Patents by Inventor Yuan-Lung Wu

Yuan-Lung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRELESS TRANSMISSION MODULE
    Publication number: 20240072571
    Abstract: A wireless transmission module for transmitting energy or signals includes a first magnetically conductive element, a first coil assembly and a first adhesive element. The first coil assembly and the first magnetically conductive element are arranged along a main axis. The first adhesive element is configured to be adhered to the first coil assembly and the first magnetic conductive element. The first adhesive element is disposed between the first coil assembly and the first magnetically conductive element.
    Type: Application
    Filed: December 16, 2022
    Publication date: February 29, 2024
    Inventors: Feng-Lung CHIEN, Mao-Chun CHEN, Kun-Ying LEE, Yuan HAN, Tsang-Feng WU
  • Package structure of capacitive coupling isolator
    Patent number: 10541195
    Abstract: A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: January 21, 2020
    Assignee: LITE-ON SINGAPORE PTE. LTD.
    Inventors: You-Fa Wang, Wei-Wen Lai, Pu-Han Lin, Yuan-Lung Wu
  • PACKAGE STRUCTURE OF CAPACITIVE COUPLING ISOLATOR
    Publication number: 20190237394
    Abstract: A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.
    Type: Application
    Filed: October 19, 2018
    Publication date: August 1, 2019
    Inventors: YOU-FA WANG, WEI-WEN LAI, PU-HAN LIN, YUAN-LUNG WU