Abstract: A method includes forming a first metallic feature, forming a dielectric layer over the first metallic feature, etching the dielectric layer to form an opening, with a top surface of the first metallic feature being exposed through the opening, and performing a first treatment on the top surface of the first metallic feature. The first treatment is performed through the opening, and the first treatment is performed using a first process gas. After the first treatment, a second treatment is performed through the opening, and the second treatment is performed using a second process gas different from the first process gas. A second metallic feature is deposited in the opening.

Abstract: A partitioning method for partitioning a group of power-ground (PG) cells is disclosed. The method includes: placing at least one out-boundary PG cell on a substrate, wherein power strips of the at least one out-boundary PG cell are aligned with corresponding power rails on the substrate; and placing at least one in-boundary PG cell on the substrate, wherein power strips of the at least one in-boundary PG cell are aligned with corresponding power rails on the substrate.

Abstract: A logistic station comprises a plurality of objects having a first status and a second status and a detection device used for detecting the status of the objects. The detection device comprises a pallet having a plurality of first supporting portions and a first sensor. The objects are detachably disposed on the first supporting portions of the pallet. A first reference position and a first predetermined position are configured in the pallet with respect to the first supporting portions thereof. The first sensor transmits a first signal to the first predetermined position to detect whether objects having the second status.

Abstract: A displaced wafer detection system comprises a unified pod, a pod opener, a horizontal transmission robot, and a sensor. The unified pod encloses a plurality of wafers in a first position. The pod opener opens the unified pod. The horizontal transmission robot carries the wafers from the unified pod to a second position. When one of the wafers reaches the second position, the sensor detects if any wafer slips during wafer transmission from the unified pod.