Abstract: A method includes forming a conductive feature through a first dielectric layer, sequentially forming a second dielectric layer and a third dielectric layer over the first dielectric layer, and etching the third dielectric layer to form an opening. A first width of the opening at a top surface of the third dielectric layer is greater than a second width of the opening at a first interface between the third dielectric layer and the second dielectric layer. The method also includes etching the second dielectric layer until the opening extends to the conductive feature, thereby forming an enlarged opening, and forming a metal material in the enlarged opening. A third width of the enlarged opening at the first interface is equal to or less than a fourth width of the enlarged opening at a second interface between the second dielectric layer and the first dielectric layer.

Abstract: A memory device, includes a memory array for storing a plurality of vector data each of which has an MSB vector and a LSB vector. The memory array includes a plurality of memory units each of which has a first bit and a second bit. The first bit is used to store the MSB vector of each vector data, the second bit is used to store the LSB vector of each vector data. A bit line corresponding to each vector data executes one time of bit-line-setup, and reads the MSB vector and the LSB vector of each vector data according to the bit line. The threshold voltage distribution of each memory unit is divided into N states, where N is a positive integer and N is less than 2 to the power of 2, and the effective bit number stored by each memory unit is less than 2.

Abstract: Embodiments provide a dielectric inter block disposed in a metallic region of a conductive line or source/drain contact. A first and second conductive structure over the metallic region may extend into the metallic region on either side of the inter block. The inter block can prevent etchant or cleaning solution from contacting an interface between the first conductive structure and the metallic region.

Abstract: Improved conductive contacts, methods for forming the same, and semiconductor devices including the same are disclosed. In an embodiment, a semiconductor device includes a first interlayer dielectric (ILD) layer over a transistor structure; a first contact extending through the first ILD layer, the first contact being electrically coupled with a first source/drain region of the transistor structure, a top surface of the first contact being convex, and the top surface of the first contact being disposed below a top surface of the first ILD layer; a second ILD layer over the first ILD layer and the first contact; and a second contact extending through the second ILD layer, the second contact being electrically coupled with the first contact.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a first fin structure. The semiconductor device structure includes a first source/drain structure over the first fin structure. The semiconductor device structure includes a first dielectric layer over the first source/drain structure and the substrate. The semiconductor device structure includes a first conductive contact structure in the first dielectric layer and over the first source/drain structure. The semiconductor device structure includes a second dielectric layer over the first dielectric layer and the first conductive contact structure. The semiconductor device structure includes a first conductive via structure passing through the second dielectric layer and connected to the first conductive contact structure. A first width direction of the first conductive contact structure is substantially parallel to a second width direction of the first conductive via structure.

Abstract: A coin acceptor includes main body having coin dispenser mounted therein, coin tubes mounted in the main body and disposed at the bottom side of the coin dispenser, and sensing device including multiple optical sensor modules respectively aimed at the coin tubes. The distance between each optical sensor module and the coins in the respective coin tube is calculated by: measuring the time taken for the reflected light to travel from the coins in the respective coin tube to the proximity sensor of the respective optical sensor module and then multiplying the time thus measured by the speed of light. The number of coins in each coin tube is calculated by: deducting the distance between the respective optical sensor module and the coins in the respective coin tube from the pre-measured depth of the empty coin tube, and then dividing the reminder thus obtained by the thickness of single coin.

Abstract: A coin acceptor includes main body having coin dispenser mounted therein, coin tubes mounted in the main body and disposed at the bottom side of the coin dispenser, and sensing device including multiple optical sensor modules respectively aimed at the coin tubes. The distance between each optical sensor module and the coins in the respective coin tube is calculated by: measuring the time taken for the reflected light to travel from the coins in the respective coin tube to the proximity sensor of the respective optical sensor module and then multiplying the time thus measured by the speed of light. The number of coins in each coin tube is calculated by: deducting the distance between the respective optical sensor module and the coins in the respective coin tube from the pre-measured depth of the empty coin tube, and then dividing the reminder thus obtained by the thickness of single coin.

Abstract: A troubleshooted coin output method used in a coin dispensing and outputting machine including a machine main unit formed of a coin dispensing unit, a coin hopper consisting of a driver circuit, motors, coin-pushing modules and sensors and a circuit module, and coin tubes for storing coins. When outputting coins, the circuit module counts the amount of coins to be outputted subject to the amount of money to be given, and then stops the coin output operation if the outputted amount of coins does not match the amount of money to be given due to failure or one motor or any other reasons, and then counts the rest amount to be given, and then drives the other motor to output coins till that the desired amount are outputted, thereby troubleshooting the problem.