Abstract: Embodiments provide a dielectric inter block disposed in a metallic region of a conductive line or source/drain contact. A first and second conductive structure over the metallic region may extend into the metallic region on either side of the inter block. The inter block can prevent etchant or cleaning solution from contacting an interface between the first conductive structure and the metallic region.

Abstract: Improved conductive contacts, methods for forming the same, and semiconductor devices including the same are disclosed. In an embodiment, a semiconductor device includes a first interlayer dielectric (ILD) layer over a transistor structure; a first contact extending through the first ILD layer, the first contact being electrically coupled with a first source/drain region of the transistor structure, a top surface of the first contact being convex, and the top surface of the first contact being disposed below a top surface of the first ILD layer; a second ILD layer over the first ILD layer and the first contact; and a second contact extending through the second ILD layer, the second contact being electrically coupled with the first contact.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a first fin structure. The semiconductor device structure includes a first source/drain structure over the first fin structure. The semiconductor device structure includes a first dielectric layer over the first source/drain structure and the substrate. The semiconductor device structure includes a first conductive contact structure in the first dielectric layer and over the first source/drain structure. The semiconductor device structure includes a second dielectric layer over the first dielectric layer and the first conductive contact structure. The semiconductor device structure includes a first conductive via structure passing through the second dielectric layer and connected to the first conductive contact structure. A first width direction of the first conductive contact structure is substantially parallel to a second width direction of the first conductive via structure.

Abstract: A wireless transmission module for transmitting energy or signals includes a first magnetically conductive element, a first coil assembly and a first adhesive element. The first coil assembly and the first magnetically conductive element are arranged along a main axis. The first adhesive element is configured to be adhered to the first coil assembly and the first magnetic conductive element. The first adhesive element is disposed between the first coil assembly and the first magnetically conductive element.

Abstract: A probe card includes a circuit board, a fixing member, and a plurality of probes. The fixing member is fixed on the circuit board and has a through opening therein. The fixing member has opposite first and second sidewalls defining the through opening. Each of the probes includes an arm portion and a tip portion. One end of the arm portion is connected to the circuit board. The tip portion extends from the arm portion. The arm portions of the probes extend in substantially a same direction inclined to a direction perpendicular to the first sidewall of the fixing member in a top view.

Abstract: A brightness compensation method and related product are disclosed. The method includes steps of receiving at least one compensation table sent from a mobile terminal by a driving device, and obtaining a target grayscale value of a target pixel point in a first display picture of the display device, determining a fixing value corresponding to the target pixel point according to the at least one compensation table, performing a brightness compensation to the target pixel point according to the fixing value, and driving the display device to display the first display picture after performing the brightness compensation. The embodiment of the present application can eliminate a brightness uneven phenomenon in the first display picture caused by attenuation of the luminous efficiency of the OLED device.

Abstract: A probe card includes a circuit board having a through opening therein. A fixing member is at least partially in the through opening of the circuit board and has a through opening therein. The through opening of the fixing member is defined at least partially by opposite first and second sidewalls of the fixing member. A plurality of probes each includes an arm portion and a tip portion. One end of the arm portion is connected to the circuit board. The arm portion extends through the first sidewall of the fixing member into the through opening of the fixing member. The arm portion is angled with respect to a direction perpendicular to the first sidewall of the fixing member when viewed from above. The tip portion extends from the arm portion. The second sidewall of the fixing member is free of probes.

Abstract: A brightness compensation method and related product are disclosed. The method includes steps of receiving at least one compensation table sent from a mobile terminal by a driving device, and obtaining a target grayscale value of a target pixel point in a first display picture of the display device, determining a fixing value corresponding to the target pixel point according to the at least one compensation table, performing a brightness compensation to the target pixel point according to the fixing value, and driving the display device to display the first display picture after performing the brightness compensation. The embodiment of the present application can eliminate a brightness uneven phenomenon in the first display picture caused by attenuation of the luminous efficiency of the OLED device.

Abstract: A probe card includes a circuit board having a through opening therein. A fixing member is at least partially in the through opening of the circuit board and has a through opening therein. The through opening of the fixing member is defined at least partially by opposite first and second sidewalls of the fixing member. A plurality of probes each includes an arm portion and a tip portion. One end of the arm portion is connected to the circuit board. The arm portion extends through the first sidewall of the fixing member into the through opening of the fixing member. The arm portion is angled with respect to a direction perpendicular to the first sidewall of the fixing member when viewed from above. The tip portion extends from the arm portion. The second sidewall of the fixing member is free of probes.

Abstract: The present disclosure provides a display panel. The display panel has a display region and a packaging region disposed outside the display region, and includes an array substrate including a glass substrate, a flexible substrate disposed on the glass substrate, and a scanning line and a data lines disposed on the flexible substrate, a bending region extending outside the packaging region is disposed outside the packaging region at at least one side of the flexible substrate, a metal wire array used for connecting the scanning line and the data line of the array substrate to row driving and column driving chips is disposed in the bending region on the flexible substrate, and the bending region is bent toward a side surface of the flexible substrate deviating from the scanning line.

Abstract: A probe card, a wafer testing system and a wafer testing method are provided. The wafer testing system includes a wafer holder and a probe card. A wafer is held on the wafer holder, and testing pads are formed on the wafer, in which the testing pads are arranged along a test straight line. The probe card includes probes each of which includes an arm portion and a tip portion. An included angle between the test straight line and an extension of a projection line of the arm portion onto the wafer ranges from about 40 degrees to about 55 degrees.

Abstract: Disclosed are a pixel structure based on ink-jet printing technology and a method for manufacturing the same. In the pixel structure and in the method for manufacturing the same, a metal oxide semi-conductive material is used for forming an anode layer. The anode layer is divided into conductive areas and semi-conductive areas by conductive treatment. The semi-conductive areas play a same role as a dielectric layer in the prior art. The method for manufacturing the pixel structure is simple because formation of the dielectric layer is not needed. An organic functional layer formed by ink-jet has a uniform film thickness, which effectively improves quality of a product.

Abstract: An inkjet printer and a method thereof is disclosed. The inkjet printer, for fabricating an organic light-emitting diode device, includes a printing control apparatus, a main printing apparatus, a volume detection apparatus, and a compensation printing apparatus. The volume detection apparatus is capable of detecting volume and printing locations of a printing solution which needs to be compensated as soon as a main printing apparatus carrying out a primary printing, so that the compensation printing apparatus is capable of carrying out a compensation printing on the printing solution which needs printing compensation.

Abstract: Disclosed are a pixel structure based on ink-jet printing technology and a method for manufacturing the same. In the pixel structure and in the method for manufacturing the same, a metal oxide semi-conductive material is used for forming an anode layer. The anode layer is divided into conductive areas and semi-conductive areas by conductive treatment. The semi-conductive areas play a same role as a dielectric layer in the prior art. The method for manufacturing the pixel structure is simple because formation of the dielectric layer is not needed. An organic functional layer formed by ink-jet has a uniform film thickness, which effectively improves quality of a product.

Abstract: An inkjet printer and a method thereof is disclosed. The inkjet printer, for fabricating an organic light-emitting diode device, includes a printing control apparatus, a main printing apparatus, a volume detection apparatus, and a compensation printing apparatus. The volume detection apparatus is capable of detecting volume and printing locations of a printing solution which needs to be compensated as soon as a main printing apparatus carrying out a primary printing, so that the compensation printing apparatus is capable of carrying out a compensation printing on the printing solution which needs printing compensation.

Abstract: A pixel structure of an organic light emitting diode (OLED) display panel and a manufacturing method thereof are disclosed. The pixel structure comprises a pixel region, anode conductive layers, pixel units, and a cathode conductive layer. The pixel region comprises sub-pixel regions arranged in sequence, at least two adjacent sub-pixel regions defined as a sub-pixel region group are disposed integrally. The anode conductive layers are disposed in the sub-pixel regions respectively, and separated from each other. The cathode conductive layer is electrically connected with the anode conductive layers to control the pixel units. Each of the pixel units comprises sub-pixels and is disposed in the pixel region. Each of the sub-pixels is disposed in one of the sub-pixel regions. The sub-pixels are formed integrally and have a same color in the sub-pixel region group. The pixel unit comprises a hole injection layer, a luminous layer and an electron injection layer.

Abstract: The present disclosure discloses an LED display panel including at least a thin film transistor array layer, a quantum dot light emitting layer, and an LED array layer arranged between the thin film transistor array layer and the quantum dot light emitting layer, when the LED array layer emits excitation light, the excited quantum dot emits light to emit at least two colors of light. The present disclosure can reduce the production cost and greatly improve the production yield, and can effectively reduce the energy consumption of the display panel and improve the service life.

Abstract: The present disclosure provides a display panel. The display panel has a display region and a packaging region disposed outside the display region, and includes an array substrate including a glass substrate, a flexible substrate disposed on the glass substrate, and a scanning line and a data lines disposed on the flexible substrate, a bending region extending outside the packaging region is disposed outside the packaging region at at least one side of the flexible substrate, a metal wire array used for connecting the scanning line and the data line of the array substrate to row driving and column driving chips is disposed in the bending region on the flexible substrate, and the bending region is bent toward a side surface of the flexible substrate deviating from the scanning line.

Abstract: A pixel structure of an organic light emitting diode (OLED) display panel and a manufacturing method thereof are disclosed. The pixel structure comprises a pixel region, anode conductive layers, pixel units, and a cathode conductive layer. The pixel region comprises sub-pixel regions arranged in sequence, at least two adjacent sub-pixel regions defined as a sub-pixel region group are disposed integrally. The anode conductive layers are disposed in the sub-pixel regions respectively, and separated from each other. The cathode conductive layer is electrically connected with the anode conductive layers to control the pixel units. Each of the pixel units comprises sub-pixels and is disposed in the pixel region. Each of the sub-pixels is disposed in one of the sub-pixel regions. The sub-pixels are formed integrally and have a same color in the sub-pixel region group. The pixel unit comprises a hole injection layer, a luminous layer and an electron injection layer.

Abstract: The present disclosure discloses an LED display panel including at least a thin film transistor array layer, a quantum dot light emitting layer, and an LED array layer arranged between the thin film transistor array layer and the quantum dot light emitting layer, when the LED array layer emits excitation light, the excited quantum dot emits light to emit at least two colors of light. The present disclosure can reduce the production cost and greatly improve the production yield, and can effectively reduce the energy consumption of the display panel and improve the service life.