Patents by Inventor Yuan-Han Chu

Yuan-Han Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for cutting substrate and system for processing same
    Patent number: 10211105
    Abstract: An apparatus for cutting a substrate is disclosed. The apparatus includes a main body containing a reactive solution and the substrate; and a catalytic cutting element disposed inside the main body and contacting one of at least two adjacent cutting peripheries of the substrate to conduct a chemical reaction to cut the substrate.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: February 19, 2019
    Assignee: National Taiwan University of Science and Technology
    Inventors: Bing-Joe Hwang, Wei-Nien Su, Jeng-Ywan Jeng, Yuan-Han Chu, Tse-Ming Chiu, Hsin-Fu Teng
  • APPARATUS FOR CUTTING SUBSTRATE AND SYSTEM FOR PROCESSING SAME
    Publication number: 20180076089
    Abstract: An apparatus for cutting a substrate is disclosed. The apparatus includes a main body containing a reactive solution and the substrate; and a catalytic cutting element disposed inside the main body and contacting one of at least two adjacent cutting peripheries of the substrate to conduct a chemical reaction to cut the substrate.
    Type: Application
    Filed: November 17, 2017
    Publication date: March 15, 2018
    Applicant: National Taiwan University of Science and Technology
    Inventors: Bing-Joe Hwang, Wei-Nien Su, Jeng-Ywan Jeng, Yuan-Han Chu, Tse-Ming Chiu, Hsin-Fu Teng
  • Apparatus and method for processing a substrate
    Patent number: 9852948
    Abstract: A method of processing a substrate is disclosed. The method includes the following steps: providing a substrate body having a surface; placing a die on the surface, wherein the die acts as a catalyst; immersing the substrate body and the die in a reaction solution; and processing the substrate body via a chemical reaction occurring on the surface through the reaction solution and the catalyst.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: December 26, 2017
    Assignee: NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Bing-Joe Hwang, Wei-Nien Su, Jeng-Ywan Jeng, Yuan-Han Chu, Tse-Ming Chiu, Hsin-Fu Teng
  • APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE
    Publication number: 20160233129
    Abstract: A method of processing a substrate is disclosed. The method includes the following steps: providing a substrate body having a surface; placing a die on the surface, wherein the die acts as a catalyst; immersing the substrate body and the die in a reaction solution; and processing the substrate body via a chemical reaction occurring on the surface through the reaction solution and the catalyst.
    Type: Application
    Filed: February 3, 2016
    Publication date: August 11, 2016
    Applicant: National Taiwan University of Science and Technology
    Inventors: Bing-Joe Hwang, Wei-Nien Su, Jeng-Ywan Jeng, Yuan-Han Chu, Tse-Ming Chiu, Hsin-Fu Teng