Abstract: A polishing system for polishing a workpiece includes a sensor group detecting pressure information of the workpiece and generating a pressure sequence; a processor coupled to the sensor group and configured to: receive the pressure sequence; generate indication information including a predetermined track of a polishing head to polish the workpiece; based on the pressure sequence and the indication information, generate a deviation sequence of the pressure sequence; and based on the deviation sequence, generate an adjustment instruction, to adjust a position of the polishing head. A polishing method, an assistant polishing device, an assistant polishing system, and an assistant polishing method are also disclosed.

Abstract: A calibration system, a calibration method, and a calibration device configured to determine base information of a polish head to polish a workpiece through the polish head are provided. The base information comprises a first position. The calibration system includes the polish head, a controller, and a sensor group. The controller is coupled to the polish head and controls the polish head to move along a first direction. The sensor group detects a force that at least one of the polish head and the workpiece senses to generate a first pressure value. The controller determines whether the first pressure value is greater than a predetermined value. According to that the first pressure value is greater than the predetermined value, the first position is determined.