Abstract: An electric heating material processing device includes a material transporting module, a material feeding controller, a material discharging controller, a gas vent, and an electric heating thermal desorption device. The material transporting module has a material inlet and a material outlet. The material feeding controller is connected to the material inlet, and is configured to control a feeding quantity and a feeding speed of the materials. The material discharging controller is connected to the material outlet, and is configured to control a discharging quantity and a discharging speed of the materials. The gas vent is disposed on an end of the material transporting module. The electric heating thermal desorption device is disposed on an outer surface of the material transporting module, and is configured to perform a thermal desorption process on the materials. The electric heating thermal desorption device includes an electric heating acceptor and plural electric heaters.

Abstract: The present invention reveals an alignment platform for aligning electronic component precisely to the operation position during testing or hot pressing processes. The alignment platform makes a rotor to rotate by a driving apparatus. The rotor has an eccentric axle to where a connecting member is disposed. The connecting member is moved by the eccentric axle, driving an active plate to move. The eccentric axle, the driving apparatus, the connecting member, and the active plate are configured to move under control in a micro or nano meter scale. Thus, precisely alignment of electronic component can be achieved. Floating mechanism of electronic component transmission apparatus or electronic component handler may be dismissed for lowering cost and prolonging lifetime.

Abstract: A virtual computer verification platform is provided with a verifying and debugging environment so as to develop a new microprocessor chip, a new system software, a new firmware and a new peripheral chip. The virtual computer verification platform includes a simulation system and a set of on-line debugging auxiliary tools, wherein the microprocessor chip can be designed in a Behavior model, a RTL model and a Gate model. The message communication for integrating the whole simulation system is implemented through a message passing mechanism supported by UNIX IPC (Inter-Process Communication) and PLI (Programming Language Interface) supported by Verilog.