Patents by Inventor Yuan-Chung Hsieh

Yuan-Chung Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM
    Publication number: 20240087879
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Ceramic multilayer capacitor array
    Patent number: 6934145
    Abstract: A ceramic multilayer capacitor array having a plurality of capacitors in a surface mount compatible package. The array is constructed from a plurality of first dielectric plates, each of which has a first pattern of electrodes, and a plurality of second dielectric plates, each of which has a second pattern of electrodes. The second pattern of electrodes is substantially identical to the first pattern of electrodes, and is shifted with respect to the first pattern of electrodes. Each of the electrodes has at least one tab portion, which extends to at least one of the side faces of the package. Perpendicularly projecting first and second plates, the tab portions of the electrodes in the first plates are free from the tab portions of the electrodes in the second plates.
    Type: Grant
    Filed: July 5, 2001
    Date of Patent: August 23, 2005
    Assignee: Phycomp Holding B.V.
    Inventors: Yuan-Chung Hsieh, Men-Tsuan Tsai, Shiow-Chang Luh