Abstract: An illumination device and a manufacture method thereof are provided. The illumination device includes a base, an illumination chip, and a sealant. The illumination chip is disposed on the base while the sealant covers the illumination chip. The sealant has an outer surface which includes an inner circular convex and an outer circular convex surrounding the inner circular convex. The inner circular convex encloses a space with a narrow bottom and a wide opening. The illumination chip is disposed within a projective area of the inner circular convex. A part of the light emitted from the illumination chip is directly reflected from the inner circular convex to the outer circular convex and directly leaves the sealant from the outer circular convex.

Abstract: A light emitting diode contains a package structure and a light emitting diode die embedded in the package structure. The package structure has an elliptic bottom surface having a semi-major axes and a semi-minor axis and a semi-ellipsoidal surface connecting and surrounding the edge of the elliptic bottom surface, wherein the maximum height of the ellipsoidal surface from the elliptic bottom surface is between the semi-major axes and the semi-minor axis.

Abstract: A light emitting diode contains a package structure and a light emitting diode die embedded in the package structure. The package structure has an elliptic bottom surface having a semi-major axes and a semi-minor axis and a semi-ellipsoidal surface connecting and surrounding the edge of the elliptic bottom surface, wherein the maximum height of the ellipsoidal surface from the elliptic bottom surface is between the semi-major axes and the semi-minor axis.

Abstract: A light emitting diode contains a package structure and a light emitting diode die embedded in the package structure. The package structure has an elliptic bottom surface having a semi-major axes and a semi-minor axis and a semi-ellipsoidal surface connecting and surrounding the edge of the elliptic bottom surface, wherein the maximum height of the ellipsoidal surface from the elliptic bottom surface is between the semi-major axes and the semi-minor axis.

Abstract: A light emitting diode contains a light emitting diode chip and a light directing structure disposed thereon. The light directing structure has a pair of connected hemi-ellipsoids and an interface interposed therebetween. Each hemi-ellipsoid comprises a bottom surface in a shape of an incomplete ellipse and an ellipsoidal surface connected to the bottom surface and the interface, wherein the largest vertical distance from the ellipsoidal surface to the bottom surface is longer than a height of the interface. The bottom surface has a major axis and a minor axis intersected to define a center, wherein the interface is connected to the minor axis.

Abstract: An illumination device and a manufacture method thereof are provided. The illumination device includes a base, an illumination chip, and a sealant. The illumination chip is disposed on the base while the sealant covers the illumination chip. The sealant has an outer surface which includes an inner circular convex and an outer circular convex surrounding the inner circular convex. The inner circular convex encloses a space with a narrow bottom and a wide opening. The illumination chip is disposed within a projective area of the inner circular convex. A part of the light emitted from the illumination chip is directly reflected from the inner circular convex to the outer circular convex and directly leaves the sealant from the outer circular convex.

Abstract: A light emitting diode contains a light emitting diode chip and a light directing structure disposed thereon. The light directing structure has a pair of connected hemi-ellipsoids and an interface interposed therebetween. Each hemi-ellipsoid comprises a bottom surface in a shape of an incomplete ellipse and an ellipsoidal surface connected to the bottom surface and the interface, wherein the largest vertical distance from the ellipsoidal surface to the bottom surface is longer than a height of the interface. The bottom surface has a major axis and a minor axis intersected to define a center, wherein the interface is connected to the minor axis.

Abstract: A light emitting diode contains a package structure and a light emitting diode die embedded in the package structure. The package structure has an elliptic bottom surface having a semi-major axes and a semi-minor axis and a semi-ellipsoidal surface connecting and surrounding the edge of the elliptic bottom surface, wherein the maximum height of the ellipsoidal surface from the elliptic bottom surface is between the semi-major axes and the semi-minor axis.