Abstract: A shrimp peeling device includes a frame, a driving member, a first conveying wheel, a second conveying wheel, a conveying belt, a clamping frame, a cutting assembly, and a shell removing frame. The conveying belt is in transmission connection with the first conveying wheel and the second conveying wheel. The clamping frame is provided with a first pathway for the conveying belt to pass through. A processing opening is formed in the clamping frame. The cutting assembly is disposed at the processing opening. The shell removing frame is provided with a second pathway for the conveying belt to pass through, and the second pathway includes a limiting cavity and a narrowing cavity. The shell removing frame is provided with a discharge port. The conveying belt is upwards bent and folded in half to clamp and convey a shrimp.

Abstract: An apparatus for manufacturing a radial or azimuthal polarization conversion component includes a reflector having a truncated cone shape. The reflector has a top portion, a bottom portion, and a circumferential portion connected between the top portion and the bottom portion.

Abstract: A method for manufacturing a radial or azimuthal polarization conversion component comprises the steps of: placing a holographic recording material between two right-angle prisms, wherein the holographic recording material is divided into at least four sector-shaped areas and is partially shielded, and only one of the sector-shaped areas is exposed each time; allowing a recording light to pass through the right-angle prisms and the exposed sector-shaped area of the holographic recording material and to interfere with a reflected object light on the holographic recording material; rotating the holographic recording material to expose the other sector-shaped areas one by one to be constructed for manufacturing volume holograms with diffraction angles of 48.19 degrees, 60 degrees or about 85 degrees.

Abstract: A dipole antenna is disclosed, which is formed on an electrical circuit substrate having a ground plane and comprises a first antenna group, a second antenna group and a feeding microstrip line, wherein the first antenna group and the second antenna group have the length of a quarter wavelength on the substrate, two feeding points are formed by the intersections of the individual vertical radiating metallic line and the radiating metallic line on two sides, and the feeding microstrip line is connected between the two vertical radiating metallic lines thereby enhancing the radiation signals.

Abstract: The present disclosure relates to a thermal-acoustic-vibration three-parameter integrated in-situ sensor and system with a high-temperature-resistant and high-pressure-resistant structure, and specifically relates to the field of sensors. The provided thermal-acoustic-vibration three-parameter integrated in-situ sensor with a high-temperature-resistant and high-pressure-resistant structure comprises a heat detection device, a sound detection device and a vibration detection device; and the sound detection device and the vibration detection device are distributed on two sides of the heat detection device.

Abstract: A dipole antenna is disclosed, which is formed on an electrical circuit substrate having a ground plane and comprises a first antenna group, a second antenna group and a feeding microstrip line, wherein the first antenna group and the second antenna group have the length of a quarter wavelength on the substrate, two feeding points are formed by the intersections of the individual vertical radiating metallic line and the radiating metallic line on two sides, and the feeding microstrip line is connected between the two vertical radiating metallic lines thereby enhancing the radiation signals.

Abstract: A voice command identification method for an electronic device having a microphone matrix is provided. The method includes: obtaining a plurality of sound signals from the microphone matrix; executing a voice purify operation on the sound signals to obtain a purified sound signal and identifying a target voice signal from the purified sound signal; calculating a compound speech feature data corresponding to the target voice signal through a compound speech recognition model; comparing the compound speech feature data with a plurality of reference speech feature data in the speech feature database, so as to determine a target command mapped to the target voice signal; and executing the target command.

Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.

Abstract: A voice command identification method for an electronic device having a microphone matrix is provided. The method includes: obtaining a plurality of sound signals from the microphone matrix; executing a voice purify operation on the sound signals to obtain a purified sound signal and identifying a target voice signal from the purified sound signal; calculating a compound speech feature data corresponding to the target voice signal through a compound speech recognition model; comparing the compound speech feature data with a plurality of reference speech feature data in the speech feature database, so as to determine a target command mapped to the target voice signal; and executing the target command.

Abstract: A light source assembly comprises a base body and at least one light source module. The base body comprises a first and a second bearing base connected to each other. The first bearing base is configured for an image capture module to be disposed thereon. The second bearing base is located on the periphery of the first bearing base. The at least one light source module is slidably disposed on the second bearing base, and movable toward and away from the first bearing base. The at least one light source module forms an adjustable space. The adjustable space is configured for receiving the image capture module. The first bearing base has a first bearing surface configured for the image capture module to be disposed thereon. A sliding direction of the at least one light source module is not parallel to a normal direction of the first bearing surface.

Abstract: An apparatus for cutting a substrate is disclosed. The apparatus includes a main body containing a reactive solution and the substrate; and a catalytic cutting element disposed inside the main body and contacting one of at least two adjacent cutting peripheries of the substrate to conduct a chemical reaction to cut the substrate.

Abstract: An apparatus for cutting a substrate is disclosed. The apparatus includes a main body containing a reactive solution and the substrate; and a catalytic cutting element disposed inside the main body and contacting one of at least two adjacent cutting peripheries of the substrate to conduct a chemical reaction to cut the substrate.

Abstract: A method of processing a substrate is disclosed. The method includes the following steps: providing a substrate body having a surface; placing a die on the surface, wherein the die acts as a catalyst; immersing the substrate body and the die in a reaction solution; and processing the substrate body via a chemical reaction occurring on the surface through the reaction solution and the catalyst.

Abstract: A light source assembly comprises a base body and at least one light source module. The base body comprises a first and a second bearing base connected to each other. The first bearing base is configured for an image capture module to be disposed thereon. The second bearing base is located on the periphery of the first bearing base. The at least one light source module is slidably disposed on the second bearing base, and movable toward and away from the first bearing base. The at least one light source module forms an adjustable space. The adjustable space is configured for receiving the image capture module. The first bearing base has a first bearing surface configured for the image capture module to be disposed thereon. A sliding direction of the at least one light source module is not parallel to a normal direction of the first bearing surface.

Abstract: A method of processing a substrate is disclosed. The method includes the following steps: providing a substrate body having a surface; placing a die on the surface, wherein the die acts as a catalyst; immersing the substrate body and the die in a reaction solution; and processing the substrate body via a chemical reaction occurring on the surface through the reaction solution and the catalyst.

Abstract: A method of detecting one or more faults in a semiconductor device that includes generating a first test pattern set from a primary node list and a fault list. The primary node list includes one or more nodes and the fault list identifies one or more faults. The method also includes generating one or more secondary node lists from the primary node list and generating a second test pattern set from at least the first test pattern set and the secondary node list. Each node of the one or more nodes of the primary node list is associated with a corresponding secondary node list of the one or more secondary node lists.

Abstract: A monitoring apparatus includes a main body, a mounting plate, and a fixing plate. The mounting plate is connected to the main body and has a first bending rib structure protrusively formed thereon. The fixing plate is fixed to a mounting target and is disposed opposite to the mounting plate. The fixing plate has a first opening structure formed thereon corresponding to the first bending rib structure and a second bending rib structure laterally extending from the first opening structure. When the mounting plate is connected to the fixing plate to make the first bending rib structure pass through the first opening structure, the first bending rib structure rotates with rotation of the mounting plate relative to the fixing plate to be engaged with the second bending rib structure, so as to fix the mounting plate to the fixing plate.

Abstract: A wireless communication apparatus includes an electronic device and an NFC antenna structure having a sheet and an antenna disposed on a surrounding area of the sheet. The antenna has an outer connecting pad, an inner connecting pad, and a radiating body. The outer and inner connecting pads are respectively arranged adjacent to the outer and inner edges of the surrounding area. The radiating body has a continuously spiral shape, and two ends of the radiating body are respectively connected to the outer and inner connecting pads. The radiating body is extended from the outer connecting pad to spirally travel on the surrounding area and forms at least three loops. The outer and inner connecting pads of the antenna respectively and detachably abut against the two pins of the electronic device to achieve electrical connection between the electronic device and the antenna of the NFC antenna structure.

Abstract: An antenna structure includes an antenna, a first bonding film, and a second bonding film. The antenna is bendable and has a main segment, a first connecting segment connected to the main segment, and a second connecting segment connected to the main segment. The antenna has a first surface and an opposite second surface, and the first and the second connecting segments are respectively configured to connect a ground and a signal source. Each one of the first bonding film and the second bonding film has an adhesive surface and is bendable. The first and second surfaces of the main segment are respectively adhered on the adhesive surfaces of the first and second bonding films. The adhesive surface of the first bonding film is adhered on the adhesive surface of the second bonding film, and the main segment is encapsulated between the first and second bonding films.