Abstract: An electronic device assembly includes a PCB (20), a socket (26) mounted on the PCB, a CPU (22) connected with the socket, a thermal module (30) in thermal contact with the CPU, and a back plate (10) attached to an underside of the PCB opposite the CPU. The back plate includes a pair of recessed portions (14), and a protruding portion (12) between the recessed portions. The protruding portion is configured to abut against the PCB and thereby prevent deformation of the PCB. A plurality of bolts (50) extends through the recessed portions of the back plate, the PCB and the thermal module, and respectively threadedly engages with a plurality of nuts (40). The electronic device assembly is thereby fixed together.

Abstract: Superconductivity is inhibited in selected portions of a high temperature superconductor ("HTS") material by patterning the selected portions with a resist. The patterned material is ion-bombarded to implant impurity ions in non-resist-bearing portions of the material. After low temperature annealing, the non-resist-bearing portions of the material lose their superconducting characteristics, but such characteristics are preserved in the material's resist-bearing portions. The material's crystalline structure is preserved, so additional layers can be epitaxially grown atop the inhibited material. Superconductivity is inhibited at a selected depth in a HTS material by subjecting the material to impurity ion bombardment at an energy level controlled to implant ions in the material at the selected depth. After low temperature annealing, the material loses its superconducting characteristics at the selected depth, but such characteristics are preserved at other depths (i.e.