Patents by Inventor Yuan-Li Chuang

Yuan-Li Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130100703
    Abstract: The present invention discloses a thermoforming method and a plate assembly thereof. The thermoforming method applicable for manufacturing a plate assembly having a first plate and a second plate comprises the steps of disposing the second plate on a lamination surface of the first plate; putting the first plate and the second plate into a first mold and a second mold respectively; heating and pressing the first mold and the second mold to deform any one of the lamination surfaces of the first plate and the second plate in order to laminate the first plate and the second plate; and opening the first mold and the second mold to remove the plate assembly. The first plate can be a light guide plate, and the second plate can be a reflector.
    Type: Application
    Filed: March 1, 2012
    Publication date: April 25, 2013
    Inventors: Hsueh-Tsu CHANG, Yuan-Li CHUANG
  • Patent number: 8083514
    Abstract: In a uniform-pressure shaping apparatus and system, the system comprises a uniform-pressure shaping apparatus, a vacuum unit and a fluid circulation unit, and the apparatus comprises a first cavity and a second cavity, each including a sealed pressure chamber, a heat conduction film and a template. An object to be imprinted is put on a pattern-imprinting surface of the template. When the first and second cavities get close to each other, the vacuum unit vacuums the space between the pattern-imprinting surfaces of the two templates. Meanwhile, the fluid circulation unit drives a hot fluid to pass through the two sealed pressure chambers. With the iso-pressure characteristic of the hot fluid, the object to be imprinted is heated and pressed uniformly until a desired shape is formed, and then a cold fluid is driven to pass through the two sealed pressure chambers to cool the object to be imprinted.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: December 27, 2011
    Assignee: Chenming Mold Ind. Corp.
    Inventors: Yuan-Li Chuang, Ming-Tze Kao
  • Publication number: 20110287124
    Abstract: In a uniform-pressure shaping apparatus and system, the system comprises a uniform-pressure shaping apparatus, a vacuum unit and a fluid circulation unit, and the apparatus comprises a first cavity and a second cavity, each including a sealed pressure chamber, a heat conduction film and a template. An object to be imprinted is put on a pattern-imprinting surface of the template. When the first and second cavities get close to each other, the vacuum unit vacuums the space between the pattern-imprinting surfaces of the two templates. Meanwhile, the fluid circulation unit drives a hot fluid to pass through the two sealed pressure chambers. With the iso-pressure characteristic of the hot fluid, the object to be imprinted is heated and pressed uniformly until a desired shape is formed, and then a cold fluid is driven to pass through the two sealed pressure chambers to cool the object to be imprinted.
    Type: Application
    Filed: September 24, 2010
    Publication date: November 24, 2011
    Applicant: CHENMING MOLD IND. CORP.
    Inventors: YUAN- LI CHUANG, MING-TZE KAO
  • Publication number: 20110277963
    Abstract: A thermal module and a method of manufacturing the same are disclosed. The thermal module includes a first heat dissipation member, a second heat dissipation member, a binding layer, and a metal layer. The first heat dissipation member can be a heat dissipating substrate, and the second heat dissipation member can be a heat pipe or a heat dissipating substrate. The metal layer is coated on the first heat dissipation member through a metal spray process. The binding layer can be a solder paste. By providing the spray-coated metal layer, the thermal module can have upgraded heat dissipation efficiency, increased pull strength, and reduced manufacturing cost.
    Type: Application
    Filed: May 12, 2010
    Publication date: November 17, 2011
    Applicant: CHENMING MOLD IND. CORP.
    Inventors: YAU-HUNG CHIOU, SHU-HUI FAN, YUAN-LI CHUANG
  • Publication number: 20110061848
    Abstract: The present invention discloses a heat dissipation module and a manufacturing method thereof. The heat dissipation module comprises a metal base, a porous metal layer and a metal plate member. The porous metal layer is disposed on one side of the metal base and includes a plurality of micropores. Parts of the plurality of micropores contain a metal medium. The metal plate member is disposed on one side of the porous metal layer. Heat is rapidly conducted from the metal base through the metal plate member to the environment by means of the porous metal layer and the metal medium.
    Type: Application
    Filed: September 2, 2010
    Publication date: March 17, 2011
    Applicant: CHENMING MOLD IND. CORP.
    Inventors: Yau-Hung Chiou, Shu-Hui Fan, Yuan-Li Chuang