Patents by Inventor Yuan-Fu Cheng

Yuan-Fu Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMBEDDED SMART MODULE
    Publication number: 20240098893
    Abstract: An embedded smart module including a twistable substrate, an electrode layer, a circuit layer, an insulating layer, an electronic component and a sensing component is provided. The electrode layer is disposed on the twistable substrate. The circuit layer is disposed in the electrode layer and exposed at the surface of the electrode layer. The insulating layer is disposed between the electrode layer and the circuit layer. The electronic component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer. The sensing component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer.
    Type: Application
    Filed: October 10, 2022
    Publication date: March 21, 2024
    Applicant: National Taipei University of Technology
    Inventors: Syang-Peng Rwei, Yuan-Fu Cheng, Lih Jen Kau