Patents by Inventor Yuan-Hsiao Chao

Yuan-Hsiao Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacking structure of printed circuit board
    Patent number: 7952889
    Abstract: A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: May 31, 2011
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Yuan-Hsiao Chao
  • HOUSING FUNCTIONING AS AN ANTENNA AND METHOD FOR FABRICATING THE SAME
    Publication number: 20100039347
    Abstract: A housing, functioning as an antenna includes an antenna base including two protruding flanges. The housing is formed by injection molding a molten plastic material over and around the antenna base, whereby the antenna base is embedded in the housing, and the protruding flanges are exposed out of the housing. A method for fabricating the housing is also described.
    Type: Application
    Filed: June 30, 2009
    Publication date: February 18, 2010
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventors: Hsin-Yi Chen, Yuan-Hsiao Chao
  • STACKING STRUCTURE OF PRINTED CIRCUIT BOARD
    Publication number: 20090135576
    Abstract: A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.
    Type: Application
    Filed: June 5, 2008
    Publication date: May 28, 2009
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventor: YUAN-HSIAO CHAO