Patents by Inventor YUAN-LI LIN

YUAN-LI LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio frequency match strap assembly
    Patent number: 11955317
    Abstract: A radio frequency (RF) match assembly for a chemical vapor deposition processing chamber. The assembly includes a top electrically insulating column and a bottom electrically insulating column. The assembly further includes a one-piece RF match strap that has a head, a main body and a body extension. The main body of the one-piece RF match strap is configured to extend through the top electrically insulating column and the bottom electrically insulating column. A flexible chamber lid strap connects the processing chamber to the top of the one piece RF match strap.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Sze Chen, Yu Li Wang, Yin-Tun Chou, Yuan-Hsin Chi, Sheng-Yuan Lin
  • Probe card
    Patent number: 9759745
    Abstract: In some embodiments, a probe card includes a PCB, a substrate, a pair of probes, a capacitive device and a first part. The PCB includes a pair of conductive paths through a first surface and a second surface of the PCB. The substrate includes a pair of conductive paths through a first surface and a second surface of the substrate. The conductive paths of the substrate and the corresponding conductive paths of the PCB are coupled between the first surface of the substrate and the second surface of the PCB. The probes and the corresponding conductive paths of the substrate are coupled beyond the second surface of the substrate. The capacitive device is coupled between a first conductive path and a second conductive path through the PCB, the substrate and the probes. The first part is configured beyond the second surface of the PCB, and holds the capacitive device.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: September 12, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yung-Hsin Kuo, Yuan-Li Lin, Po-Yi Huang
  • PROBE CARD
    Publication number: 20150309074
    Abstract: In some embodiments, a probe card includes a PCB, a substrate, a pair of probes, a capacitive device and a first part. The PCB includes a pair of conductive paths through a first surface and a second surface of the PCB. The substrate includes a pair of conductive paths through a first surface and a second surface of the substrate. The conductive paths of the substrate and the corresponding conductive paths of the PCB are coupled between the first surface of the substrate and the second surface of the PCB. The probes and the corresponding conductive paths of the substrate are coupled beyond the second surface of the substrate. The capacitive device is coupled between a first conductive path and a second conductive path through the PCB, the substrate and the probes. The first part is configured beyond the second surface of the PCB, and holds the capacitive device.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 29, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: YUNG-HSIN KUO, YUAN-LI LIN, PO-YI HUANG