Patents by Inventor YUAN-HENG ZHONG

YUAN-HENG ZHONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10549344
    Abstract: A liquid composition includes copper particles, an organic acid, and a solvent. The copper particle has a particle size of 0.5 ?m˜30 ?m which falls in a micron scale. The liquid composition performs reaction sintering by redox reactions taken place between the copper particles and an organic acid solution at a low temperature of 150° C. in order to produce a dense copper layer and improve the conventional micron-scale copper particles that requires a protective atmosphere for the high-temperature sintering before achieving the required densification. This liquid composition also prevents an excessive oxidation of the nano copper particles during the low-temperature sintering process and a failure of the dense sintering. Due to the agglomeration of nano copper particles, some areas have to be sintered first, so that the sintered products have a good uniformity of tissue and a low resistance below 0.04 ohm per square (?/?).
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: February 4, 2020
    Assignee: SHENMAO TECHNOLOGY INC.
    Inventors: Chang-Meng Wang, Hsiang-Chuan Chen, Ruei-Ying Sheng, Chen-Yi Chen, Albert T. Wu, Chih-Hao Chen, Yuan-Heng Zhong
  • Publication number: 20190054525
    Abstract: A liquid composition includes copper particles, an organic acid, and a solvent. The copper particle has a particle size of 0.5 ?m˜30 ?m which falls in a micron scale. The liquid composition performs reaction sintering by redox reactions taken place between the copper particles and an organic acid solution at a low temperature of 150° C. in order to produce a dense copper layer and improve the conventional micron-scale copper particles that requires a protective atmosphere for the high-temperature sintering before achieving the required densification. This liquid composition also prevents an excessive oxidation of the nano copper particles during the low-temperature sintering process and a failure of the dense sintering. Due to the agglomeration of nano copper particles, some areas have to be sintered first, so that the sintered products have a good uniformity of tissue and a low resistance below 0.04 ohm per square (?/?).
    Type: Application
    Filed: October 31, 2017
    Publication date: February 21, 2019
    Inventors: CHANG-MENG WANG, HSIANG-CHUAN CHEN, RUEI-YING SHENG, CHEN-YI CHEN, ALBERT T. WU, CHIH-HAO CHEN, YUAN-HENG ZHONG