RF signal; synthesizing the identification RF signal and a second RF signal, which is output by each of the rest of the tested RF elements, to generate a corresponding synthesis signal; resolving the synthesis signal into the identification RF signal and the corresponding second RF signal according to the identification feature; restoring the identification RF signal into the first RF signal; and calculating at least one signal-feature parameter of the first RF signal and the second RF signal.Type: ApplicationFiled: June 20, 2023Publication date: December 28, 2023Inventors: CHIH-YUAN CHU, HSI-TSENG CHOU, JAKE WALDVOGEL LIU, CHIH-WEI CHIU
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Patent number: 11854844Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.Type: GrantFiled: June 16, 2022Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chi-Yuan Chu, Jen-Ti Wang, Wei-Chih Chen, Kuo-Fong Chuang, Cheng-Ho Hung
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Publication number: 20230237702Abstract: The method includes a data collection step, a setup step, a positioning step, an analysis step, and an adjustment step. The data collection step collects spatial data about a scene to be monitored. The setup step installs a number of monitoring devices and a reference device, where the reference device includes a reflector or a calibration pattern. The positioning step determines respective positions of the monitoring devices relative to the reference device. The analysis step determines whether the FOVs of the monitoring devices jointly cover the scene by an algorithm module analyzing the scene data, the FOVs of the monitoring devices, and the relative positions of the monitoring devices against the reference device. The adjustment step provides suggestions about adding one or more monitoring devices or changing positions of the monitoring devices to cover the scene entirely if the FOVs of the monitoring devices do not cover the scene.Type: ApplicationFiled: January 27, 2022Publication date: July 27, 2023Inventors: Wen-Hsiung Lin, Kai-Pin Tung, Chih-Yuan Chu
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Patent number: 11693431Abstract: A method and system of measuring a radio wave distribution of a radio signal source and estimating corresponding radio characteristics by using a flying vehicle is provided. The method includes the following steps. At a number of flight positions during a measurement process, a number of first radio signals transmitted by the radio signal source are measured by the flying vehicle. A position of the radio signal source is estimated according to the first radio signals and a radio channel model. A number of first radio characteristics of the first radio signal are obtained, and a radio wave distribution of the radio signal source is estimated according to the first radio characteristics of the first radio signals and a number of second radio characteristics of a number of second radio signals in the radio wave distribution are estimated according to the first radio characteristics of the first radio signals.Type: GrantFiled: September 23, 2019Date of Patent: July 4, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yi-Lun Wen, Yuan-Chu Tai
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Publication number: 20230203314Abstract: A dye for a material with amide functional groups and a dyeing method of using the same are provided. The dye includes a compound represented by Formula (I) and a solvent. Based on the total weight of the dye of 100 wt %, a content of the compound represented by Formula (I) is 40 wt % to 95 wt %. In Chemical Formula (I), R1, R2 and R3 are each independently H, —OH or —COOH, wherein at least one of R1, R2 and R3 is —OH or —COOH.Type: ApplicationFiled: December 29, 2021Publication date: June 29, 2023Applicant: Industrial Technology Research InstituteInventors: Jie-Len Huang, Pei-Ching Chang, Chang-Jung Chang, Jhong-De Lin, Ya-Lin Lin, Hung-Yu Liao, Hsiang-Yuan Chu
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Patent number: 11657524Abstract: An image capturing and depth alignment method includes radar scanning step, image capturing step, translation and synchronization step, alignment step, client detection step, client positioning step, scene map construction step, view image transmitting step, view image processing step, virtual object placement step. through translating, synchronizing, and aligning the radar scanning step's 3D point cloud map and the image capturing step's planar image of the scene, the back-end server therefore obtains surveillance information with both image and depth. Then, through positioning, multiply superimposing, image rotation and matching, speed comparison, uniformization of coordinate systems, and display through the smart glasses, a wearer of the smart glasses may be positioned and tracked in the scene. The wearer may also be instructed to reach a specific target or place of a specific object.Type: GrantFiled: January 6, 2021Date of Patent: May 23, 2023Assignee: JORJIN TECHNOLOGIES INC.Inventors: Wen-Hsiung Lin, Chih-Yuan Chu, Kai-Pin Tung
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Publication number: 20230152821Abstract: A method and a system for vehicle head direction compensation are disclosed. The method includes the following. A relative position between each of a plurality of sensors disposed on a vehicle and a plurality of base stations is obtained through the sensors and a relative coordinate system is established by a processor to obtain a vehicle head direction of the vehicle in the relative coordinate system and a deviation angle between an X-axis of the relative coordinate system and a true north azimuth. An angle compensation is performed by the processor on the vehicle head direction of the vehicle in the relative coordinate system based on the deviation angle.Type: ApplicationFiled: December 20, 2021Publication date: May 18, 2023Applicant: Industrial Technology Research InstituteInventors: Yu-Kai Wang, Yuan-Chu Tai, Chung-Hsien Wu
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Patent number: 11605553Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.Type: GrantFiled: November 16, 2020Date of Patent: March 14, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Fu-Hsien Li, Chi-Feng Tung, Chi Yuan Chu, Jen-Ti Wang, Hsiang Yin Shen
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Patent number: 11505457Abstract: An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.Type: GrantFiled: March 31, 2022Date of Patent: November 22, 2022Assignee: XINTEC INC.Inventors: Yu-Tang Shen, Shun-Wen Long, Chih-Hung Cho, Hsing-Yuan Chu