Patents by Inventor Yuan-Li Ding

Yuan-Li Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test pattern structure
    Patent number: 7989804
    Abstract: A test pattern structure including a first conductive layer and a second conductive layer is provided. The second conductive layer is directly disposed on the first conductive layer and connected to the first conductive layer through a plurality of connection interfaces. The test pattern structure of the present invention can detect the interconnection failure quickly and correctly without SEM identification.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: August 2, 2011
    Assignee: United Microelectronics Corp.
    Inventors: Da-Jiang Yang, Chih-Ping Lee, Rui-Huang Cheng, Xing-Hua Zhang, Xu Ma, Xiao-Fei Han, Hong Ma, Hong Liao, Yuan-Li Ding
  • TEST PATTERN STRUCTURE
    Publication number: 20100227131
    Abstract: A test pattern structure including a first conductive layer and a second conductive layer is provided. The second conductive layer is directly disposed on the first conductive layer and connected to the first conductive layer through a plurality of connection interfaces. The test pattern structure of the present invention can detect the interconnection failure quickly and correctly without SEM identification.
    Type: Application
    Filed: March 4, 2009
    Publication date: September 9, 2010
    Applicant: United Microelectronics Corp.
    Inventors: Da-Jiang Yang, Chih-Ping Lee, Rui-Huang Cheng, Xing-Hua Zhang, Xu Ma, Xiao-Fei Han, Hong Ma, Hong Liao, Yuan-Li Ding