Abstract: The present disclosure provides a real-time dynamic prediction system and method of a three-dimensional shape of a high-pressure jet grouting pile.

Abstract: A manufacturing method of a semiconductor structure includes the following steps. A first wafer is provided. The first wafer includes a first substrate and a first device layer. A second wafer is provided. The second wafer includes a second substrate and a second device layer. The second device layer is bonded to the first device layer. An edge trimming process is performed on the first wafer and the second wafer to expose a first upper surface of the first substrate and a second upper surface of the first substrate and to form a damaged region in the first substrate below the first upper surface and the second upper surface. The second upper surface is higher than the first upper surface. A first photoresist layer is formed. The first photoresist layer is located on the second wafer and the second upper surface and exposes the first upper surface and the damaged region. The damaged region is removed by using the first photoresist layer as a mask. The first photoresist layer is removed.

Abstract: A plating apparatus for electroplating a wafer includes a housing defining a plating chamber for housing a plating solution. A voltage source of the apparatus has a first terminal having a first polarity and a second terminal having a second polarity different than the first polarity. The first terminal is electrically coupled to the wafer. An anode is within the plating chamber, and the second terminal is electrically coupled to the anode. A membrane support is within the plating chamber and over the anode. The membrane support defines apertures, wherein in a first zone of the membrane support a first aperture-area to surface-area ratio is a first ratio, and in a second zone of the membrane support a second aperture-area to surface-area ratio is a second ratio, different than the first ratio.

Abstract: A display panel includes a substrate and display pixels. The display pixels are disposed on the substrate, and each of the display pixels includes pad sets, light-emitting devices, a first connecting wire, a second connecting wire, and first cutting regions. Each pad set has a first pad and a second pad. The light-emitting devices are electrically bonded to at least part of the pad sets. The first connecting wire is electrically connected to the first pads of a plurality of first pad sets of the pad sets. The second connecting wire is electrically connected to the second pads of the pad sets. The first cutting regions are disposed on one side of each of the first pad sets. Two first connecting portions of the first connecting wire and the second connecting wire connecting each of the first pad sets are located in one of the first cutting regions.

Abstract: A foldable electronic device includes a first housing and a second housing that are rotationally connected to each other by means of rotating shafts located on two sides, and an antenna. The first housing can switch between an unfolded state and a folded state relative to the second housing, and the antenna is disposed in a closed slot. The antenna includes a first antenna segment and a second antenna segment that are sequentially connected and disposed in a length direction of the antenna. One end of the first antenna segment is connected to a ground plate of the first housing. The first antenna segment extends from one end toward a direction in which an opening/closing region of the first housing and the second housing in the unfolded state is away from the first housing.

Abstract: A display panel includes a substrate and display pixels. The display pixels are disposed on the substrate, and each of the display pixels includes pad sets, light-emitting devices, a first connecting wire, a second connecting wire, and first cutting regions. Each pad set has a first pad and a second pad. The light-emitting devices are electrically bonded to at least part of the pad sets. The first connecting wire is electrically connected to the first pads of a plurality of first pad sets of the pad sets. The second connecting wire is electrically connected to the second pads of the pad sets. The first cutting regions are disposed on one side of each of the first pad sets. Two first connecting portions of the first connecting wire and the second connecting wire connecting each of the first pad sets are located in one of the first cutting regions.

Abstract: A display apparatus includes a light-transmitting substrate, a pad group, a mini-IC, a first wire, and a first light-emitting element. The pad group includes a first pad, a second pad, and a third pad. The mini-IC is bonded to the pad group. The first wire is electrically connected to the first pad. The first pad and the second pad have first sides and second sides opposite to each other. The third pad is located on the first sides of the first pad and the second pad. The first wire is structurally separated from the second pad and the third pad. A winding segment of the first wire is disposed between the second pad and the third pad and bypasses the second pad from the first sides of the first pad and the second pad so as to extend toward the second sides of the first pad and the second pad.

Abstract: A substrate assembly and a display device are provided. The substrate assembly includes a substrate, a first conductive line, and a second conductive line. The first conductive line is disposed on the substrate, wherein a voltage is applied to the first conductive line. The second conductive line is disposed on the substrate, wherein in a top view, at least a portion of the second conductive line extends along a first direction. The first conductive line and the second conductive line are at least partially overlapped in a normal direction of the substrate. A distance between the first conductive line and the second conductive line in the normal direction is greater than or equal to 3500 angstroms, and less than or equal to 4500 angstroms.

Abstract: A display device includes a flexible substrate, a bonding pad, a light-emitting diode, an encapsulant, and a support structure. The bonding pad and the light-emitting diode are located on the flexible substrate. The encapsulant covers the light-emitting diode. The support structure is laterally located between the light-emitting diode and the bonding pad. The support structure has an inclined surface, and a thickness of the support structure close to the light-emitting diode is greater than the thickness of the support structure close to the bonding pad.

Abstract: This invention discloses a synthetic gypsum and gypsum boards produced therefrom. Limestone (Calcium Carbonate), slaked lime (calcium hydroxide), water, and sulfuric acid are mixed, and alpha hemihydrate gypsum is optionally added as crystal seed to produce synthetic gypsum. The synthetic gypsum is then used to make gypsum boards. The gypsum board produced according to this invention contains at least 10% alpha hemihydrate gypsum.

Abstract: A three-dimensional (3D) memory device includes a 3D NAND memory array, an on-die static random-access memory (SRAM), and peripheral circuits formed on the same chip with the on-die SRAM. The peripheral circuits include a page buffer coupled to the on-die SRAM and a controller coupled to the on-die SRAM and the page buffer. The controller may be configured to load program data into the page buffer and cache the program data into the on-die SRAM as a backup copy of the program data. In response to a status of programming the program data from the page buffer into the 3D NAND memory array being failed, the controller may be further configured to transmit the backup copy of the program data in the on-die SRAM to the page buffer, and program the backup copy of the program data in the page buffer into the 3D NAND memory array.

Abstract: A substrate assembly and a display device are provided. The substrate assembly includes a substrate, a first conductive line, and a second conductive line. The first conductive line is disposed on the substrate, wherein a voltage is applied to the first conductive line. The second conductive line is disposed on the substrate, wherein in a top view, at least a portion of the second conductive line extends along a first direction. The first conductive line and the second conductive line are at least partially overlapped in a normal direction of the substrate. A distance between the first conductive line and the second conductive line in the normal direction is greater than or equal to 3500 angstroms, and less than or equal to 4500 angstroms.

Abstract: A display panel includes a substrate and display pixels. The display pixels are disposed on the substrate, and each of the display pixels includes pad sets, light-emitting devices, a first connecting wire, a second connecting wire, and first cutting regions. Each pad set has a first pad and a second pad. The light-emitting devices are electrically bonded to at least part of the pad sets. The first connecting wire is electrically connected to the first pads of a plurality of first pad sets of the pad sets. The second connecting wire is electrically connected to the second pads of the pad sets. The first cutting regions are disposed on one side of each of the first pad sets. Two first connecting portions of the first connecting wire and the second connecting wire connecting each of the first pad sets are located in one of the first cutting regions.

Abstract: Embodiments of a three-dimensional (3D) memory device and a method of operating the 3D memory device are provided. The 3D memory device includes an array of 3D NAND memory cells, an array of static random-access memory (SRAM) cells, and a peripheral circuit. The array of SRAM cells and the peripheral circuit arranged at one side are bonded with the array of 3D NAND memory cells at another side to form a chip. Data is received from a host through the peripheral circuit, buffered in the array of SRAM cells, and transmitted from the array of SRAM cells to the array of 3D NAND memory cells. The data is programmed into the array of 3D NAND memory cells.

Abstract: A display device having a non-display region is provided. The display device includes a first conductive line to which a voltage is applied and a second conductive line which is at least partially overlapped with the first conductive line. There is a distance between the first conductive line and the second conductive line in a normal direction of the display device is greater than or equal to 3500 angstroms, and less than or equal to 4500 angstroms.

Abstract: A display panel includes a substrate and display pixels. The display pixels are disposed on the substrate, and each of the display pixels includes pad sets, light-emitting devices, a first connecting wire, a second connecting wire, and first cutting regions. Each pad set has a first pad and a second pad. The light-emitting devices are electrically bonded to at least part of the pad sets. The first connecting wire is electrically connected to the first pads of a plurality of first pad sets of the pad sets. The second connecting wire is electrically connected to the second pads of the pad sets. The first cutting regions are disposed on one side of each of the first pad sets. Two first connecting portions of the first connecting wire and the second connecting wire connecting each of the first pad sets are located in one of the first cutting regions.

Abstract: The disclosure provides a mini type FAKRA connector, which includes a metal housing, a plastic housing, a pin, and multiple terminals. The plastic housing is assembled to the metal housing, and a portion structure of the metal housing and a portion structure of the plastic housing are overlapped to form a tunnel. The pin is inserted into the tunnel to fix the metal housing and the plastic housing together. The terminals penetrate the metal housing and the plastic housing.

Abstract: An example display assembly includes: a continuous display including: a first rigid segment attached to and substantially coplanar with an inner surface of a first assembly of the folding device; a second rigid segment attached to and substantially coplanar with an inner surface of a second assembly of the folding device; a primary flexible segment; a third rigid segment disposed between the second rigid segment and the primary flexible segment; and a fourth rigid segment disposed between the first rigid segment and the primary flexible segment; a primary supporting plate attached to the continuous display; a first supplemental supporting plate attached to the primary supporting plate adjacent to the third rigid segment; and a second supplemental supporting plate attached to the primary supporting plate adjacent to the fourth rigid segment.

Abstract: Embodiments of 3D memory devices with a static random-access memory (SRAM) and fabrication methods thereof are disclosed herein. In certain embodiments, the 3D memory device includes a first semiconductor structure and a second semiconductor structure. The first semiconductor structure includes an array of SRAM cells and a first bonding layer, and the second semiconductor structure includes an array of 3D NAND memory strings and a second bonding layer. The first semiconductor structure is attached with the second semiconductor structure through the first bonding layer and the second bonding layer. The array of 3D NAND memory strings and the array of SRAM cells are coupled through a plurality of bonding contacts in the first bonding layer and the second bonding layer and are arranged at opposite sides of the plurality of bonding contacts.

Abstract: The present invention provides methods, compositions, combinations, and kits for treating a subject with a viral infection (e.g., COVID-19) by administering or providing an estrogen receptor modulator and an anti-inflammatory agent or by administering or providing an anti-inflammatory agent (e.g., melatonin) to the subject.