Patents by Inventor Yuan-Hsin Liu

Yuan-Hsin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084445
    Abstract: A leak check is performed on a semiconductor wafer processing tool that includes a process chamber and process gas lines, and a semiconductor wafer is processed using the semiconductor wafer processing tool if the leak check passes. Each gas line includes a mass flow controller (MFC) and normally closed valves including an upstream and downstream valves upstream and downstream of the MFC. Leak checking includes: leak checking up to the downstream valves of the gas lines with the upstream valves closed and the downstream valves of the gas lines closed; and leak checking up to the upstream valve of each the process gas line with the upstream valves of the of the process gas lines closed and with the downstream valve of the of the process gas line being leak checked open and the downstream valve of every other process gas line closed.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 14, 2024
    Inventors: Chih-Wei Chou, Yuan-Hsin Chi, Chih-Hao Yang, Hung-Chih Wang, Yu-Chi Liu, Sheng-Yuan Lin
  • Patent number: 8240882
    Abstract: A light emitting diode module includes: a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer, and a plurality of through holes; a metallic heat sink formed with a plurality of chip-support portions and disposed below the printed circuit board; a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of the chip-support portions and each of which is electrically connected to the upper circuit layer. A method for making the light emitting diode module is also disclosed.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: August 14, 2012
    Assignee: Bright LED Electronics Corp.
    Inventors: Tsung-Jen Liao, Chung-Kai Wang, Yuan-Hsin Liu, Yao-Tsung Hsu
  • Publication number: 20110157897
    Abstract: A light emitting diode module includes: a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer, and a plurality of through holes; a metallic heat sink formed with a plurality of chip-support portions and disposed below the printed circuit board; a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of the chip-support portions and each of which is electrically connected to the upper circuit layer. A method for making the light emitting diode module is also disclosed.
    Type: Application
    Filed: December 15, 2010
    Publication date: June 30, 2011
    Applicant: Bright LED Electronics Corp.
    Inventors: Tsung-Jen Liao, Chung-Kai Wang, Yuan-Hsin Liu, Yao-Tsung Hsu
  • Patent number: 5353984
    Abstract: A paper board having a desired pattern and a plurality of folding lines embossed thereon defining a polygonal bottom section, an inner peripheral wall section extending outwardly from each side of the bottom section and pairs of corner sections disposed between two adjacent inner peripheral wall sections permitting the formation of a container. Wall edge, outer wall and plate sections extending outwardly from each inner peripheral wall section may be folded outwardly and downwardly to the underside of the bottom section to form hollow walls of the container.
    Type: Grant
    Filed: October 13, 1993
    Date of Patent: October 11, 1994
    Inventors: Yuan-Hsin Liu, Richard C. H. Chang
  • Patent number: 5335845
    Abstract: A partitioned and foldable paper food container which is suitable for containing different foods in different compartments and can be folded into a flat rectangle for easy carry and storage. The food container is made of pure fiber paper meeting FDA regulation and is formed in such a manner that the paper is first cut into a predetermined pattern, then embossed with folding lines, then folded and finally heat sealed or adhered. The food container includes a main compartment and two subsidiary compartments integrally extending from two end edges of the main compartment, whereby after folded and sealed, the subsidiary compartments can be received in the main compartment to form a partitioned food container for containing different foods in different compartments and thereby prevents the taste of the foods from mixing with one another.
    Type: Grant
    Filed: August 18, 1993
    Date of Patent: August 9, 1994
    Inventor: Yuan-Hsin Liu
  • Patent number: 5332148
    Abstract: A paper container with multiple variable compartments which is formed from a paper board of adequate thickness cut into a predetermined pattern. The paper board is made of paper of pure fibers and additives, laminated to adequate thickness and coated with polyethylene to meet the FDA regulations. The paper pattern is formed with inner openings and embossed with a plurality of folding lines, whereby the paper pattern can be folded about the folding lines and heat-sealed by means of molds to form a container having multiple variable compartments of which the size, shape and number can be varied through changing the positions, numbers and shapes of the inner openings so as to more suitably contain various foods or articles and facilitate the package thereof.
    Type: Grant
    Filed: August 18, 1993
    Date of Patent: July 26, 1994
    Inventors: Yuan-Hsin Liu, Richard C. H. Chang
  • Patent number: 5323958
    Abstract: A paper container with multiple compartments which is formed from a paper board of adequate thickness cut into a predetermined pattern. The paper board is made of paper of pure fibers and additives, laminated to adequate thickness and coated with polyethylene to meet the FDA regulations. The paper pattern is formed with two inner transversely disposed openings and embossed with a plurality of folding lines to define multiple bottom sections, partitioning wall sections, side wall sections, corner connection sections, and top edge strip sections, whereby the paper pattern can be folded about the folding lines and heat-sealed by means of molds to form a container having multiple compartments, allowing the paper container to be more suitable for containing various foods or articles.
    Type: Grant
    Filed: August 18, 1993
    Date of Patent: June 28, 1994
    Inventors: Yuan-Hsin Liu, Richard C. H. Chang