Patents by Inventor Yuan Hsin Peng

Yuan Hsin Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR TREATING WASTEWATER
    Publication number: 20080190867
    Abstract: The present invention provides a system for treating wastewater produced during grinding and slicing in a semiconductor packaging process, comprising a collecting tank for collecting the wastewater produced during grinding and/or slicing in a semiconductor packaging process; a physical filtration device for separating the suspended materials from the wastewater by physical filtration, the physical filtration device being in fluid communication with the collecting tank; a receiving device for receiving the wastewater treated by the physical filtration device, and the receiving device being in fluid communication with the physical filtration device. The present invention further provides a method for treating wastewater produce during grinding and slicing in a semiconductor packaging process. The present invention simplifies the treatment of wastewater produced during grinding and slicing in a semiconductor packaging process, and lowers the cost.
    Type: Application
    Filed: August 3, 2007
    Publication date: August 14, 2008
    Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (Shanghai) CORPORATION
    Inventors: Sin Chai Lin, Yuan Hsin Peng, Jiang Liu, Jun Feng
  • Method for operating chemical mechanical polishing (“CMP”) tool for the manufacture of semiconductor devices
    Patent number: 6852633
    Abstract: A method for processing integrated circuit devices including a water recycling process. The method includes operating a chemical mechanical planarization process, which includes a discharge for process water. The process water is used to process one or more semiconductor wafers. The method also selectively discharges process water from the discharge. A step of transferring the process water from the chemical mechanical planarization process to a facility process is included. The method then uses the discharged water in the facility process.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: February 8, 2005
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Chien Hua Chen, Yuan Hsin Peng, Xiao Hua Li
  • Method for operating chemical mechanical polishing ("CMP") tool for the manufacture of semiconductor devices
    Publication number: 20040171266
    Abstract: A method for processing integrated circuit devices including a water recycling process. The method includes operating a chemical mechanical planarization process, which includes a discharge for process water. The process water is used to process one or more semiconductor wafers. The method also selectively discharges process water from the discharge. A step of transferring the process water from the chemical mechanical planarization process to a facility process is included. The method then uses the discharged water in the facility process.
    Type: Application
    Filed: March 8, 2004
    Publication date: September 2, 2004
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Chien Hua Chen, Yuan Hsin Peng, Xiao Hua Li