Patents by Inventor Yuan Lin

Yuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210225922
    Abstract: A circuit that includes: a photodiode configured to absorb photons and to generate photo-carriers from the absorbed photons; a first MOSFET transistor that includes: a first channel terminal coupled to a first terminal of the photodiode and configured to collect a portion of the photo-carriers generated by the photodiode; a second channel terminal; and a gate terminal coupled to a first control voltage source; a first readout circuit configured to output a first readout voltage; a second readout circuit configured to output a second readout voltage; and a current-steering circuit configured to steer the photo-carriers generated by the photodiode to one or both of the first readout circuit and the second readout circuit.
    Type: Application
    Filed: March 22, 2021
    Publication date: July 22, 2021
    Inventors: Yun-Chung Na, Szu-Lin Cheng, Shu-Lu Chen, Han-Din Liu, Hui-Wen Chen, Che-Fu Liang, Yuan-Fu Lyu, Chien-Lung Chen, Chung-Chih Lin, Kuan-Chen Chu
  • Publication number: 20210224526
    Abstract: The present application discloses a method and an apparatus for detecting wearing of a safety helmet, a device and a storage medium. The method for detecting wearing of a safety helmet includes: acquiring a first image collected by a camera device, where the first image includes at least one human body image; determining the at least one human body image and at least one head image in the first image; determining a human body image corresponding to each head image in the at least one human body image according to an area where the at least one human body image is located and an area where the at least one head image is located; and processing the human body image corresponding to the at least one head image according to a type of the at least one head image.
    Type: Application
    Filed: February 1, 2021
    Publication date: July 22, 2021
    Inventors: Mingyuan MAO, Yuan FENG, Ying XIN, Pengcheng YUAN, Bin ZHANG, Shufei LIN, Xiaodi WANG, Shumin HAN, Yingbo XU, Jingwei LIU, Shilei WEN, Hongwu Zhang, Errui DING
  • Publication number: 20210225649
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first layer over a substrate. The first layer has a trench. The method includes forming a first spacer and a second spacer respectively over opposite inner walls of the trench. The first spacer and the second spacer are spaced apart from each other. The method includes removing a first portion of the first spacer to form a first gap in the first spacer, wherein a first part and a second part of the first spacer are spaced apart by the first gap, and the first gap communicates with the trench. The method includes forming a filling layer into the trench and the first gap to cover the first spacer and the second spacer. The filling layer, the first spacer, and the second spacer together form a strip structure. The method includes removing the first layer.
    Type: Application
    Filed: April 1, 2021
    Publication date: July 22, 2021
    Inventors: Chih-Ming LAI, Shih-Ming CHANG, Wei-Liang LIN, Chin-Yuan TSENG, Ru-Gun LIU
  • Publication number: 20210223489
    Abstract: Photonic devices and methods of manufacture are provided. In embodiments a fill material and/or a secondary waveguide are utilized in order to protect other internal structures such as grating couplers from the rigors of subsequent processing steps. Through the use of these structures at the appropriate times during the manufacturing process, damage and debris that would otherwise interfere with the manufacturing process of the device or operation of the device can be avoided.
    Type: Application
    Filed: July 16, 2020
    Publication date: July 22, 2021
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Chih-Hsuan Tai, Hua-Kuei Lin, Tsung-Yuan Yu, Min-Hsiang Hsu
  • Publication number: 20210225708
    Abstract: A method for a through-silicon-via (TSV) connector includes: providing a semiconductor wafer with a silicon substrate, wherein the semiconductor wafer has a frontside and a backside opposite to the frontside thereof; forming multiple holes in the silicon substrate of the semiconductor wafer; forming a first insulating layer at a sidewall and bottom of each of the holes; forming a metal layer over the semiconductor wafer and in each of the holes; polishing the metal layer outside each of the holes to expose a frontside surface of the metal layer in each of the holes; forming multiple metal bumps or pads each on the frontside surface of the metal layer in at least one of the holes; grinding a backside of the silicon substrate of the semiconductor wafer to expose a backside surface of the metal layer in each of the holes, wherein the backside surface of the metal layer in each of the holes and a backside surface of the silicon substrate of the semiconductor wafer are coplanar; and cutting the semiconductor wafer
    Type: Application
    Filed: January 21, 2021
    Publication date: July 22, 2021
    Inventors: Jin-Yuan Lee, Mou-Shiung Lin
  • Publication number: 20210225697
    Abstract: A semiconductor device structure and a method for forming a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a first conductive structure over the semiconductor substrate. The semiconductor device structure also includes a first dielectric layer surrounding the first conductive structure and a second dielectric layer over the first dielectric layer. The semiconductor device structure further includes a second conductive structure partially surrounded by the second dielectric layer and partially surrounded by the first conductive structure. In addition, the semiconductor device structure includes an interfacial layer separating the first conductive structure from the second conductive structure.
    Type: Application
    Filed: January 16, 2020
    Publication date: July 22, 2021
    Inventors: Chun-Yuan CHEN, Chia-Hao CHANG, Cheng-Chi CHUANG, Yu-Ming LIN, Chih-Hao WANG
  • Publication number: 20210225926
    Abstract: A fingerprint sensing module including an image sensor, a microlens array and a light-shielding layer is provided. The image sensor has multiple pixels. Each of the pixels has multiple light-sensing regions physically separated. Each of the light-sensing regions is adapted to receive an image beam coming from a fingerprint of user. The microlens array is disposed above the image sensor. The microlens array includes multiple microlens. A focus region of each of the microlens covers a portion of the light-sensing regions. The light-shielding layer is disposed between the image sensor and the microlens array. The light-shielding layer has multiple openings, and the positions of the openings are corresponded to the positions of the pixels.
    Type: Application
    Filed: August 27, 2020
    Publication date: July 22, 2021
    Applicant: Egis Technology Inc.
    Inventors: Tzu-Yang Peng, Ming-Yuan Cheng, Chung-Yi Wang, Yu-Hsuan Lin
  • Patent number: 11065724
    Abstract: Laser weldable compositions are provided which in various examples include a tricyclodecane dimethanol-modified copolymer, a terephthalate-type polyester and an inorganic filler. Compared with compositions without the tricyclodecane dimethanol-modified copolymer, the compositions of the invention have improved, uniform laser transmittance, thereby welded products including the compositions have improved bonding strength and require stronger tensile strength to be torn apart.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: July 20, 2021
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: Te-Shun Lin, Cheng-Hsiang Hung, Hsin-Hsien Tsai, Po-Yuan Cheng, Yung-Sheng Lin, Kuen-Yuan Hwang, June-Yen Chou
  • Patent number: 11067483
    Abstract: A hybrid cooler/dryer that conditions a sample gas includes a heat exchanger, a condensate-removal device, and a membrane dryer. In some embodiments, the hybrid cooler/dryer also includes passive cooling, as embodied by an air amplifier and heat sink, or a length of tubing that exposes the sample gas to ambient temperature. The hybrid cooler/dryer requires no electrical power.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: July 20, 2021
    Assignee: Perma Pure LLC
    Inventors: Craig Sunada, Cui Jun, Yuan Lin, Robert Laemmle
  • Patent number: 11065823
    Abstract: A welding process of an inflatable product is provided that includes using isolating members between first and second portions of weldable tensioning members to resist the first and second portions of the weldable tensioning structures being welded together during welding of the first portions to a first sheet of weldable material and welding of the second portions to a second sheet of weldable material.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: July 20, 2021
    Assignee: Intex Marketing Ltd.
    Inventors: Hua Hsiang Lin, Yaw Yuan Hsu
  • Publication number: 20210216266
    Abstract: A tiled display system is disclosed, which includes: a plurality of circuit boards; a plurality of display devices electrically connected to each other via the plurality of circuit boards; and a controller driving the plurality of display devices to enable each display device to display a sub-frame, wherein the plurality of display devices include: a first display device and a second display device disposed adjacent to the first display device; wherein one of the plurality of circuit boards is at least partially overlapped with the first display device and the second display device and is electrically connected with the first display device and the second display device; and wherein the one of the plurality of circuit boards crosses a boundary between the first display device and the second display device.
    Type: Application
    Filed: March 31, 2021
    Publication date: July 15, 2021
    Inventors: Jui-Jen YUEH, Kuan-Feng LEE, Yuan-Lin WU
  • Publication number: 20210217744
    Abstract: A semiconductor device includes a first transistor having a first fin, wherein a base of the first fin is surrounded by a first dielectric material, the first fin having a first fin height measured from the top surface of the first dielectric material to a top surface of the first fin; and a second transistor having a second fin, wherein a base of the second fin is surrounded by a second dielectric material, the second fin having a second fin height measured from a top surface of the second dielectric material to a top surface of the second fin, wherein the first fin height is different from the second fin height.
    Type: Application
    Filed: March 29, 2021
    Publication date: July 15, 2021
    Inventors: Wei-Cheng LIN, Hui-Ting YANG, Jiann-Tyng TZENG, Lipen YUAN, Wei-An LAI
  • Patent number: 11062773
    Abstract: A near-memory computation system includes a plurality of computation nodes. Each computation node receives a plurality of input signals and outputs a computing result signal. The computation node includes a plurality of non-volatile memory cells and a processing element. Each non-volatile memory cell stores a weighting value during a program operation and outputs a weighting signal according to the weighting value during a read operation. The processing element is coupled to the plurality of non-volatile memory cells. The processing element receives the plurality of input signals and generates the computing result signal by performing computations with the plurality of input signals and a plurality of weighting signals generated by the plurality of non-volatile memory cells. The plurality of non-volatile memory cells and the processing element are manufactured by different or the same processes.
    Type: Grant
    Filed: March 22, 2020
    Date of Patent: July 13, 2021
    Assignee: eMemory Technology Inc.
    Inventors: Chun-Fu Lin, Ching-Yuan Lin, Tsung-Mu Lai, Chih-Hsin Chen
  • Patent number: 11062908
    Abstract: A semiconductor device includes: a fin structure disposed on a substrate; a gate feature that traverses the fin structure to overlay a central portion of the fin structure; a pair of source/drain features, along the fin structure, that are disposed at respective sides of the gate feature; and a plurality of contact structures that are formed of tungsten, wherein a gate electrode of the gate feature and the pair of source/drain features are each directly coupled to a respective one of the plurality of contact structures.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: July 13, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hong-Ying Lin, Cheng-Yi Wu, Alan Tu, Chung-Liang Cheng, Li-Hsuan Chu, Ethan Hsiao, Hui-Lin Sung, Sz-Yuan Hung, Sheng-Yung Lo, C. W. Chiu, Chih-Wei Hsieh, Chin-Szu Lee
  • Publication number: 20210207893
    Abstract: A vapor-chamber that includes a porous microstructure sheet with varying surface energy across different regions to optimize utilization of a working fluid. Modulating the surface energy of the porous microstructure sheet can minimize the amount of the working fluid that becomes trapped in the condenser region(s) and maximize an aggregate thin-film evaporation area of the working fluid in the evaporator region(s). The condenser region of the vapor-chamber is treated so that the internal surfaces have low surface energy. For example, the treatment may cause the condenser region to become hydrophobic to minimize the amount of fluid that becomes trapped in the condenser. The evaporator region is treated so that the internal surfaces have high surface energy. For example, the treatment may cause the evaporator region to become hydrophilic to induce the formation of large numbers of robust (e.g., dry-out resistant) thin-film evaporation sites.
    Type: Application
    Filed: February 1, 2021
    Publication date: July 8, 2021
    Inventors: Shahar Ben-Menahem, Tzu-Yuan Lin, Michael Nikkhoo
  • Publication number: 20210201742
    Abstract: An electronic device is provided. The electronic device includes: a display panel and a host. The host is electrically connected to the display panel, and includes a processing unit and a graphics processing unit. The processing unit executes a driver program of the graphics processing unit and a specific program to render a display image of the specific program, wherein the display image includes a user interface. The processing unit obtains position information about a static area of the user interface. In response to the processing unit obtaining the position information about the static area of the user interface, the graphics processing unit performs a burn-in-prevention process on the static area via the driver program to generate an output image, and transmits the output image to the display panel for displaying.
    Type: Application
    Filed: September 29, 2020
    Publication date: July 1, 2021
    Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
    Inventors: Hou-Yuan LIN, Ching-Hung CHAO, Po-Chang TSENG, Hung-Yen CHEN
  • Patent number: 11047680
    Abstract: A multi-node data synchronous acquisition system and a method for real-time monitoring of underwater surface deformation. The system includes at least four sensor arrays, where each of the sensor array consists of a plurality of ribbon-like rigid substrates connected by movable joints. On each section of rigid substrate, three sensor units are respectively connected to a slave station data acquisition unit through cables. The slave station data acquisition unit is connected with a central controller through a cable. The central controller includes a compressive cabin outside and an embedded controller and a power supply inside. Each slave station data acquisition unit acquires data from an MEMS attitude sensor and then transmits it to the embedded controller. The present invention may realize synchronous acquisition of underwater or even underwater multi-node data, implement three-dimensional surface reconstruction, and may be used for improving the ocean observation capability.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: June 29, 2021
    Assignee: Zhejiang University
    Inventors: Jiawang Chen, Huangchao Zhu, Chunying Xu, Chen Cao, Zhou Yu, Jun Han, Yuan Lin
  • Publication number: 20210192986
    Abstract: A flexible display device is disclosed. The flexible display device includes a first layer and a second layer overlapping with the first layer. The first layer includes a plurality of first patterns, and the plurality of first patterns has a first pitch. The second layer includes a plurality of second patterns, and the plurality of second patterns has a second pitch. A ratio of the first pitch to the second pitch is greater than or equal to 2 and less than or equal to 200.
    Type: Application
    Filed: December 3, 2020
    Publication date: June 24, 2021
    Inventor: Yuan-Lin Wu
  • Publication number: 20210193630
    Abstract: A method of manufacturing an electronic device, comprising: providing a carrier substrate with a plurality of light-emitting units disposed thereon, the plurality of light-emitting units being spaced with a first pitch (P1) in a first direction and a second pitch (P2) in a second direction that is perpendicular to the first direction; providing a driving substrate; and transferring at least a portion of the plurality of light-emitting units to the driving substrate to form a transferred portion of the plurality of light-emitting units on the driving substrate, the transferred portion being spaced with a third pitch (P3) in a third direction and a fourth pitch (P4) in a fourth direction that is perpendicular to the third direction; wherein the first pitch (P1), the second pitch (P2), the third pitch (P3), and the fourth pitch (P4) are satisfied following relations: P3=mP1; and P4=nP2, m and n are positive integers.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 24, 2021
    Inventors: Jia-Yuan CHEN, Tsung-Han TSAI, Kuan-Feng LEE, Yuan-Lin WU
  • Publication number: 20210188626
    Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed to correspond to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a packaging layer, and at least a portion of the packaging layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the packaging layer define a chamber.
    Type: Application
    Filed: December 23, 2019
    Publication date: June 24, 2021
    Inventors: Heng-chung CHANG, Jhih-Jie HUANG, Chih-Ya TSAI, Jing-Yuan LIN