Patents by Inventor Yuan-Kai Liang

Yuan-Kai Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering structure and process of making the same
    Patent number: 9421644
    Abstract: The invention discloses a soldering structure and process of making the same. The soldering structure comprises: a solder, a Sn—Co—Fe intermetallic compound having a thickness less than 10 ?m and a diffusion barrier layer. The process of making the soldering structure is to react the solder containing Sn with an alloy consisting of 85˜95 wt % of Co and 5˜15 wt % of Fe at the temperature between 250 and 300° C.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: August 23, 2016
    Assignee: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Chih-Chi Chen, Yuan-Kai Liang
  • Soldering Structure and Process of Making the same
    Publication number: 20160175989
    Abstract: The invention discloses a soldering structure and process of making the same. The soldering structure comprises: a solder, a Sn—Co—Fe intermetallic compound having a thickness less than 10 ?m and a diffusion barrier layer. The process of making the soldering structure is to react the solder containing Sn with an alloy consisting of 85˜95 wt % of Co and 5˜15 wt % of Fe at the temperature between 250 and 300° C.
    Type: Application
    Filed: January 28, 2015
    Publication date: June 23, 2016
    Inventors: Chih-Chi Chen, Yuan-Kai Liang