Patents by Inventor Yuan CHU

Yuan CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133941
    Abstract: An electronic device is provided and includes a substrate, a first contact pad, a second contact pad, an electronic element, and a third contact pad. The first contact pad and the second contact pad are disposed on the substrate. The electronic element is located above the substrate and electrically connected to the first contact pad and the second contact pad. The third contact pad is electrically connected to the first contact pad. A test method for an electronic device is also provided.
    Type: Application
    Filed: September 7, 2023
    Publication date: April 25, 2024
    Applicant: CARUX TECHNOLOGY PTE. LTD.
    Inventors: Chao-Chin Sung, Chueh-Yuan Nien, Chien-Tzu Chu
  • Publication number: 20240127989
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.
    Type: Application
    Filed: January 25, 2023
    Publication date: April 18, 2024
    Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
  • Publication number: 20240127988
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.
    Type: Application
    Filed: March 2, 2023
    Publication date: April 18, 2024
    Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
  • Publication number: 20240117297
    Abstract: A p-aminobenzoic acid-producing microorganism is provided. The p-aminobenzoic acid-producing microorganism is obtained by a method for preparing a p-aminobenzoic acid-producing microorganism. The method for preparing a p-aminobenzoic acid-producing microorganism includes (a) performing an acclimation process on a source microorganism with at least one sulfonamide antibiotic to obtain at least one acclimatized microorganism and (b) screening out at least one p-aminobenzoic acid-producing microorganism from the at least one acclimatized microorganism, wherein the at least one p-aminobenzoic acid-producing microorganism has a higher p-aminobenzoic acid titer than the source microorganism.
    Type: Application
    Filed: December 29, 2022
    Publication date: April 11, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Pei-Ching CHANG, Jhong-De LIN, Ya-Lin LIN, Hung-Yu LIAO, Hsiang Yuan CHU, Jie-Len HUANG
  • Publication number: 20240120639
    Abstract: A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.
    Type: Application
    Filed: August 10, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hsiang Huang, Fong-Yuan Chang, Tsui-Ping Wang, Yi-Shin Chu
  • Patent number: 11946771
    Abstract: An aerial vehicle including a body, a first ranging device, a second ranging device and a controller is provided. The first ranging device is disposed on the body and is configured to detect a first distance between the first ranging device and the reflector. The second ranging device is disposed on the body and is configured to detect a second distance between the second ranging device and the reflector. The controller is configured to obtain an included angle between a direction of the body and the reflector according to the first distance and the second distance.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: April 2, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuan-Chu Tai, Chung-Hsien Wu, Yu-Kai Wang
  • Patent number: 11932498
    Abstract: A temperature control system and method for devices under test and an image sensor-testing apparatus having the system are provided. The temperature control method for devices under test mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: March 19, 2024
    Assignee: CHROMA ATE INC.
    Inventors: Chin-Yi Ouyang, Chin-Yuan Kuo, Chang-Jyun He, Yung-Fan Chu
  • Publication number: 20240077716
    Abstract: A micromirror assembly comprises a first position-limiting part, a micromirror chip, and a second position-limiting part that are stacked. The micromirror chip includes a fastening frame, a movable part, and a first cantilever, where the movable part is connected to the fastening frame by the first cantilever. The first position-limiting part and the second position-limiting part are separately connected to the fastening frame, the first position-limiting part and the second position-limiting part have a hollow area, and the hollow areas are opposite to the movable part. The first position-limiting part and the second position-limiting part are configured to absorb shock from a collision with the micromirror chip, and a projection of a collision part of the first position-limiting part on the micromirror chip intersects with a central axis of the first cantilever.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Inventors: Fei Zhao, Huai Yuan Chu, Jinghui Xu, Jiahao Wu
  • Patent number: 11919536
    Abstract: The present disclosure relates to an evaluation method and system for steering comfort in a human machine cooperative take-over control process of an autonomous vehicle, and a storage medium, thereby avoiding a defect that most comfort evaluation methods are applicable only in laboratory conditions, and also solving a problem that most comfort evaluation methods do not consider non-traditional control characteristics of a driver in a take-over control process. The method of the present disclosure includes: acquiring vehicle data information in a current driving cycle, and preprocessing the vehicle data information to form preprocessed vehicle data information; and using the preprocessed vehicle data information as an input to a well-trained comfort model library, and performing log probability matching calculation on the basis of the comfort model library, to form a comfort recognition result corresponding to comfort.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: March 5, 2024
    Assignee: Tsinghua University
    Inventors: Xuewu Ji, Yuan Chu
  • Patent number: 11918987
    Abstract: Provided are a preparation method for a propylene epoxidation catalyst, and a use thereof. During the preparation, an alkoxide solution of a prepared active component and a silica gel support are mixed, then a rotary evaporation treatment is performed on the mixture to remove a low-carbon alcohol to obtain a catalyst precursor, and then the obtained catalyst precursor is subjected to calcination and silylation treatments to obtain the propylene epoxidation catalyst. The catalyst is prepared in a simple process, can be applied to the chemical process of preparing propylene oxide by propylene epoxidation, has high average selectivity to propylene oxide, and has industrial application prospect.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: March 5, 2024
    Assignee: Wanhua Chemical Group Co., Ltd.
    Inventors: Lei Wang, Tongji Wang, Fei Ye, Kang Sun, Naibo Chu, Qiankun Jiao, Yuan Li
  • Patent number: 11916060
    Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device comprises a source region and a drain region in a substrate and laterally spaced. A gate stack is over the substrate and between the source region and the drain region. The drain region includes two or more first doped regions having a first doping type in the substrate. The drain region further includes one or more second doped regions in the substrate. The first doped regions have a greater concentration of first doping type dopants than the second doped regions, and each of the second doped regions is disposed laterally between two neighboring first doped regions.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Fu Hsu, Ta-Yuan Kung, Chen-Liang Chu, Chih-Chung Tsai
  • Publication number: 20230417822
    Abstract: The present invention discloses an RF element group testing system and method. The method comprises steps: adding an identification feature to a first RF signal, which is output by one of the plurality of tested RF elements, to generate an identification RF signal; synthesizing the identification RF signal and a second RF signal, which is output by each of the rest of the tested RF elements, to generate a corresponding synthesis signal; resolving the synthesis signal into the identification RF signal and the corresponding second RF signal according to the identification feature; restoring the identification RF signal into the first RF signal; and calculating at least one signal-feature parameter of the first RF signal and the second RF signal.
    Type: Application
    Filed: June 20, 2023
    Publication date: December 28, 2023
    Inventors: CHIH-YUAN CHU, HSI-TSENG CHOU, JAKE WALDVOGEL LIU, CHIH-WEI CHIU
  • Patent number: 11854844
    Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Yuan Chu, Jen-Ti Wang, Wei-Chih Chen, Kuo-Fong Chuang, Cheng-Ho Hung
  • Publication number: 20230237702
    Abstract: The method includes a data collection step, a setup step, a positioning step, an analysis step, and an adjustment step. The data collection step collects spatial data about a scene to be monitored. The setup step installs a number of monitoring devices and a reference device, where the reference device includes a reflector or a calibration pattern. The positioning step determines respective positions of the monitoring devices relative to the reference device. The analysis step determines whether the FOVs of the monitoring devices jointly cover the scene by an algorithm module analyzing the scene data, the FOVs of the monitoring devices, and the relative positions of the monitoring devices against the reference device. The adjustment step provides suggestions about adding one or more monitoring devices or changing positions of the monitoring devices to cover the scene entirely if the FOVs of the monitoring devices do not cover the scene.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 27, 2023
    Inventors: Wen-Hsiung Lin, Kai-Pin Tung, Chih-Yuan Chu
  • Patent number: 11693431
    Abstract: A method and system of measuring a radio wave distribution of a radio signal source and estimating corresponding radio characteristics by using a flying vehicle is provided. The method includes the following steps. At a number of flight positions during a measurement process, a number of first radio signals transmitted by the radio signal source are measured by the flying vehicle. A position of the radio signal source is estimated according to the first radio signals and a radio channel model. A number of first radio characteristics of the first radio signal are obtained, and a radio wave distribution of the radio signal source is estimated according to the first radio characteristics of the first radio signals and a number of second radio characteristics of a number of second radio signals in the radio wave distribution are estimated according to the first radio characteristics of the first radio signals.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: July 4, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Lun Wen, Yuan-Chu Tai
  • Publication number: 20230203314
    Abstract: A dye for a material with amide functional groups and a dyeing method of using the same are provided. The dye includes a compound represented by Formula (I) and a solvent. Based on the total weight of the dye of 100 wt %, a content of the compound represented by Formula (I) is 40 wt % to 95 wt %. In Chemical Formula (I), R1, R2 and R3 are each independently H, —OH or —COOH, wherein at least one of R1, R2 and R3 is —OH or —COOH.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 29, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Jie-Len Huang, Pei-Ching Chang, Chang-Jung Chang, Jhong-De Lin, Ya-Lin Lin, Hung-Yu Liao, Hsiang-Yuan Chu
  • Patent number: 11657524
    Abstract: An image capturing and depth alignment method includes radar scanning step, image capturing step, translation and synchronization step, alignment step, client detection step, client positioning step, scene map construction step, view image transmitting step, view image processing step, virtual object placement step. through translating, synchronizing, and aligning the radar scanning step's 3D point cloud map and the image capturing step's planar image of the scene, the back-end server therefore obtains surveillance information with both image and depth. Then, through positioning, multiply superimposing, image rotation and matching, speed comparison, uniformization of coordinate systems, and display through the smart glasses, a wearer of the smart glasses may be positioned and tracked in the scene. The wearer may also be instructed to reach a specific target or place of a specific object.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: May 23, 2023
    Assignee: JORJIN TECHNOLOGIES INC.
    Inventors: Wen-Hsiung Lin, Chih-Yuan Chu, Kai-Pin Tung
  • Publication number: 20230152821
    Abstract: A method and a system for vehicle head direction compensation are disclosed. The method includes the following. A relative position between each of a plurality of sensors disposed on a vehicle and a plurality of base stations is obtained through the sensors and a relative coordinate system is established by a processor to obtain a vehicle head direction of the vehicle in the relative coordinate system and a deviation angle between an X-axis of the relative coordinate system and a true north azimuth. An angle compensation is performed by the processor on the vehicle head direction of the vehicle in the relative coordinate system based on the deviation angle.
    Type: Application
    Filed: December 20, 2021
    Publication date: May 18, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Kai Wang, Yuan-Chu Tai, Chung-Hsien Wu
  • Patent number: 11605553
    Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: March 14, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Fu-Hsien Li, Chi-Feng Tung, Chi Yuan Chu, Jen-Ti Wang, Hsiang Yin Shen
  • Patent number: 11505457
    Abstract: An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: November 22, 2022
    Assignee: XINTEC INC.
    Inventors: Yu-Tang Shen, Shun-Wen Long, Chih-Hung Cho, Hsing-Yuan Chu